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1. 发明申请

WO2007033146A2 LATERAL INTERPOSER CONTACT DESIGN AND PROBE CARD ASSEMBLY 审中-公开
标题翻译：横向插座联系设计和探针卡组件
公开(公告)号：WO2007033146A2
公开(公告)日：2007-03-22
申请号：PCT/US2006035442
申请日：2006-09-13
申请人： TOUCHDOWN TECHNOLOGIES INC
发明人： GARABEDIAN RAFFI , TEA NIM HAK , ISMAIL SALEH
IPC分类号： G01R1/073
CPC分类号： H01R12/52 , G01R1/07371 , H01L2224/1134 , H01L2224/1308 , H01L2924/00013 , H01L2924/01019 , H01L2924/01055 , H01L2924/01067 , H01L2924/09701 , H01L2924/1461 , H01R13/24 , H05K3/325 , H01L2224/29099 , H01L2924/00
摘要： An interposer has an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of the interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of the interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.
摘要翻译：插入器具有具有上表面和下表面的插入器基板和具有上部和下部的至少一个弹性接触元件。上部部分以基本上垂直的方式延伸到中介层基板的上表面之上，并且下部部分以基本垂直的方式延伸到中介层基板的下表面之下。弹性接触元件的上部和下部在平行于基底的方向上基本上具有弹性。

2. 发明申请

WO2008069967A3 LATERAL INTERPOSER CONTACT DESIGN AND PROBE CARD ASSEMBLY 审中-公开
标题翻译：横向插针接触设计和探针卡组件
公开(公告)号：WO2008069967A3
公开(公告)日：2008-10-30
申请号：PCT/US2007024631
申请日：2007-11-30
申请人： TOUCHDOWN TECHNOLOGIES INC
发明人： KINGHORN DAVID , GARABEDIAN RAFFI , YABUKI RICHARD , ISMAIL SALLEH
IPC分类号： G01R1/073
CPC分类号： G01R1/07378 , H01R12/52 , H01R13/24 , H01R13/2435 , H01R13/2464 , H01R13/2485 , H05K3/325
摘要： The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.
摘要翻译：本发明涉及一种中介层，其具有带有上表面和下表面的中介层基底以及具有上部和下部的至少一个弹性接触元件。上部以基本垂直的方式在所述插入基板的上表面上方延伸，并且下部在所述插入基板的下表面下方以基本垂直的方式延伸。弹性接触元件的上部和下部在平行于基板的方向上基本上是弹性的。

3. 发明申请

WO2009011696A8 A DEVICE AND METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM 审中-公开
标题翻译：一种用于重复微电子系统的装置和方法
公开(公告)号：WO2009011696A8
公开(公告)日：2010-03-18
申请号：PCT/US2007073579
申请日：2007-07-16
申请人： TOUCHDOWN TECHNOLOGIES INC
发明人： NAMBURI LAKSHMIKANTH , GARABEDIAN RAFFI
IPC分类号： G01R1/073 , G01R31/02 , G01R31/26 , H01L21/00 , H01L21/66 , H05K3/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/07342
摘要： A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired. Specifically, a probe card for use with a diagnostic computer for testing semiconductor wafers, the probe card comprises a substrate and a plurality operational of probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer, and wherein the plurality of operational probes include a sacrificial material that is activated by applying a voltage. A method for removing a damaged probe from a probe card is also disclosed. The method removes a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and the plurality of operational probes comprises a sacrificial material that is activated by applying a voltage. The method comprises identifying the damaged probe, applying the voltage to the damaged probe, exposing the damaged probe to an etching solution and removing the damaged probe from the probe card. A second method for repairing a damaged probe from a probe card is also disclosed. The method repairs a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and a plurality of replacement probes connected to the substrate and wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. The method comprising the steps of identifying the damaged probe, removing the damaged probe from the probe card, separating one of the plurality of replacement probes from the substrate, and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed. Several refinements to these devices and methods are disclosed.
摘要翻译：公开了一种用于修复MEMS系统的新型装置和方法，包括用于半导体测试的探针卡。在一个实施例中，与用于测试半导体晶片的诊断计算机一起使用的探针卡包括衬底，连接到衬底的多个操作探针，其中多个操作探针适于与诊断计算机进行电连接，多个连接到基板的替换探针，其中多个操作探针和多个置换探针构成在基本上相同的制造过程中。还公开了可以修复的新型探针卡。具体地说，探针卡与用于测试半导体晶片的诊断计算机一起使用的探针卡，所述探针卡包括衬底和连接到所述衬底的探测器的多个操作，其中所述多个操作探针适于与所述诊断计算机进行电连接，并且其中所述多个操作探针包括通过施加电压而被激活的牺牲材料。还公开了一种从探针卡中去除损坏的探针的方法。该方法从包括连接到基板的多个操作探针的探针卡移除损坏的探针，并且多个操作探针包括通过施加电压而被激活的牺牲材料。该方法包括识别损坏的探针，向损坏的探针施加电压，将损坏的探针暴露于蚀刻溶液中，并从探针卡上移除损坏的探针。还公开了用于从探针卡修复损坏的探针的第二种方法。该方法修复来自探针卡的损坏的探针，所述探针卡包括连接到基底的多个操作探针和连接到所述基底的多个替代探针，并且其中所述多个操作探针和所述多个置换探针基本相同制造工艺。该方法包括以下步骤：识别损坏的探针，从探针卡移除损坏的探针，将多个置换探针中的一个与基底分开，以及安装从多个替换探针分离的一个探针，其中损坏的探针被去除。公开了对这些装置和方法的若干改进。

4. 发明申请

WO2008153558A3 A SEMICODUCTOR TESTING DEVICE WITH ELASTOMER INTERPOSER 审中-公开
标题翻译：具有弹性体插入器的半导体测试装置
公开(公告)号：WO2008153558A3
公开(公告)日：2009-04-09
申请号：PCT/US2007069896
申请日：2007-05-29
申请人： TOUCHDOWN TECHNOLOGIES INC
发明人： KARKLIN KEN , GARABEDIAN RAFFI
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , H01L24/45 , H01L2224/45144 , H01L2924/00014 , H01L2924/0105 , H01L2924/01079 , H01L2924/1461 , H01L2224/48 , H01L2924/00
摘要： A novel device for testing semiconductor chips is disclosed A benefit with all the embodiments described herein is that the device may expepence zero (or near zero) nascent force The device may be comppsed of a printed circuit board (PCB)that has at least one PCB piercing structure, a probe contactor substrate that has at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer that has at least one electrical via made of a conductive elastomer When the PCB piercing structure and the substrate piercing structure pierce the elastomer, the PCB becomes electrically connected to the probe contactor Instead of the piercing structure, the PCB or the probe contractor substrate may be adhered to the elastomer by an adhesive, such that the PCB becomes electrically connected to the probe contactor
摘要翻译：公开了一种用于测试半导体芯片的新型器件。本文所述的所有实施例的优点在于，器件可以超过零（或近零）新生力。该器件可以由具有至少一个PCB的印刷电路板（PCB）穿孔结构，具有至少一个基板穿孔结构的探针接触器基板，其中所述基板穿孔结构电连接到探针接触器，以及具有至少一个由导电弹性体制成的电通路的插入件当所述PCB穿孔结构和基板刺穿结构刺穿弹性体，PCB变得电连接到探针接触器代替穿孔结构，PCB或探针承载基底可以通过粘合剂粘附到弹性体上，使得PCB变得电连接到探针接触

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