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    • 2. 发明申请
    • SURFACE MOUNT CHIP CAPACITOR
    • 表面安装芯片电容器
    • WO2007064372A1
    • 2007-06-07
    • PCT/US2006/031123
    • 2006-08-10
    • VISHAY SPRAGUE, INC.KATRARO, ReuvenKUSHNAREV, LiliaCOHEN, NissimGOLDBERGER, Haim
    • KATRARO, ReuvenKUSHNAREV, LiliaCOHEN, NissimGOLDBERGER, Haim
    • H01G4/00H01G9/00
    • H01G9/012H01G2/065H01G9/042H01G9/0425H01G9/08Y10T29/41Y10T29/417
    • A surface mount chip capacitor includes a metal substrate, a conductive powder element comprising a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor. The coating preferably comprises a parylene or a parylene derivative.
    • 表面安装片式电容器包括金属基板,包括阀金属的导电粉末元件,并且部分地围绕金属基板,金属基板从导电粉末朝向表面安装片式电容器的阳极端向外延伸,银体阴极 至少部分地围绕导电粉末元件,通过围绕银体阴极的气相沉积形成的涂层,围绕从导电粉末向外延伸的基板的一部分形成的绝缘材料,在阳极处形成在金属基板周围的导电涂层 表面安装片式电容器的端部,与表面贴装电容器的阳极端处的导电涂层电连接的端接端子阳极,以及电连接到表面安装芯片的阴极端处的银体阴极的端部端子阴极 电容。 涂层优选包含聚对二甲苯或聚对二甲苯衍生物。