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1. 发明申请

WO2017218806A1 POINT SYMMETRIC COMPLEMENTARY MEANDER LINE SLOTS FOR MUTUAL COUPLING REDUCTION 审中-公开
标题翻译：对称互补补偿线路插槽用于相互耦合约化
公开(公告)号：WO2017218806A1
公开(公告)日：2017-12-21
申请号：PCT/US2017/037724
申请日：2017-06-15
申请人： UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. , ELECTRONICS AND TELECOMMUNICATION RESEARCH INSTITUTE (ETRI)
发明人： YOON, Yong, Kyu , HWANGBO, Seahee , YANG, Hae, Yong
IPC分类号： H01Q3/00
摘要： Various examples are provided for point symmetric complementary meander line (PSC-ML) slots, which can be used for mutual coupling reduction. In one example, an antenna array includes first and second patch antenna elements disposed on a first side of a substrate, the first and second patch antenna elements separated by a gap. The antenna array can include point symmetric complementary meander line (PSC-ML) slots formed in a ground plane disposed on a second side of the substrate. The PSC-ML slots can include a pair of ML slots aligned with the gap between the first and second patch antenna elements. In another example, a method includes forming first and second antenna elements on a first side of a substrate and forming PSC-ML slots in a ground plane disposed on a second side of the substrate that are aligned with a gap between the first and second antenna elements.
摘要翻译：针对点对称互补曲折线（PSC-ML）时隙提供了各种示例，其可用于互耦减少。在一个示例中，天线阵列包括布置在衬底的第一侧上的第一和第二贴片天线元件，第一和第二贴片天线元件由间隙分开。天线阵列可以包括形成在设置在衬底的第二侧上的接地平面中的点对称互补曲折线（PSC-ML）槽。 PSC-ML插槽可以包括与第一和第二贴片天线元件之间的间隙对齐的一对ML插槽。在另一个示例中，一种方法包括在衬底的第一侧上形成第一和第二天线元件，并且在设置在衬底的第二侧上的接地平面中形成PSC-ML槽，所述PSC-ML槽与第一和第二天线元件。

2. 发明申请

WO2017180956A1 FRACTAL-RECTANGULAR REACTIVE IMPEDANCE SURFACE FOR ANTENNA MINIATURIZATION 审中-公开
标题翻译：用于天线微型化的分形矩形反应阻抗表面
公开(公告)号：WO2017180956A1
公开(公告)日：2017-10-19
申请号：PCT/US2017/027552
申请日：2017-04-14
申请人： UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. , ELECTRONICS AND TELECOMMUNICATION RESEARCH INSTITUTE (ETRI)
发明人： YOON, Yong, Kyu , HWANGBO, Seahee , YANG, Hae, Yong
IPC分类号： H01Q1/38 , H01Q1/00 , H01Q1/48 , H01Q9/04 , H01Q9/16 , H01Q11/10
CPC分类号： H01Q21/065 , H01Q1/00 , H01Q1/38 , H01Q1/48 , H01Q3/04 , H01Q9/04 , H01Q9/0407 , H01Q9/0428 , H01Q9/0442 , H01Q9/045 , H01Q9/16 , H01Q11/10 , H01Q13/10 , H01Q15/0093 , H01Q21/0025
摘要： Various examples are provided that are related to fractal-based reactive impedance surfaces. These surfaces allow for miniaturization of antennas. In one example, a fractal rectangular reactive impedance surface (FR-RIS) includes a plurality of fractal rectangular (FR) patches having an outer edge defined by a fractal rectangular pattern that is repeated along each side of inner FR patches of the plurality of FR patches. The fractal rectangular pattern of a FR patch matches with the fractal rectangular pattern of an adjacent FR patch. An antenna can include a planar antenna disposed over the FR-RIS.
摘要翻译：提供了与基于分形的电抗性表面有关的各种示例。这些表面可以使天线小型化。在一个示例中，分形矩形电抗性表面（FR-RIS）包括多个分形矩形（FR）贴片，其具有由分形矩形图案限定的外边缘，所述分形矩形图案沿着所述多个FR的内FR片的每一侧重复补丁。 FR片的分形矩形图案与相邻FR片的分形矩形图案相匹配。天线可以包括布置在FR-RIS上的平面天线。

3. 发明申请

WO2017184556A2 GLASS INTERPOSER INTEGRATED ANTENNA FOR INTRACHIP, INTERCHIP AND BOARD COMMUNICATIONS 审中-公开
公开(公告)号：WO2017184556A2
公开(公告)日：2017-10-26
申请号：PCT/US2017/028054
申请日：2017-04-18
申请人： UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
发明人： HWANGBO, Seahee , YOON, Yong, Kyu
IPC分类号： H01Q1/32
CPC分类号： H01Q1/2283 , H01L23/492 , H01L23/49811 , H01L23/66 , H01Q1/32 , H01Q9/0407 , H01Q9/285 , H01Q9/30 , H01Q9/36 , H01Q13/106 , H01Q15/14
摘要： Various examples are provided for glass interposer integrated antennas for intrachip, interchip and board communications. In one example, a reflector through- glass via (TGV) antenna includes a TGV or group of TGVs extending through a glass substrate. The TGV can extend from a feeding line disposed on a first side of the glass substrate to a loading disc disposed on a second side of the glass substrate. An array of reflector pillars extending through the glass substrate from a ground plane on the first side of the glass substrate to the second side of the glass substrate can also be provided with the array of reflector pillars distributed beyond an outer edge of the loading disc. The TGV antenna can be implemented as a dual mode design and excited at a first frequency to generate an omni-directional radiation pattern and at a second frequency to generate a broadside radiation pattern.

4. 发明申请

WO2017184556A3 GLASS INTERPOSER INTEGRATED ANTENNA FOR INTRACHIP, INTERCHIP AND BOARD COMMUNICATIONS 审中-公开
标题翻译：用于INTRACHIP，INTERCHIP和板通信的玻璃互连器集成天线
公开(公告)号：WO2017184556A3
公开(公告)日：2017-10-26
申请号：PCT/US2017/028054
申请日：2017-04-18
申请人： UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
发明人： HWANGBO, Seahee , YOON, Yong, Kyu
IPC分类号： H01Q15/14 , H01Q15/18 , H01Q19/18 , H01Q19/19 , H05K3/42 , H05K7/06
摘要： Various examples are provided for glass interposer integrated antennas for intrachip, interchip and board communications. In one example, a reflector through- glass via (TGV) antenna includes a TGV or group of TGVs extending through a glass substrate. The TGV can extend from a feeding line disposed on a first side of the glass substrate to a loading disc disposed on a second side of the glass substrate. An array of reflector pillars extending through the glass substrate from a ground plane on the first side of the glass substrate to the second side of the glass substrate can also be provided with the array of reflector pillars distributed beyond an outer edge of the loading disc. The TGV antenna can be implemented as a dual mode design and excited at a first frequency to generate an omni-directional radiation pattern and at a second frequency to generate a broadside radiation pattern.
摘要翻译：提供了用于片内，片间和板通信的玻璃中介层集成天线的各种示例。在一个示例中，反射器玻璃通孔（TGV）天线包括延伸穿过玻璃基板的TGV或一组TGV。 TGV可以从布置在玻璃基板的第一侧上的馈电线延伸到布置在玻璃基板的第二侧上的加载盘。从玻璃衬底的第一侧上的接地平面延伸穿过玻璃衬底到玻璃衬底的第二侧的反射柱阵列还可以设置有分布在加载盘的外边缘之外的反射柱的阵列。 TGV天线可以实现为双模式设计，并且以第一频率激励以产生全向辐射模式，并且以第二频率产生宽频辐射模式。

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