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1. 发明申请

WO2021262497A1 SILICONE RUBBER COMPOSITIONS 审中-公开
公开(公告)号：WO2021262497A1
公开(公告)日：2021-12-30
申请号：PCT/US2021/037550
申请日：2021-06-16
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION
发明人： BEYER, Patrick , ROSENZWEIG, Michael , BACKER, Michael , BENEDETTI, Cesare , JELETIC, Matthew
IPC分类号： C08G77/12 , C08G77/14 , C08G77/20 , C08G77/50 , C08G77/00 , C08L83/04 , C08L83/14 , C09D183/04 , C09D183/14 , C09J183/04 , C09J183/14 , C08G77/80
摘要： A curable silicone rubber composition of the type referred to in industry as "self-adhesive" or as having "selective adhesion" (hereafter referred to as "curable self-adhesive silicone rubber compositions"). The curable self-adhesive silicone rubber compositions comprise: (A) one or more organopolysiloxanes containing at least 2 alkenyl groups and/or alkynyl groups per molecule and having a viscosity in a range of 1000mPa.s to 200,000mPa.s at 25°C; (B) an organopolysiloxane containing at least 2 or 3 silicon-bonded hydrogen atoms per molecule; (C) at least one hydrosilylation catalyst; (D) at least one reinforcing and optionally one or more non-reinforcing fillers; (E) an adhesion promoter; and (F) an oligomer which has been found to surprisingly provide heat-humidity stabilization.

2. 发明申请

WO2015098118A1 ROOM-TEMPERATURE-CURABLE SILICONE RUBBER COMPOSITION, THE USE THEREOF, AND METHOD FOR REPAIRING ELECTRONIC DEVICE 审中-公开
标题翻译：室温可固化硅橡胶组合物及其用途及其修复电子设备的方法
公开(公告)号：WO2015098118A1
公开(公告)日：2015-07-02
申请号：PCT/JP2014/006473
申请日：2014-12-25
申请人： DOW CORNING TORAY CO., LTD.
发明人： KODAMA, Harumi , ONISHI, Masayuki
IPC分类号： C08L83/14 , C08K3/00 , C08K5/5419 , C08L83/04 , C08L83/06 , C09J183/14 , C09K3/10
CPC分类号： C09J183/14 , C08G77/50 , C08K3/36 , C08K5/5419 , C08K5/5435 , C08K5/57 , C08L83/00 , C08L83/04 , C08L83/14 , C09K3/1018 , Y02P20/582
摘要： To provide a room-temperature-curable silicone rubber which exhibits good adhesion to a substrate contacted during curing and can be efficiently peeled. The problem is solved by a room-temperature-curable silicone rubber composition comprising (A) an organopolysiloxane having in each molecule at least two specified alkoxysilyl-containing groups on silicon atoms in the molecular chain, (B) a diorganodialkoxysilane or partially hydrolyzed condensate thereof, and (C) a condensation-reaction catalyst.
摘要翻译：提供一种室温可固化的硅橡胶，其对固化期间接触的基材表现出良好的粘附性并且可以有效地剥离。该问题通过室温可固化的硅橡胶组合物来解决，该组合物包含（A）分子链中每个分子中至少两个含硅烷氧基的特定烷氧基甲硅烷基的有机聚硅氧烷，（B）二有机二烷氧基硅烷或其部分水解缩合物，（C）缩合反应催化剂。

3. 发明申请

WO2014124364A1 STABLE THERMAL RADICAL CURABLE SILICONE ADHESIVE COMPOSITIONS 审中-公开
标题翻译：稳定的热可固化硅胶粘合剂组合物
公开(公告)号：WO2014124364A1
公开(公告)日：2014-08-14
申请号：PCT/US2014/015571
申请日：2014-02-10
申请人： DOW CORNING CORPORATION
发明人： LARSON, Kent , STEINBRECHER, Kristen , TONGE, James , ZARISFI, Afrooz
IPC分类号： C09J183/06 , C09J183/14 , C08L83/06 , C08L83/14
CPC分类号： C09J183/06 , B05D3/0272 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08K3/22 , C08K2003/2265 , C08L83/06 , C08L83/14 , C09J133/14 , C09J183/14
摘要： A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane- functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.
摘要翻译：提供了稳定的可热固化的硅氧烷组合物，其包含（I）具有一个或多个选自丙烯酸酯基和甲基丙烯酸酯基团的基团可固化基团的聚簇官能聚有机聚硅氧烷; （II）反应性树脂和聚合物; （III）自由基引发剂; （IV）水分固化引发剂; 和（V）交联剂。反应性树脂和聚合物包括（a）有机聚硅氧烷聚合物和（b）烷氧基官能的有机聚硅氧烷树脂。烷氧基官能的有机聚硅氧烷树脂包括在（iv）氢化硅烷化催化剂的存在下，（i）烯基官能的硅氧烷树脂，（ii）烷氧基硅烷官能的有机硅氧烷和（iii）端封体的反应的反应产物。稳定的可热固化的硅氧烷组合物可用于电子应用。

4. 发明申请

WO2008088523A1 DUAL CURING POLYMERS AND METHODS FOR THEIR PREPARATION AND USE 审中-公开
标题翻译：双固化聚合物及其制备和使用方法
公开(公告)号：WO2008088523A1
公开(公告)日：2008-07-24
申请号：PCT/US2007/025215
申请日：2007-12-10
申请人： DOW CORNING CORPORATION , ALVAREZ, Khristopher, Edward , SHEPHARD, Nick, Evan , TONGE, James
发明人： ALVAREZ, Khristopher, Edward , SHEPHARD, Nick, Evan , TONGE, James
IPC分类号： C08G77/14 , C08G77/18 , C08G77/50 , C08L83/06 , C08L83/14 , C08L101/10 , C09D183/06 , C09D183/14 , C09D201/10 , C09J183/06 , C09J183/14 , C09J201/10
CPC分类号： C08G77/14 , C08G77/50 , C08J3/243 , C08J2383/06 , C08J2383/14 , C08L83/06 , C08L83/14 , C09D183/14 , C08L2666/28
摘要： A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R 2 2Si0 2/2 )b, (R 2 Si0 3/2 )c, (Si0 4/2 )d, (R 1 )f, and (R 2 3SiO 1/2 )g, where each R 1 is independently an oxygen atom or a divalent hydrocarbon group; each R 1 is independently divalent hydrocarbon group; each R 2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
摘要翻译：聚合物通过辐射和湿气固化机制固化。聚合物通过氢化硅烷化制备。该聚合物可用于粘合剂组合物。该聚合物包括式（I），（R 2）2 SiO 2/2/2）b，（R 2 SiO 2 / 2）c，（SiO 4/2/2）d，（R 1）2和（R 2）3 SiO 2 > 1/2 g，其中每个R 1独立地是氧原子或二价烃基; 每个R 1独立地是二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

5. 发明申请

WO2022051204A1 ORGANOPOLYSILOXANE CLUSTER POLYMER FOR RAPID AIR CURE 审中-公开
公开(公告)号：WO2022051204A1
公开(公告)日：2022-03-10
申请号：PCT/US2021/048163
申请日：2021-08-30
申请人： DOW SILICONES CORPORATION , DOW GLOBAL TECHNOLOGIES LLC
发明人： THOMAS, Ryan , SHEPHARD, Nick , LU, Gang , SUNDERLAND, Julia
IPC分类号： C08G77/18 , C08G77/20 , C08G77/50 , C09J183/04 , C09J183/14
摘要： A composition contains an organopolysiloxane having the following average chemical structure: X3SiO-SiR2-R'-(R2SiO)x-R2Si-[Rb-(R2SiO)y-R2Si-Rb'-(R2SiO)z-R2Si]m-R'-R2SiO-SiX3; where X is -OSiR2-R'-R2SiO-R2Si-R"-A; R is an alkyl group having from 2 to 6 carbons and aryl groups; R', R", Rb and Rb' are divalent hydrocarbon groups comprising a chain of 2 to 6 methylene units; A is acrylate, methacrylate or trialkoxysilyl; provided that, on average, 60 to 90 mole-percent of the A groups are acrylate and methacrylate; Subscript m has an average value in a range of zero to 10; Subscripts x, y and z each has an average value in a range of zero to 1200; and provided that the average values of m, x, y and z are such that the sum of the average values for x, y and z is in a range of 300-1200 and the molar ratio of methylene units to siloxane units is less than 0.15.

6. 发明申请

WO2022051203A1 ORGANOPOLYSILOXANE CLUSTER POLYMER FOR RAPID AIR UV CURE 审中-公开
公开(公告)号：WO2022051203A1
公开(公告)日：2022-03-10
申请号：PCT/US2021/048160
申请日：2021-08-30
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION
发明人： WALKER, James A. , LIU, Junying , HANLEY, Patrick S. , THOMAS, Ryan
IPC分类号： C08G77/18 , C08G77/20 , C08G77/50 , C09J183/04 , C09J183/14
摘要： A composition contains a cluster organopolysiloxane having structure (I) where X = (aa) and R is independently in each occurrence selected from a group consisting of aryl groups and alkyl groups having from 2 to 6 carbons; R' and R" are independently in each occurrence selected from divalent hydrocarbon groups containing from 2 to 6 carbon atoms; n is a value in a range of 50 to less than 200; and A is independently in each occurrence selected from a group consisting of acrylate, methacrylate and trialkoxysilyl groups; provided that, on average, 50 to 95 mole-percent of the A groups are selected from acrylate and methacrylate groups and 5 to 50 mole-percent of the A groups are selected from trialkoxysilyl groups.

7. 发明申请

WO2019043490A1 HYPERBRANCHED POLYDIORGANOSILOXANE POLYOXAMIDE POLYMERS 审中-公开
公开(公告)号：WO2019043490A1
公开(公告)日：2019-03-07
申请号：PCT/IB2018/056092
申请日：2018-08-13
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： HARTMANN-THOMPSON, Claire , SHERMAN, Audrey A.
IPC分类号： C08G77/54 , C09J183/14
摘要： Hyperbranched polydiorganosiloxane polyoxamide polymers are formed from reaction mixtures containing AX g and BZ m compounds where either A or B is a siloxane-based group, and each X is either an oxalylamino-functional group or an amino-functional group, and each Z is either an amino-functional group or an oxylamino-functional group, such that upon reaction X and Z form an oxamide bond.

8. 发明申请

WO2015196345A1 1K UV AND THERMAL CURE HIGH TEMPERATURE DEBONDABLE ADHESIVE 审中-公开
标题翻译： 1K紫外线和热固化高温不粘胶
公开(公告)号：WO2015196345A1
公开(公告)日：2015-12-30
申请号：PCT/CN2014/080578
申请日：2014-06-24
申请人： HENKEL (CHINA) COMPANY LIMITED , HENKEL CORPORATION , HENKEL AG& CO. KGAA
发明人： HYNES, Stephen , SUN, Chunyu , OUYANG, Jiangbo , WOODS, John Gregory , ISSARI, Bahram , KONG, Shengqian , LIU, Yayun , ZHANG, Wenhua
IPC分类号： C09J183/07 , C09J183/14 , C08G77/50
CPC分类号： C09J183/14 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/52 , C08K3/36 , C08K5/0025 , C08K5/07 , C08K5/56 , C08L83/00 , C09J5/06 , C09J183/04 , C09J2205/302 , C09J2205/31 , C09J2483/00 , H01L21/6835 , H01L27/1259
摘要： One-component UV and thermal curable temporary adhesives for use in high temperature applications are provided. Said adhesives comprise (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on l,3,5,7-tetravinyl-l,3,5,7- tetramethylcyclotetrasiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also assemblies including such an adhesive and methods of using said adhesive are encompassed.
摘要翻译：提供了用于高温应用的单组分UV和热固性临时粘合剂。所述粘合剂包括（i）1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷上的乙烯基与硅烷或硅氧烷上的末端Si-H氢之间的反应的部分氢化硅烷化反应产物具有末端Si-H氢，和（ii）光和/或热自由基固化引发剂。还包括包括这种粘合剂的组件和使用所述粘合剂的方法。

9. 发明申请

WO2014160067A1 THERMALLY CURABLE SILICONE COMPOSITIONS AS TEMPORARY BONDING ADHESIVES 审中-公开
标题翻译：热固性硅酮组合物作为临时粘结粘合剂
公开(公告)号：WO2014160067A1
公开(公告)日：2014-10-02
申请号：PCT/US2014/025751
申请日：2014-03-13
申请人： DOW CORNING CORPORATION
发明人： FU, Peng-Fei , WANG, Sheng
IPC分类号： C09J183/14 , C08K3/36 , C08K5/5425
CPC分类号： C09J183/14 , C08G77/12 , C08G77/20 , C08K5/5425 , H01L31/1892 , Y02E10/50
摘要： Provided in various embodiments are silicone-based storage stable temporary bonding adhesive compositions. The storage stable TBA compositions are formed by combining (e.g., mixing or blending) an alkenyl functional siloxane polymer, an alkenyl functional filler with a particle size below one micrometer, an SiH-containing crosslinker, a hydrosilylation catalyst, and a cure inhibitor where the molar ratio of the cure inhibitor and the hydrosilylation catalyst is greater than 40/1 and less than 500/1. The resulting TBA compositions may be one-part compositions. The TBA compositions can be used in varied applications including 3D chip integration, packaging applications, semiconductor devices, radio-frequency identification tags, chip cards, high-density memory devices, and microelectronic devices.
摘要翻译：在各种实施方案中提供了基于硅氧烷的储存稳定的临时粘合粘合剂组合物。储存稳定的TBA组合物通过将烯基官能硅氧烷聚合物，粒度低于1微米的烯基官能填料，含SiH的交联剂，氢化硅烷化催化剂和固化抑制剂组合（例如，混合或共混）形成，其中固化抑制剂和氢化硅烷化催化剂的摩尔比大于40/1且小于500/1。得到的TBA组合物可以是一部分组合物。 TBA组合物可用于各种应用，包括3D芯片集成，封装应用，半导体器件，射频识别标签，芯片卡，高密度存储器件和微电子器件。

10. 发明申请

WO2008076184A1 DUAL CURING POLYMERS AND METHODS FOR THEIR PREPARATION AND USE 审中-公开
标题翻译：双固化聚合物及其制备和使用方法
公开(公告)号：WO2008076184A1
公开(公告)日：2008-06-26
申请号：PCT/US2007/023467
申请日：2007-11-07
申请人： DOW CORNING CORPORATION , ALVAREZ, Khristopher, Edward , SHEPHARD, Nick, Evan , TONGE, James
发明人： ALVAREZ, Khristopher, Edward , SHEPHARD, Nick, Evan , TONGE, James
IPC分类号： C08G77/50 , C08J3/24 , C08L83/14 , C09D183/14 , C09J183/14 , C08L83/07 , C08L101/10 , C09D201/10 , C09J201/10
CPC分类号： C08G77/50 , C08J3/243 , C08J2383/04 , C08K5/54 , C09D183/14 , Y10T428/31663
摘要： A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R 2 2 Si0 2/2 ) b, (R 2 Si0 3/2 ) c , (SiO 4/2 ) d, (R 1 ') f, and (R 2 3 Si0 1/2 ) g, where each R 1 is independently an oxygen atom or a divalent hydrocarbon group; each R 1' is independently divalent hydrocarbon group; each R 2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
摘要翻译：聚合物通过辐射或湿气固化机制或两者固化。聚合物通过氢化硅烷化制备。聚合物包括下式的单元：（R 2）2

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