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1. 发明申请

WO2018160557A1 ELECTRONICS TESTER 审中-公开
公开(公告)号：WO2018160557A1
公开(公告)日：2018-09-07
申请号：PCT/US2018/019934
申请日：2018-02-27
申请人： AEHR TEST SYSTEMS
发明人： JOVANOVIC, Jovan , DEBOE, Kenneth W. , STEPS, Steven C. , LINDSEY, Scott E.
IPC分类号： G01R31/28 , G01R1/00 , G01R1/02 , G01R31/00
摘要： A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

2. 发明申请

WO0104643A3 WAFER-LEVEL BURN-IN AND TEST CARTRIDGE AND METHODS 审中-公开
标题翻译：水平测量和测试方法
公开(公告)号：WO0104643A3
公开(公告)日：2002-04-18
申请号：PCT/US0019391
申请日：2000-07-13
申请人： AEHR TEST SYSTEMS , UHER FRANK OTTO , ANDBERG JOHN WILLIAM , CARBONE MARK CHARLES , RICHMOND DONALD PAUL II
发明人： UHER FRANK OTTO , ANDBERG JOHN WILLIAM , CARBONE MARK CHARLES , RICHMOND DONALD PAUL II
IPC分类号： G01R31/26 , G01R1/04 , G01R1/06 , G01R31/28 , H01L21/66 , H05K3/00 , G01R31/316
CPC分类号： G01R1/0491 , G01R31/2806 , G01R31/2831 , G01R31/2863 , G01R31/2865 , G01R31/2867 , G01R31/2886 , H05K3/4691
摘要： A cartridge (10) includes a chuck plate (12) for receiving a wafer (74) and a probe plate (14) for establishing electrical contact with the wafer. In use, a mechanical connecting device (90) locks the chuck plate and the probe plate fixed relative to one another to maintain alignment of the wafer and the probe plate. Preferably, electrical contact with the wafer is established using a probe card (50) that is movably mounted to the probe plate by means of a plurality of leaf springs (52). The mechanical connecting device is preferably a kinematic coupling including a male connector (94) and first and second opposed jaws (122, 124). Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and a retracted position, and is biased towards the retracted position. This provides a positive clamping force that pulls the chuck and probe plates together when the mechanical connecting device is engaged. To leaf a wafer into the cartridge, the wafer is placed on the chuck plate, the probe plate is aligned with the wafer, and the chuck plate and the probe plate are locked together. The cartridge can then be removed from the alignment device and placed in a burn-in or test chamber that does not itself require means for aligning the wafer or for providing a probe actuation force.
摘要翻译：盒（10）包括用于接收晶片（74）的卡盘板（12）和用于与晶片建立电接触的探针板（14）。在使用中，机械连接装置（90）相对于彼此固定的卡盘板和探针板锁定，以保持晶片和探针板的对准。优选地，使用通过多个板簧（52）可移动地安装到探针板的探针卡（50）来建立与晶片的电接触。机械连接装置优选地是包括阳连接器（94）和第一和第二相对的夹爪（122,124）的运动耦合。每个夹爪可从缩回位置枢转，在该缩回位置中，阳连接器可以插入在夹爪之间，并且夹爪防止凸形连接器从夹爪之间拔出。阳连接器可在延伸位置和缩回位置之间移动，并且朝着缩回位置偏置。这提供了当夹持机械连接装置时将卡盘和探针板拉到一起的正夹紧力。为了将晶片放入盒中，将晶片放置在卡盘上，探针板与晶片对准，并将卡盘板和探针板锁定在一起。然后可以将该盒从对准装置移除并放置在本身不需要用于对准晶片或提供探针致动力的装置的老化或测试室中。

3. 发明申请

WO1995015595A1 HIGH-DENSITY INTERCONNECT TECHNIQUE 审中-公开
标题翻译：高密度互连技术
公开(公告)号：WO1995015595A1
公开(公告)日：1995-06-08
申请号：PCT/US1994012757
申请日：1994-11-04
申请人： AEHR TEST SYSTEMS, INC.
发明人： AEHR TEST SYSTEMS, INC. , BARRACLOUGH, William, D. , ALPERIN, Mikhail, A. , BREHM, Jeffrey, A. , HOANG, John, Dinh , SHEPHERD, Patrick, M. , TOMIC, James, F.
IPC分类号： H01R09/09
CPC分类号： G01R31/2863 , G01R31/2808 , H01R12/721
摘要： A high-density interconnect system (30) employs contact fingers (32) on both surfaces (34 and 36) of burn-in PCB (38), feed-through PCB (40) and driver PCB (42). Each of the PCBs (38, 40 and 42) has a card edge connector (44, 46 and 48). The feed-through PCB (40) has a second card edge connector (40) and second set of contact fingers (32), since it mates with both the burn-in PCB (38) and the driver PCB (42). The contact fingers (32) and the card edge connectors (44, 46, 48 and 50) of each PCB (38, 40 and 42) mate inversely with each other on adjacent PCBs.
摘要翻译：高密度互连系统（30）在老化PCB（38），馈通PCB（40）和驱动器PCB（42）的两个表面（34和36）上使用接触指（32）。每个PCB（38,40和42）具有一个卡缘连接器（44,46和48）。馈通PCB（40）具有第二卡缘连接器（40）和第二组接触指（32），因为它与老化PCB（38）和驱动器PCB（42）相配合。每个PCB（38,40和42）的接触指（32）和卡边缘连接器（44,46,48和50）在相邻的PCB上相互配合。

4. 发明申请

WO2004008163A3 ASSEMBLY FOR CONNECTING A TEST DEVICE TO AN OBJECT TO BE TESTED 审中-公开
公开(公告)号：WO2004008163A3
公开(公告)日：2004-01-22
申请号：PCT/US2003/022125
申请日：2003-07-15
申请人： AEHR TEST SYSTEMS , RICHMOND, Donald, P., II , JOVANOVIC, Jovan , UHER, Frank, O.
发明人： RICHMOND, Donald, P., II , JOVANOVIC, Jovan , UHER, Frank, O.
IPC分类号： G01R1/073
摘要： In one embodiment, the invention provides a test assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component. The assembly comprises a contactor assembly to interconnect with the test component, a probe assembly to mechanically support the contactor assembly and electrically connected the contactor assembly to the testing machine, and a clamping mechanism comprising a first clamping member and a second clamping member, the clamping members being urged together to exert a clamping force to deform contactor bumps of an electrical connection between the probe assembly and the contactor assembly.

5. 发明申请

WO0104641A3 WAFER LEVEL BURN-IN AND ELECTRICAL TEST SYSTEM AND METHOD 审中-公开
标题翻译：晶片级烧蚀和电测试系统和方法
公开(公告)号：WO0104641A3
公开(公告)日：2001-12-06
申请号：PCT/US0019482
申请日：2000-07-13
申请人： AEHR TEST SYSTEMS INC , RICHMOND DONALD PAUL II , HOANG JOHN DINH , LOBACZ JERZY
发明人： RICHMOND DONALD PAUL II , HOANG JOHN DINH , LOBACZ JERZY
IPC分类号： G01R31/26 , G01R31/28 , G01R31/30 , H01L21/66 , H05K3/00 , G01R31/316
CPC分类号： G01R31/2868 , G01R31/2831 , G01R31/2874 , G01R31/2886 , H05K3/4691
摘要： A burn-in and electrical test system (20) includes a temperature controlled zone (22) and a cool zone (24) separated by a transition zone (25. The temperature controlled zone (22) is configured to receive a plurality of wafer cartridges (26) and connect the cartridges (26) to test electronics (28) and power electronics (30), which are mounted in the cool zone (24). Each of the wafer cartridges (26) contains a semiconductor wafer incorporating a plurality of integrated circuits. The test electronics (28) consists of a pattern generator PCB (100) and a signal driver and fault analysis PCB (102) connected together by a parallel bus (104). The pattern generator PCB (100) and the fault analysis PCB (102) are connected to a rigid signal probe PCB (104) in cartridge (26) to provide a straight through signal path. The probe PCB (104) is rigid in order to allow close control of capacitance between each signal line and a backplane, thus providing impedance controlled interconnections between a semiconductor wafer under test and the test electronics (28). The power distribution system (30) is connected to a probe power PCB (106) in the cartridge (26). The probe power PCB (106) has at least a bendable portion in order to allow it to be positioned closely adjacent to and parallel with the rigid probe PCB (104), yet extend a substantial distance away from the probe PCB (106) at its interconnection (109).
摘要翻译：老化和电气测试系统（20）包括由过渡区（25）分隔的温度控制区（22）和冷却区（24）。温度控制区（22）被配置为接收多个晶片盒（26），并将盒（26）连接到安装在冷区（24）中的测试电子器件（28）和功率电子器件（30）。每个晶片盒（26）包含半导体晶片，测试电子装置28由图案发生器PCB 100和由并行总线104连接在一起的信号驱动器和故障分析PCB 102组成，图案发生器PCB 100和故障分析 PCB（102）连接到盒（26）中的刚性信号探针PCB（104）以提供直通信号路径。探针PCB（104）是刚性的，以允许对每个信号线和底板，从而提供了阻抗控制之间的互连被测试的半导体晶圆和测试电子器件（28）。配电系统（30）连接到盒（26）中的探针电源PCB（106）。探针电源PCB（106）具有至少一个可弯曲部分，以便允许其被定位成紧密邻近且平行于刚性探针PCB（104），但在其探针PCB（106）处远离其探头PCB（106）延伸相当大的距离互连（109）。

6. 发明申请

WO0019775B1 WAFER LEVEL BURN-IN AND TEST THERMAL CHUCK AND METHOD 审中-公开
标题翻译： WAFER LEVEL BURN-IN和TERM THERM CHUCK AND METHOD
公开(公告)号：WO0019775B1
公开(公告)日：2000-06-15
申请号：PCT/US9921885
申请日：1999-09-20
申请人： AEHR TEST SYSTEMS
发明人： ANDBERG JOHN W
IPC分类号： G01R31/26 , G01R31/30 , H01L21/00 , H01L21/66 , H01L21/683 , H05B3/68 , B23B5/22 , C23C16/00 , H01T23/00 , H05B3/44
CPC分类号： H01L21/67248 , H01L21/67103
摘要： A thermal chuck or heat sink (10) has a lower surface (12) covered with fins (14) parallel to air flow (16), to increase the surface area and promote heat transfer. A pair of slots (32) near pedestal (20) (along the fins) effectively lowers the conductivity of the metal in the direction across the fins. Heat flowing through this region of lowered conductivity experiences a greater temperature drop. This raises the temperature at the adjacent parts of the top surface, and (for properly sized slots) results in circular isotherms. The circular isotherms are turned into a nearly isothermal surface by a precisely dimensioned groove (36) parallel to the top surface (22), extending around the circumference of the pedestal (20). Heat flowing into the outer regions of the circular surface (22) is forced to travel radially inward, thus raising the edge temperature (which would naturally be lower than the center). For properly sized slots (32) and groove (36), it is possible to achieve a nearly constant temperature top surface (22).
摘要翻译：热卡盘或散热器（10）具有覆盖有与空气流（16）平行的翅片（14）的下表面（12），以增加表面积并促进热传递。靠近基座（20）（沿着翅片）的一对槽（32）有效地降低金属沿着翅片的方向的导电性。流过该区域的热量降低的热量经历较大的温度下降。这提高了顶部表面相邻部分的温度，并且（对于适当尺寸的狭槽）导致圆形等温线。圆形等温线通过平行于顶表面（22）的精确尺寸的凹槽（36）变成几乎等温的表面，围绕基座（20）的圆周延伸。流入圆形表面（22）的外部区域的热量被迫径向向内行进，从而提高边缘温度（这自然会低于中心点）。对于适当尺寸的槽（32）和槽（36），可以实现几乎恒定的温度顶表面（22）。

7. 发明申请

WO2006116767A1 APPARATUS FOR TESTING ELECTRONIC DEVICES 审中-公开
标题翻译：用于测试电子设备的装置
公开(公告)号：WO2006116767A1
公开(公告)日：2006-11-02
申请号：PCT/US2006/016659
申请日：2006-04-27
申请人： AEHR TEST SYSTEMS , RICHMOND, Donald, P., II , DEBOE, Kenneth, W. , UHER, Frank, O. , JOVANOVIC, Jovan , LINDSEY, Scott, E , MAENNER, Thomas, T. , SHEPHERD, Patrick, M. , TYSON, Jeffrey, L. , CARBONE, Mark, C. , BURKE, Paul, W. , CAO, Doan, D. , TOMIC, James, F. , VU, Long, V.
发明人： RICHMOND, Donald, P., II , DEBOE, Kenneth, W. , UHER, Frank, O. , JOVANOVIC, Jovan , LINDSEY, Scott, E , MAENNER, Thomas, T. , SHEPHERD, Patrick, M. , TYSON, Jeffrey, L. , CARBONE, Mark, C. , BURKE, Paul, W. , CAO, Doan, D. , TOMIC, James, F. , VU, Long, V.
IPC分类号： G01R31/28 , G01R1/073
CPC分类号： G01R31/287 , G01R31/003 , G01R31/26 , G01R31/2642 , G01R31/2851 , G01R31/2855 , G01R31/2863 , G01R31/2868 , G01R31/2872 , G01R31/2877 , G01R31/2886 , G01R31/2889 , G01R31/2891 , G01R31/31924 , G06F8/30
摘要： An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
摘要翻译：描述了一种用于老化和/或功能测试未调制晶片的微电子电路的装置。可以对晶片上的大量触点进行大量的电源，接地和信号连接。该装置具有允许电通路进入的盒。分配板具有多个接口，其被策略地定位以提供致密配置。接口通过柔性附件连接到第一连接器模块阵列。第一连接器模块中的每一个可以独立地连接到多个第二连接器模块中的相应的一个，从而减少装置的框架上的应力。其他特征包括例如允许对端子施加到晶片的触点上的力的严格控制的活塞。

8. 发明申请

WO2004027836A3 DIE CARRIER 审中-公开
公开(公告)号：WO2004027836A3
公开(公告)日：2004-04-01
申请号：PCT/US2003/026415
申请日：2003-08-19
申请人： AEHR TEST SYSTEMS , MALATHONG, Seang, P. , HEMMERLING, Martin, A.
发明人： MALATHONG, Seang, P. , HEMMERLING, Martin, A.
IPC分类号： G01R1/04
摘要： A die carrier is disclosed which is specifically designed for use in a TSOP socket. More specifically, the die carrier has a carrier substrate with carrier contacts thereon that are dimensioned specifically to match the positioning of the upper and lower socket contacts. The carrier substrate, being 145 microns thick, can also fit between the upper and lower socket contacts. A carrier base support component is located below a portion only of the carrier substrate, and does not impair insertion of the carrier substrate into the relatively small spacing between the upper and lower socket contacts. Damage to the carrier substrate is avoided by clamping edges of the carrier substrate from opposing sides between the upper and lower socket contacts. There are no screws or nuts within the carrier base support component that may increase its size and prevent it from being inserted into the socket. A double-sided, robust electrical connection is made by each respective pair of upper and lower socket contacts.

9. 发明申请

WO0104642A9 KINEMATIC COUPLING 审中-公开
标题翻译：动力耦合
公开(公告)号：WO0104642A9
公开(公告)日：2002-09-06
申请号：PCT/US0019390
申请日：2000-07-13
申请人： AEHR TEST SYSTEMS INC , UHER FRANK OTTO , ANDBERG JOHN WILLIAM , CARBONE MARK CHARLES , RICHMOND DONALD PAUL II
发明人： UHER FRANK OTTO , ANDBERG JOHN WILLIAM , CARBONE MARK CHARLES , RICHMOND DONALD PAUL II
IPC分类号： B23Q1/00 , F16B5/06 , F16B21/16 , G01R1/04 , G01R31/28 , G01R31/316 , H01L21/00
CPC分类号： F16B5/0657 , B23Q1/0072 , F16B5/0628 , F16B21/16 , G01R1/045 , G01R31/2886
摘要： A kinematic coupling includes a male connector (94) and first and second opposed jaws (122, 124). Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and a retracted position, and is biased towards the retracted position. This provides a positive clamping force when the kinematic coupling is engaged.
摘要翻译：运动耦合包括阳连接器（94）和第一和第二相对的夹爪（122,124）。每个夹爪可从缩回位置枢转，在该缩回位置中，阳连接器可以插入在夹爪之间，并且夹爪防止凸形连接器从夹爪之间拔出。阳连接器可在延伸位置和缩回位置之间移动，并且朝着缩回位置偏置。当运动耦合接合时，这提供了正的夹紧力。

10. 发明申请

WO0104642A2 KINEMATIC COUPLING 审中-公开
标题翻译：运动耦合
公开(公告)号：WO0104642A2
公开(公告)日：2001-01-18
申请号：PCT/US0019390
申请日：2000-07-13
申请人： AEHR TEST SYSTEMS INC , UHER FRANK OTTO , ANDBERG JOHN WILLIAM , CARBONE MARK CHARLES , RICHMOND DONALD PAUL II
发明人： UHER FRANK OTTO , ANDBERG JOHN WILLIAM , CARBONE MARK CHARLES , RICHMOND DONALD PAUL II
IPC分类号： B23Q1/00 , F16B5/06 , F16B21/16 , G01R1/04 , G01R31/28 , G01R1/00
CPC分类号： F16B5/0657 , B23Q1/0072 , F16B5/0628 , F16B21/16 , G01R1/045 , G01R31/2886
摘要： A kinematic coupling includes a male connector (94) and first and second opposed jaws (122, 124). Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and a retracted position, and is biased towards the retracted position. This provides a positive clamping force when the kinematic coupling is engaged.
摘要翻译：运动学联轴器包括阳连接器（94）和第一和第二相对的夹爪（122,124）。每个夹爪均可从缩回位置枢转，在该缩回位置中，可将阳连接器插入夹爪之间，以及夹爪防止凸连接器从夹爪之间退出的接合位置。公连接器可在伸出位置和缩回位置之间移动，并朝向缩回位置偏置。当运动联轴器啮合时，这提供了一个正的夹紧力。

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