专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2017145206A1 支持装置及び支持方法审中-公开
标题翻译：配套装置和配套方法
公开(公告)号：WO2017145206A1
公开(公告)日：2017-08-31
申请号：PCT/JP2016/004849
申请日：2016-11-09
申请人： NECプラットフォームズ株式会社
发明人：寺尾　智明
IPC分类号： H05K5/02
CPC分类号： H05K7/16 , F16M11/048 , F16M11/08 , F16M13/02 , H05K5/0204 , H05K7/1461
摘要：保守工事などを実行する際に要する壁面占有面積を省スペース化する支持装置を提供する。支持装置として、電子機器の筐体に取り付けて該筐体を支持する一対の支持脚と、電子機器を設置する取付面に取り付けて該電子機器を設置する場所に固定する一対の固定脚と、一対の支持脚と一対の固定脚との端部相互を、一対の固定脚に対して一対の支持脚を直立方向に転回可能に且つ一対の固定脚に対して一対の支持脚を水平方向にスライド可能に連結する一対のスライドヒンジ機構と、を含めて構成する。
摘要翻译：
提供一种支持设备，可以节省执行维护工作等所需的墙壁占用的空间。附接到电子装置的壳体以支撑壳体的一对支撑腿，附接到其上安装电子装置并固定到安装电子装置的位置的安装表面上的一对固定腿，一对支撑腿和一对固定腿的端部相对于一对固定腿相互移位，使得一对支撑腿可沿竖直方向转动，并且一对支撑腿水平并且一对滑动铰链机构可滑动地彼此连接。

2. 发明申请

WO2013078971A1 GUIDE BRACKET AND ELECTRONIC DEVICE ADOPTING THE GUIDE BRACKET 审中-公开
标题翻译：指南支架和电子装置采用导向支架
公开(公告)号：WO2013078971A1
公开(公告)日：2013-06-06
申请号：PCT/CN2012/085236
申请日：2012-11-26
申请人： HANGZHOU H3C TECHNOLOGIES CO., LTD.
发明人： WANG, Xiaojun , TANG, Yongfeng
IPC分类号： H05K7/18
CPC分类号： H05K7/1461 , H05K7/1489
摘要： According to an example, a guide bracket and an electronic device adopting the guide bracket are provided. A free end of a resilient sheet installed in a wall of the guide bracket is to be held by a snap-fit part set in a chassis beyond the external surface of the wall where the resilient sheet is located to implement position limiting of the guide bracket in the forward-backward direction. The free end of the resilient sheet is to retreat inwards with the bending of the resilient sheet towards the interior of the wall where the resilient sheet is located to avoid the snap-fit part.
摘要翻译：根据一个示例，提供了一种引导支架和采用引导支架的电子装置。安装在引导支架的壁上的弹性片的自由端将被设置在底盘中的卡扣配合部分保持在超过弹性片所在壁的外表面以实现引导支架的位置限制在前后方向。弹性片的自由端向内退回，弹性片朝向弹性片所在的壁的内部弯曲以避免卡扣配合部分。

3. 发明申请

WO2009089428A1 BLANKING PANEL FOR STANDARDIZED EQUIPMENT RACK AND CABINET ENCLOSURE 审中-公开
标题翻译：用于标准化设备的隔离板和橱柜外壳
公开(公告)号：WO2009089428A1
公开(公告)日：2009-07-16
申请号：PCT/US2009/030573
申请日：2009-01-09
申请人： UPSITE TECHNOLOGIES, INC.
发明人： SEMPLINER, Arthur, T. , MERCHANT, Berkeley, T.
IPC分类号： A47F7/00
CPC分类号： H05K7/1461 , H05K7/1488
摘要： A snap-mount blanking panel for an equipment rack or cabinet enclosure has ergonomic grips spaced laterally inward to permit comfortable and reliable mounting and removal of the blanking panel regardless of lateral clearance. Resiliently flexible sealing skirt members create a positive seal with adjacent electronic devices or blanking panels. Stacking structure enables stable stacking of multiple units outside a container. An off-set platform allows for mounting ambient atmospheric indicators or signage, or may be used as a writing surface. A cable pass- through is also provided.
摘要翻译：用于设备机架或机柜外壳的卡扣安装式消隐面板具有横向向内间隔的符合人体工程学的夹具，以便无论侧向间隙如何，均可舒适可靠地安装和拆卸消隐面板。弹性柔软的密封裙部件与相邻的电子设备或消隐面板产生正密封。堆叠结构使得容器之外的多个单元能够稳定地堆叠。偏置平台允许安装环境大气指示器或标牌，或者可以用作书写面。还提供电缆穿透。

4. 发明申请

WO2006122248A2 ELECTRONICS MODULE ASSEMBLY 审中-公开
标题翻译：电子模块总成
公开(公告)号：WO2006122248A2
公开(公告)日：2006-11-16
申请号：PCT/US2006/018249
申请日：2006-05-10
申请人： SCIENTIFIC-ATLANTA, INC. , SANDGREN, Daniel, J. , CLARK, Joseph, R.
发明人： SANDGREN, Daniel, J. , CLARK, Joseph, R.
CPC分类号： H05K7/1461 , G02B6/4453
摘要： An electronics module assembly for detachably retaining a pair of electronic sub-modules in a single slot of a chassis. A host module of the electronics module assembly is configured to be detachably received and retained in a slot of the chassis. The host module has a height corresponding with a height of the slot of the chassis. A pair of sub-modules are configured to be detachably received and retained in the host module. The combined height of the sub-modules is no greater than the height dimension of the slot of the chassis. Therefore, where there was once only room for one electronics module in a single slot of the chassis, a pair of sub-modules with the host module may now be utilized in the single slot of the chassis.
摘要翻译：一种用于将一对电子子模块可拆卸地保持在底盘的单个槽中的电子模块组件。电子模块组件的主机模块被配置为可拆卸地接收并保持在底盘的槽中。主机模块具有与机箱的槽的高度相对应的高度。一对子模块被配置为可拆卸地接收并保留在主机模块中。子模块的组合高度不大于底盘槽的高度尺寸。因此，在机箱的单个插槽中一次只有一个电子模块的空间的情况下，具有主机模块的一对子模块现在可以用在机箱的单个槽中。

5. 发明申请

WO2005107353A2 REINFORCEMENT FOR SUBSTRATE ASSEMBLIES 审中-公开
标题翻译：基座装配加固
公开(公告)号：WO2005107353A2
公开(公告)日：2005-11-10
申请号：PCT/US2005/012589
申请日：2005-04-13
申请人： MOTOROLA, INC. , NESTOR, Marc, N. , GOODMAN, Mitch, E. , GUTIERREZ, Greg, M.
发明人： NESTOR, Marc, N. , GOODMAN, Mitch, E. , GUTIERREZ, Greg, M.
IPC分类号： H05K9/00
CPC分类号： H05K9/0026 , H05K1/0271 , H05K7/1461 , H05K9/0032
摘要： The present invention is directed to a reinforced substrate apparatus (100) and method (600) for reinforcing a substrate (110). The substrate apparatus includes the substrate, a first shield (115, 215) coupled to the substrate and at least a second shield (120, 220) coupled to the substrate. A strengthening member (125, 225, 275) can be coupled to the first shield and the second shield without necessarily contacting the substrate. The method can include the step of attaching (620) the first shield and the second shield to the substrate where at least one among the first shield and the second shield shields circuitry on the substrate. The method also includes the step of coupling (640) a strengthening member to the first shield and the second shield.
摘要翻译：本发明涉及用于加强基底（110）的增强基底装置（100）和方法（600）。衬底装置包括衬底，耦合到衬底的第一屏蔽（115,215）和耦合到衬底的至少第二屏蔽（120,220）。加强构件（125,225,275）可以联接到第一屏蔽件和第二屏蔽件而不必接触基板。该方法可以包括将第一屏蔽和第二屏蔽附着（620）到基板的步骤，其中第一屏蔽和第二屏蔽屏蔽电路中的至少一个在基板上。该方法还包括将加强构件联接（640）到第一屏蔽件和第二屏蔽件的步骤。

6. 发明申请

WO02054847A2 INTERCONNECTING MODULE FOR THE BASE OF ELECTRONIC EQUIPMENT CASING 审中-公开
标题翻译：电子设备外壳的互连模块
公开(公告)号：WO02054847A2
公开(公告)日：2002-07-11
申请号：PCT/FR2001/003987
申请日：2001-12-14
IPC分类号： H01R12/52 , H01R12/62 , H01R13/64 , H05K1/02 , H05K1/14 , H05K7/14
CPC分类号： H05K1/147 , H01R12/52 , H01R12/62 , H01R13/64 , H05K1/0218 , H05K1/144 , H05K3/0061 , H05K7/1452 , H05K7/1461 , H05K2201/10189
摘要： The interconnecting module for the base of an electronic equipment housing offsets, in relation to the faces of the printed circuit boards (4, 5) that support the equipment components housed in the casing, a field of connection points to the exterior of the casing embodied by the rear ends of the pins of a semi-connector (3) fixed to the back of the casing, while still retaining the compactness of the casing despite the large number of connection points with the exterior of the casing (several hundred). Said module takes the form of three panels with a central panel (7), fixed to the rear end of the pins of the semi-connector (3) which is mounted to the back of the casing and two lateral panels (8, 9), folded up and attached to each other, connected to the longitudinal edges of the central panel (7) by pieces of flexible printed circuit (10, 11) and supporting the field of connection points offset from the faces of the boards (4, 5) of the electronic equipment. Electronic connections link the two fields of connection points via the joining parts (10, 11).
摘要翻译：这种用于电子设备箱底部的互连模块确保了在支撑容纳在壳体中的设备的部件的印刷电路板（4,5）的表面处的偏移，附接到所述壳体的所述后半部3，同时用外部壳体中的环境保持在壳体的紧凑性，尽管非常大的数量的连接点的连接器的销与由后方物化外壳外部的环境连接端（几百）。它与固定到连接器的一半（3）的销的后端的中央面板7a三联的形式安装在壳体背面和两个侧面板（8,9）折叠并放平抵靠其它通过柔性印刷电路部件（10,11）附接到中央面板（7）的纵向边缘并且在电子设备的卡（4,5）的面处支持远程连接点场，通过连接件（10,11）连接连接点的两个区域的电连接。

7. 发明申请

WO00041448A1 ELECTRONIC MODULE CONTAINING COOLING ELEMENTS FOR ELECTRONIC COMPONENTS 审中-公开
标题翻译：包含电子元件冷却元件的电子模块
公开(公告)号：WO00041448A1
公开(公告)日：2000-07-13
申请号：PCT/CH1998/000563
申请日：1998-12-30
IPC分类号： H05K7/14 , H05K7/20
CPC分类号： H05K7/20727 , H05K7/1461 , H05K7/20545
摘要： A data acquisition module (1) comprising a coupling board (15) with several electronic components (3, 8) that are mounted on at least one surface of said board. A protective cover (16) mounted opposite said surface covers the electronic components. In order to cool analog-to-digital converters of said module, a piston (41) that is connected to the protective cover (16) is pressed against the upper surface of at least one electronic component (3) in order to establish a thermal bridge between the electronic component and the protective cover. The piston is mounted on a support that is secured to the cover (16). The diameter of the portion (410) of the piston (41) that comes into contact with the electronic component (3) that is to be cooled is smaller than the diameter of the portion (411) of the piston that comes into contact with the support (40) for said piston.
摘要翻译：一种数据采集模块（1），包括具有多个电子部件（3,8）的耦合板（15），所述耦合板安装在所述板的至少一个表面上。与所述表面相对安装的保护盖（16）覆盖电子部件。为了冷却所述模块的模数转换器，连接到保护盖（16）的活塞（41）被压靠在至少一个电子部件（3）的上表面上，以便建立热电子元件与保护罩之间的桥梁。活塞安装在固定到盖（16）上的支撑件上。与要冷却的电子部件（3）接触的活塞（41）的部分（410）的直径小于与所述活塞（41）接触的部分（411）的直径所述活塞的支撑件（40）。

8. 发明申请

WO99056514A1 SIMPLIFIED MODULAR STRUCTURE 审中-公开
标题翻译：简化模块化结构
公开(公告)号：WO99056514A1
公开(公告)日：1999-11-04
申请号：PCT/FR1999/000935
申请日：1999-04-20
IPC分类号： H05K7/14
CPC分类号： H05K7/1461 , H05K7/1412 , H05K7/20563
摘要： The invention concerns a printed circuit card-holder modular structure (S), designed to be connected to an electronic installation, comprising two package caps (1.1, 1.2) facing each other, and defining a housing (2) for at least one printed circuit card (3). Said package caps (1.1, 1.2) mutually co-operate sandwiching at a first edge (50) support means (5) for one or several connecting blocks (10) for connection and at a second edge (40) support means (4) for a locking mechanism (7) maintaining the structure (S) in connected position. The support means (4, 5) for the locking mechanism (7) and the connection blocks (10) have disjointed ends (41, 53) before the package caps (1.1, 1.2) are mounted. The invention is applicable in particular to integrated modular avionic-type electronic installations.
摘要翻译：本发明涉及一种印刷电路卡座模块化结构（S），其被设计为连接到电子设备，包括彼此面对的两个封装盖（1.1,1.2），并且限定用于至少一个印刷电路的壳体（2）卡（3）。所述包装盖（1.1,1.2）在用于连接的一个或多个连接块（10）的第一边缘（50）支撑装置（5）处相互协作，并且在第二边缘（40）支撑装置（4）处夹持锁定机构（7）将结构（S）保持在连接位置。在安装封装盖（1.1,1.2）之前，用于锁定机构（7）和连接块（10）的支撑装置（4,5）具有不相连的端部（41,43）。本发明特别适用于集成模块式航空电子型电子装置。

9. 发明申请

WO1995025421A1 SUBRACK 审中-公开
标题翻译：载板进行组装
公开(公告)号：WO1995025421A1
公开(公告)日：1995-09-21
申请号：PCT/DE1995000279
申请日：1995-03-02
申请人： SIEMENS NIXDORF INFORMATIONSSYSTEME AG , KNOOP, Franz-Josef
发明人： SIEMENS NIXDORF INFORMATIONSSYSTEME AG
IPC分类号： H05K07/14
CPC分类号： H05K7/1461
摘要： In an arrangement for the flexible configuration of a subrack, a carrier plate is used for modules of a partial height instead of modules of full height and in turn provides guide rails for the modules of a partial height.
摘要翻译：安排一个框的灵活的配置，由此对所述模块的高度的一部分，支撑板代替模块的用于全高度和进而提供导轨用于部分高度的模块。

10. 发明申请

WO1989005087A1 PRINTED CIRCUIT BOARD LABEL HOLDER 审中-公开
标题翻译：打印电路板标签夹
公开(公告)号：WO1989005087A1
公开(公告)日：1989-06-01
申请号：PCT/US1988004026
申请日：1988-11-09
申请人： WRIGHT, Carol, Crosby
IPC分类号： H05K01/18
CPC分类号： H05K1/0266 , H05K1/14 , H05K7/1461 , H05K2201/10446 , H05K2201/10606 , H05K2203/0191
摘要： A printed circuit card label holder (30) mounted at the edge of the card (18, 20, 22) when viewed in the plane of the card and supported on the card by fingers (32) which clip onto the card where permitted by electrical components (24, 26) on the card.
摘要翻译：当在卡的平面中观察时，安装在卡的边缘处的印刷电路卡标签保持器（30），并且通过手指（32）支撑在卡上，该卡在电子许可的情况下夹在卡上卡上的组件（24,26）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式