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    • 2. 发明申请
    • CURABLE EPOXY RESIN COMPOSITIONS
    • 可固化环氧树脂组合物
    • WO00024801A1
    • 2000-05-04
    • PCT/EP1999/007615
    • 1999-10-11
    • C08G59/14C08G59/26C08G59/68C09D163/00
    • C08G59/26Y10S525/939
    • Curable epoxy resin compositions, which are obtainable by heating a composition containing at least one epoxy compound, which contains on average at least one, preferably more than one, 1,2-epoxy group and optionally also one or several hydroxyl groups in the molecule, in the presence of at least one Lewis acid as catalyst, wherein the Lewis acid is a salt of trifluoromethanesulfonic acid or of perchloric acid, the counterion of which carries a 2- to 6-fold positive charge, until the epoxy value, measured in equivalent epoxy/kg (Eq/kg) of the starting material, has been reduced by 1 to 60 percent, preferably by 5 to 50 percent; a process for their preparation, and their use for the preparation of fully cured moulded compositions or coatings. Claimed are, inter alia, also high molecular weight epoxy compounds of formula (IIa), wherein A is a divalent aliphatic or aromatic radical, B is the radical of the dioxan, which is substituted either in 2- and 5-position or in 2- and 6-position and which may be in the cis-or trans-form, and n is an integer from 1 to 10, preferably from 1 to 5.
    • 可固化环氧树脂组合物,其可通过加热含有至少一种环氧化合物的组合物获得,所述组合物在分子中平均包含至少一个,优选多于一个1,2-环氧基团和任选的一个或几个羟基基团, 在存在至少一种路易斯酸作为催化剂的情况下,其中路易斯酸是三氟甲磺酸或高氯酸的盐,其抗衡离子具有2-至6倍的正电荷,直到环氧值以等同方式测量 环氧树脂/ kg(Eq / kg)的原料,减少1〜60%,优选5〜50%。 它们的制备方法及其用于制备完全固化的模塑组合物或涂层的用途。 所要求的还包括式(IIa)的高分子量环氧化合物,其中A是二价脂族或芳族基团,B是二烷基的基团,其在2-位和5-位取代或在2 - 和6-位,并且其可以是顺式或反式,n是1至10,优选1至5的整数。
    • 4. 发明申请
    • ENCAPSULATED STRUCTURAL ADHESIVE
    • 密封结构粘合剂
    • WO2007018736A2
    • 2007-02-15
    • PCT/US2006023036
    • 2006-06-13
    • APPLETON PAPER INC
    • YAN NIANXISANDS PEGGY DOROTHYGUINEBRETIERE SANDRA JACQUELIN
    • C08K9/00
    • C08K9/10C09J4/00C09J11/00C09J133/04Y10S525/922Y10S525/939Y10T428/28Y10T428/2985
    • The invention teaches an encapsulated curable adhesive composition especially adapted for use as a structural adhesive. The adhesive composition enables formation of a thin layer reactive composition of microcapsules and a two-part curative. The adhesive composition comprises a first population of microcapsules encasing a monomer and a first-part curative comprising an initiator. The adhesive composition further comprises a second-part curative. The second-part curative comprises an activator and a catalyst. At least the activator of the second-part curative is preferably encapsulated in a second population of microcapsules. The catalyst and the second population of microcapsules can be dispersed in a binder material, along with the first population of microcapsules. The first population of microcapsules contain encapsulated within the core a monomer having a Tg 35°C or less and the first-part curative. The first population microcapsules contain encapsulated within the core a monomer having a Tg 35°C or less along with the first-part curative. The encapsulated monomer and first-part curative constitute a blend which is a free flowing liquid having a viscosity of less than 500 Cp (milliPascal-second), and more preferably less than 10 Cp (milliPascal-second). The first population of microcapsules with first-part curative, and a second-part curative and second population of microcapsules are dispersed in a binder material. Reactive contact of the monomer and first-part curative with the second-part curative is affected by exuding the respective capsule contents into reactive contact through breakage of the microcapsules such as an interference fit of the substrate or substrates to which the composition is applied.
    • 本发明教导了一种特别适合用作结构粘合剂的包封的可固化粘合剂组合物。 粘合剂组合物能够形成微胶囊的薄层反应性组合物和两部分固化剂。 粘合剂组合物包含包含单体的第一组微胶囊和包含引发剂的第一部分固化剂。 粘合剂组合物还包含第二部分固化剂。 第二部分治疗剂包括活化剂和催化剂。 至少第二部分固化剂的活化剂优选包封在第二组微胶囊中。 催化剂和第二批微胶囊可以与第一批微胶囊一起分散在粘合剂材料中。 第一批微胶囊包含核心内的Tg为35℃或更低的单体和第一部分固化剂。 第一种群微胶囊包含核心内具有Tg为35℃以下的单体以及第一部分固化剂。 包封的单体和第一部分固化剂构成混合物,其是具有小于500cp(毫帕·秒)的粘度的自由流动的液体,更优选小于10CPp(毫帕·秒)。 具有第一部分固化剂的第一批微胶囊和第二部分固化剂和第二批微胶囊分散在粘合剂材料中。 单体和第一部分固化剂与第二部分固化剂的反应性接触受到通过微胶囊的破坏而渗出相应的胶囊内容物变成反应性接触的影响,例如施加组合物的基底或基底的过盈配合。
    • 5. 发明申请
    • MODULAR SYSTEM FOR COATING PLASTICS
    • 用于涂料的模块化系统
    • WO2003046092A1
    • 2003-06-05
    • PCT/US2002/037823
    • 2002-11-25
    • E. I. DU PONT DE NEMOURS AND COMPANYHELLMANN, UdoWEIGEL, Maria
    • HELLMANN, UdoWEIGEL, Maria
    • C09D7/14
    • C09D5/002C09D7/80Y10S525/939
    • The invention relates to a modular system for the production of coating compositions for coating plastics comprising the following component modules: A) at least one base module containing at least one binder, extenders and/or pigments, optionally together with conventional coating additives, water and/or organic solvents, B) at least one adhesion module containing at least one adhesion-promoting component optionally together with binders, conventional coating additives, extenders, organic solvents and/or water, C) at least one elasticity module containing at least one elasticising component optionally together with conventional coating additives, extenders, organic solvents and/or water and D) at least one binder module containing at least one binder optionally together with additives, organic solvents and/or water.
    • 本发明涉及一种用于生产涂料塑料的涂料组合物的模块化系统,其包括以下组分模块:A)至少一种含有至少一种粘合剂,增量剂和/或颜料,任选地与常规涂料添加剂一起的水,和 /或有机溶剂,B)至少一个包含至少一种粘合促进组分的粘合剂组合物,任选地与粘合剂,常规涂料添加剂,增量剂,有机溶剂和/或水一起,C)至少一种弹性模块,其包含至少一种弹性 组分任选地与传统的涂料添加剂,增量剂,有机溶剂和/或水一起,和D)至少一种含有至少一种粘合剂的粘合剂组合物,任选地与添加剂,有机溶剂和/或水一起。