专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2010097230A3 METHOD FOR PRODUCING A METAL STRUCTURE ON A SUBSTRATE 审中-公开
标题翻译：一种用于生产金属结构上的衬底
公开(公告)号：WO2010097230A3
公开(公告)日：2011-01-20
申请号：PCT/EP2010001198
申请日：2010-02-26
申请人： ZYRUS BETEILIGUNGSGMBH & CO PATENTE I KG , ROSTAMI BARDIA , KRUSE JAN , UELZEN THORSTEN , BECKER EIKE
发明人： ROSTAMI BARDIA , KRUSE JAN , UELZEN THORSTEN , BECKER EIKE
IPC分类号： H05K3/20 , H01L51/00
CPC分类号： H05K3/205 , C25D7/06 , H01L51/0013 , H01L51/0021 , H05K3/1275 , H05K3/207 , H05K3/241 , H05K2201/0329 , H05K2201/0969 , H05K2203/0117 , H05K2203/0534 , H05K2203/0723 , Y02P20/582
摘要： According to the invention, a method for producing a metal structure on a substrate is provided, characterized by the method steps: a. a polymerization process, wherein at least one structure electrode is used, said electrode having a surface with a first area of a structure that can be specified (electrode contact area), and a remaining, second area (electrode complementary area), wherein the electrode contact area can be connected to a first voltage potential, wherein at least a part of the electrode contact area is brought into contact with a preferably liquid first electrolyte, wherein compounds which can be polymerized and/or cross-linked are introduced in the first electrolyte, and wherein a first current flow is generated by the first electrolyte via the structure electrode, wherein a conductive polymer film of the specified structure is formed on the electrolyte contact area which was brought into contact with the first electrolyte (polymer structure), b. a galvanization process, wherein at least a part of the polymer structure is brought into contact with a preferably liquid second electrolyte, wherein a metal substance is introduced in the second electrolyte, wherein a second current flow is generated by the second electrolyte via the polymer structure, wherein a conductive metal film of the specified structure is formed and/or deposited on the area of the polymer structure which was brought into contact with the second electrolyte (metal structure), c. a transfer of the metal structure to the substrate, wherein at least a part of the metal structure is applied to the substrate, and/or a transfer of the polymer structure to the substrate, wherein at least a part of the polymer structure is applied to the substrate.
摘要翻译：根据本发明，是用于制造在衬底上的金属结构，其特征在于以下步骤的方法：一个。的聚合方法，其中至少一个图案电极，使用其表面具有预定的结构（电极接触面积）和剩余的第二部分（电极互补区），其中，与第一电压电势的电极接触区域可连接，至少一个电极接触面积的接触部的第一区域一个，优选为液体，第一电解质被带，所述可聚合组在第一电解质和/或可交联被并入的化合物，并通过在电极结构中的第一电解质产生的第一电流流动，向使其与所述第一电解质 - 电极接触区域接触形成所述预定图案的导电性高分子膜（聚合物结构）中，b。电镀工艺，其中所述聚合物结构的至少一部分与一个，优选为液体，第二电解质接触时，其特征在于，其中，通过在聚合物结构中的第二电解质产生的第二电流流动的金属材料被引入到所述第二电解质，其中，所述带入与聚合物结构的第二电解质区域接触地形成，所述预定图案的导电性金属膜和/或沉积（金属结构）中，c。金属结构的转印到基底上，其中至少所述金属结构的一部分被施加到基底上，和/或在基板上的转印聚合物结构的，其中，至少该聚合物结构的一部分被施加到衬底上。

IPRDB

热门服务

关于我们

友情链接

联系方式