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1. 发明申请

WO2006130157A2 FIELD EMISSION ASSISTED MICRODISCHARGE DEVICES 审中-公开
标题翻译：现场排放辅助微处理器件
公开(公告)号：WO2006130157A2
公开(公告)日：2006-12-07
申请号：PCT/US2005/025121
申请日：2005-07-12
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , PARK, Sung-Jin , EDEN, J., Gary , PARK, Kyung-Ho
发明人： PARK, Sung-Jin , EDEN, J., Gary , PARK, Kyung-Ho
CPC分类号： H01J1/025 , B82Y10/00 , H01J3/025 , H01J17/066 , H01J63/02 , H01J2201/30469 , H01J2217/49
摘要： Field emission nanostructures (18) assist operation of a microdischarge device. The field emission nanostructures are integrated into the microdischarge device(s) or are situated near an electrode (14, 16, 36, 38) of the microdischarge device(s). The field emission nanostructures reduce operating and ignition voltages compared to otherwise identical device lacking the field emission nanostructures, while also increasing the radiative output of the microdischarge device(s).
摘要翻译：场发射纳米结构（18）有助于微放电器件的工作。场致发射纳米结构集成到微放电器件中或位于微放电器件的电极（14,16,36,38）附近。与其他相同的缺少场致发射纳米结构的器件相比，场致发射纳米结构降低了操作和点火电压，同时也增加了微放电器件的辐射输出。

2. 发明申请

WO2010044992A1 ELLIPSOIDAL MICROCAVITY PLASMA DEVICES AND POWDER BLASTING FORMATION 审中-公开
标题翻译： ELLIPSOIDAL微波等离子体装置和粉末喷砂形成
公开(公告)号：WO2010044992A1
公开(公告)日：2010-04-22
申请号：PCT/US2009/057961
申请日：2009-09-23
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin , SUNG, Seung, Hoon
发明人： EDEN, J., Gary , PARK, Sung-Jin , SUNG, Seung, Hoon
IPC分类号： H01J17/04
CPC分类号： H01J65/046 , H01J9/241 , H01J11/18
摘要： Microcavity plasma devices and arrays are formed in layers that also seal the plasma medium, i e, gas(es) and/or vapors A microcavity plasma device includes first and second thin layers that are joined together A half ellipsoid microcavity or plurality of half ellipsoid microcavities is defined in one or both of the first and second thin layers, and electrodes are arranged with respect to the microcavity to excite a plasma within said microcavities upon application of a predetermined voltage to the electrodes A method for forming a microcavity plasma is also provided by a preferred embodiment The method includes defining a pattern of protective polymer on the first thin layer Powder blasting forms half ellipsoid microcavities in the first thin layer The second thin layer is joined to the first layer The patterning can be conducted lithographically or can be conduced with a simple screen
摘要翻译：微腔等离子体装置和阵列形成为也密封等离子体介质即气体和/或蒸汽的层。微腔等离子体装置包括连接在一起的第一和第二薄层半椭圆微腔或多个半椭圆微腔被限定在第一和第二薄层中的一个或两个中，并且相对于微腔布置电极，以便在向电极施加预定电压时在所述微腔内激发等离子体。用于形成微腔等离子体的方法也由优选的实施方案该方法包括在第一薄层上限定保护性聚合物的图案粉末喷射形成第一薄层中的半椭圆形微腔第二薄层连接到第一层。图案化可以光刻地进行，或者可以用简单的屏幕

3. 发明申请

WO2009055765A2 MICROCAVITY PLASMA DEVICES WITH NON-UNIFORM CROSS-SECTION MICROCAVITIES 审中-公开
标题翻译：具有非均匀性交叉显微镜的MICROCAVITY等离子体装置
公开(公告)号：WO2009055765A2
公开(公告)日：2009-04-30
申请号：PCT/US2008/081272
申请日：2008-10-27
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin , SOO, Kwang , PRICE, Andrew, J.
发明人： EDEN, J., Gary , PARK, Sung-Jin , SOO, Kwang , PRICE, Andrew, J.
IPC分类号： H01L29/02
CPC分类号： H01J11/18 , C25D11/12 , C25D11/26 , H01J9/241 , H01J61/82
摘要： An embodiment of the invention is an array of microcavity plasma devices having microcavities of non-uniform cross-section. The array includes a first electrode that is a thin metal foil or film including a plurality of non-uniform cross-section microcavities therein that are encapsulated in oxide. The invention provides for a continuous range of microcavity wall profiles to be fabricated, ranging from a linear taper to parabolic (bowl-shaped) cavities. A second electrode is a thin metal foil encapsulated in oxide that is bonded to the first electrode, the oxide preventing contact between the first and second electrodes. A packaging layer contains gas or vapor in the non-uniform cross- section microcavities. A method for forming an array of microcavity plasma devices begins with pre-anodizing a metal foil or thin film. Photoresist is patterned onto the anodized metal foil or film to encapsulate the anodized foil or film except on a top surface at desired positions of microcavities. A second anodization or electrochemical etching is conducted to form the non-uniform cross-section sidewall microcavities cavities. After removing photoresist and metal oxide, a final anodization lines the walls of the microcavities with metal oxide and fully encapsulates the metal electrodes with metal oxide.
摘要翻译：本发明的实施例是具有不均匀横截面的微腔的微腔等离子体装置的阵列。该阵列包括第一电极，该第一电极是薄的金属箔或膜，其中包含多个非均匀的横截面微腔，其被封装在氧化物中。本发明提供了要制造的连续范围的微腔壁轮廓，范围从线性锥形到抛物线（碗形）腔。第二电极是封装在氧化物中的薄金属箔，其结合到第一电极，防止第一和第二电极之间的氧化物接触。包装层在不均匀的横截面微腔中包含气体或蒸汽。用于形成微腔等离子体装置的阵列的方法开始于金属箔或薄膜的预阳极氧化。将光致抗蚀剂图案化到阳极氧化的金属箔或膜上以将阳极化箔或膜除外在微腔的所需位置处除了顶表面。进行第二阳极氧化或电化学蚀刻以形成不均匀的横截面侧壁微腔。在去除光致抗蚀剂和金属氧化物之后，用金属氧化物最终的阳极氧化将微腔的壁线引导，并用金属氧化物完全封装金属电极。

4. 发明申请

WO2012178177A2 MICROPLASMA JET DEVICES, ARRAYS, MEDICAL DEVICES AND METHODS 审中-公开
标题翻译： MICROPLASMA喷射装置，阵列，医疗装置和方法
公开(公告)号：WO2012178177A2
公开(公告)日：2012-12-27
申请号：PCT/US2012/044037
申请日：2012-06-25
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin , CHO, Jin, Hoon , MA, H., Jeffrey
发明人： EDEN, J., Gary , PARK, Sung-Jin , CHO, Jin, Hoon , MA, H., Jeffrey
IPC分类号： H05H1/24 , H05H1/30 , H05H1/34
CPC分类号： H01J37/32467 , H01J9/18 , H01J37/3244 , H01J37/32513 , H01J37/32568 , H05H1/2406 , H05H2001/2418 , H05H2001/2462
摘要： Preferred embodiments of the present invention include microplasma jet devices and arrays in various materials, and low temperature microplasma jet devices and arrays. These include preferred embodiment single microplasma jet devices and arrays of devices formed in monolithic polymer blocks with elongated microcavities. The arrays can be densely packed, for example having 100 jets in an area of a few square centimeters. Additional embodiments include metal/metal oxide microplasma jet devices that have micronozzles defined in the metal oxide itself. Methods of fabrication of microplasma jet devices are also provided by the invention, and the methods have been demonstrated as being capable of producing tailored micronozzle contours that are unitary with the material insulating electrodes.
摘要翻译：本发明的优选实施例包括各种材料中的微血管射流装置和阵列，以及低温微血浆喷射装置和阵列。这些包括优选的实施方案，单个微血浆喷射装置和在具有细长微腔的整体式聚合物嵌段中形成的装置阵列。阵列可以被密集地包装，例如在几平方厘米的区域中具有100个喷嘴。另外的实施方案包括在金属氧化物本身中具有微喷嘴的金属/金属氧化物微量喷射装置。本发明还提供了微型喷射装置的制造方法，并且已经证明这些方法能够产生与材料绝缘电极整体的定制的微型喷嘴轮廓。

5. 发明申请

WO2008153663A1 ARRAYS OF MICROCAVITY PLASMA DEVICES AND ELECTRODES WITH REDUCED MECHANICAL STRESS 审中-公开
标题翻译：具有降低机械应力的微波等离子体装置和电极阵列
公开(公告)号：WO2008153663A1
公开(公告)日：2008-12-18
申请号：PCT/US2008/006226
申请日：2008-05-15
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin
发明人： EDEN, J., Gary , PARK, Sung-Jin
IPC分类号： H01J17/49
CPC分类号： H01J11/18 , C25D11/26
摘要： An array of microcavity plasma devices include a plurality of thin metal first electrodes and stress reduction structures and/or geometries designed to promote the flatness during and after processing. The first electrodes are buried in a thin metal oxide layer which protects the electrodes from the plasma in the microcavities. In embodiments of the invention, some or all of the electrodes are connected. Patterns of connections in a one- or two- dimensional array of microcavities can be defined. The first electrodes comprise circumferential electrodes that surround individual microcavities. A second thin layer having a buried, second electrode is bonded to the first thin layer. A packaging layer seals the discharge medium into the microcavities. In a preferred methods of formation of arrays of microcavity plasma devices or electrodes, a thin metal foil or film is symmetrically anodized and formed with a stress reduction geometry and/or structures.
摘要翻译：微腔等离子体装置的阵列包括多个薄金属第一电极和设计成在加工期间和之后促进平坦度的应力减小结构和/或几何形状。第一电极被埋在薄的金属氧化物层中，其在微腔中保护电极免受等离子体的影响。在本发明的实施例中，部分或全部电极被连接。可以定义一维或二维微腔阵列中的连接模式。第一电极包括围绕各个微腔的圆周电极。具有埋置的第二电极的第二薄层被结合到第一薄层。包装层将排放介质密封到微腔中。在形成微腔等离子体器件或电极的阵列的优选方法中，薄金属箔或膜对称地阳极氧化并且具有应力减小几何形状和/或结构。

6. 发明申请

WO2012015943A2 ENCAPSULATED METAL MICROTIP MICROPLASMA DEVICES, ARRAYS AND FABRICATION METHODS 审中-公开
标题翻译：包埋金属微孔微波器件，阵列和制造方法
公开(公告)号：WO2012015943A2
公开(公告)日：2012-02-02
申请号：PCT/US2011/045564
申请日：2011-07-27
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin , YOON, JeKwon , CHUNG, Brian
发明人： EDEN, J., Gary , PARK, Sung-Jin , YOON, JeKwon , CHUNG, Brian
IPC分类号： H05H1/24 , B01D53/00 , C02F1/48 , C01B13/11
CPC分类号： H01T21/00 , B01D53/32 , B01D2257/104 , B01D2257/91 , B01D2258/06 , B01D2259/818 , C01B13/10 , C02F1/32 , C02F1/4608 , C02F1/46109 , C02F1/48 , C02F1/78 , C02F2001/46133 , C02F2001/46152 , C02F2303/04 , H05H1/2406 , H05H2001/2418 , H05H2245/121
摘要： An embodiment of the invention is a microtip microplasma device having a first metal microtip ( 12a, 50a) opposing a second metal microtip ( 12b, 50b) with a gap ( 16, 48) therebetween. The first and second metal microtips are encapsulated in metal oxide ( 14) that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays (62, 64, 66, 86, 92, 100) can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
摘要翻译：本发明的一个实施方案是具有与第二金属微尖端（12b，50b）相对的第一金属微尖端（12a，50a）的微尖端微型装置，其间具有间隙（16,48）。第一和第二金属微尖端被封装在金属氧化物（14）中，其电隔离并物理地连接第一和第二金属微尖端。在优选的装置中，第一和第二金属微尖端和金属氧化物包括整体的单一结构。阵列（62,64,66,86,92,100）可以是柔性的，可以以堆叠方式布置，并且可以形成为气瓶，例如用于气体和液体处理装置，空气过滤器和其它应用。形成微尖锐微量器件阵列的优选方法提供了金属网，其中具有微孔开口阵列。金属网的电极区域被掩蔽，留下金属网的计划连接的金属氧化物区域未被掩蔽。计算的连接金属氧化物区域进行电化学蚀刻，以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。去除面具。电化学蚀刻电极区域以将电极区域包封在金属氧化物中。

7. 发明申请

WO2007146279A3 LOW VOLTAGE MICROCAVITY PLASMA DEVICE AND ADDRESSABLE ARRAYS 审中-公开
公开(公告)号：WO2007146279A3
公开(公告)日：2007-12-21
申请号：PCT/US2007/013765
申请日：2007-06-12
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin , TCHERTCHIAN, Paul, A. , SUNG, Seung, Hoon
发明人： EDEN, J., Gary , PARK, Sung-Jin , TCHERTCHIAN, Paul, A. , SUNG, Seung, Hoon
IPC分类号： H01J17/49 , H01J61/09
摘要： Microcavity plasma devices and arrays of microcavity plasma devices are provided that have a reduced excitation voltage. A trigger electrode (28, 28a, 28b, 35a, 35b) disposed proximate to a microcavity (12) reduces the excitation voltage required between first and second electrodes (16, 18) to ignite a plasma in the microcavity when gas(es) or vapor(s) (or combinations thereof) are contained within the microcavity. The invention also provides symmetrical microplasma devices and arrays of microcavity plasma devices for which current waveforms are the same for each half-cycle of the voltage driving waveform. Additionally, the invention also provides devices that have standoff portions and voids that can reduce cross talk. The devices are preferably also used with a trigger electrode.

8. 发明申请

WO2007011388A2 MICRODISCHARGE DEVICES WITH ENCAPSULATED ELECTRODES AND METHOD OF MAKING 审中-公开
标题翻译：具有封装电极的微型扩大器装置和制造方法
公开(公告)号：WO2007011388A2
公开(公告)日：2007-01-25
申请号：PCT/US2005/035782
申请日：2005-10-04
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin
发明人： EDEN, J., Gary , PARK, Sung-Jin
IPC分类号： H01J61/04 , H01J17/04
CPC分类号： H01J17/04 , H01J9/02
摘要： An embodiment of the invention is a microdischarge device including a first electrode (230) encapsulated in a dielectric, which may be a nanoporous dielectric film. A second electrode (240) is provided which may also be encapsulated with a dielectric. The electrodes are configured to ignite a discharge in a microcavity when a time-varying (an AC, RF, bipolar or a pulsed DC, etc.) potential is applied between the electrodes. In specific embodiments of the invention, the second electrode may be a screen covering the microcavity opening and the microcavity may be closed at one end. In some embodiments of the invention, the second electrode may be in direct contact with the first electrode. In other embodiments, a gap separates the electrodes. In a preferred method of manufacturing microdischarge devices with encapsulated electrodes, a metal substrate is used to form a nanoporous dielectric encapsulated electrode and dissolve a portion of the dielectric layer. The dielectric layer is then anodized a second time, resulting in a nanoporous dielectric encapsulated electrode with improved regularity of the nanoscale dielectric structures. In some embodiments of the invention, the columnar voids in the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.
摘要翻译：本发明的一个实施例是一种微放电装置，其包括封装在电介质中的第一电极（230），所述电介质可以是纳米多孔介电膜。提供第二电极（240），其也可以用电介质封装。当在电极之间施加时变（AC，RF，双极或脉冲DC等）电势时，电极被配置为点燃微腔中的放电。在本发明的具体实施例中，第二电极可以是覆盖微腔开口的屏幕，并且微腔可以在一端封闭。在本发明的一些实施例中，第二电极可以与第一电极直接接触。在其他实施例中，间隙将电极分开。在制造具有封装电极的微放电器件的优选方法中，使用金属衬底来形成纳米多孔介电封装电极并溶解部分介电层。然后第二次阳极氧化电介质层，产生具有改进的纳米级电介质结构规则性的纳米多孔介电包封电极。在本发明的一些实施例中，电介质中的柱状空隙可以用一种或多种材料回填以进一步调整电介质的性质。

9. 发明申请

WO2007091993A2 PLASMA EXTRACTION MICROCAVITY PLASMA DEVIVE AND METHOD 审中-公开
标题翻译：等离子体萃取微波等离子体蒸馏和方法
公开(公告)号：WO2007091993A2
公开(公告)日：2007-08-16
申请号：PCT/US2006/003289
申请日：2006-01-31
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin
发明人： EDEN, J., Gary , PARK, Sung-Jin
CPC分类号： G01N21/73 , G01N21/6404 , H05H1/2406 , H05H2001/2412
摘要： A preferred embodiment plasma extraction microcavity plasma device generates a spatially-confined plasma in a gas or vapor, or gas and vapor mixture, including, for example, atmospheric pressure air. A microcavity plasma device is excited by a potential applied between excitation electrodes (16, 18, 42) of the microcavity plasma device, and a probe electrode (20) proximate the microcavity is maintained at the potential of one of the electrodes, extracts plasma from the microcavity plasma device. In preferred embodiments, the excitation electrodes of the microcavity plasma device are isolated from the plasma by dielectric (22, 24, 26), and time-varying (AC, RF, bipolar or pulsed DC, etc.) potential excites a plasma that is then extracted by the probe electrode. In alternate embodiments, the microcavity plasma device has an excitation electrode that contacts the plasma. A DC potential excites a plasma that is then extracted by the probe electrode.
摘要翻译：优选的实施方案等离子体提取微腔等离子体装置在气体或蒸汽或气体和蒸汽混合物中产生空间有限的等离子体，包括例如大气压的空气。微腔等离子体装置被施加在微腔等离子体装置的激发电极（16,18,42）之间的电位激发，并且靠近微腔的探针电极（20）保持在一个电极的电位上，从微腔等离子体装置。在优选实施例中，微腔等离子体装置的激发电极通过电介质（22,24,26）与等离子体隔离，时变（AC，RF，双极或脉冲DC等）电位激发等离子体然后由探针电极提取。在替代实施例中，微腔等离子体装置具有接触等离子体的激发电极。 DC电位激发等离子体，然后由探针电极提取。

10. 发明申请

WO2007087371A2 POLYMER MICROCAVITY AND MICROCHANNEL DEVICES AND FABRICATION METHOD 审中-公开
标题翻译：聚合物微波和微通道器件和制造方法
公开(公告)号：WO2007087371A2
公开(公告)日：2007-08-02
申请号：PCT/US2007/001951
申请日：2007-01-23
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, Gary, J. , PARK, Sung-Jin , LU, Meng
发明人： EDEN, Gary, J. , PARK, Sung-Jin , LU, Meng
IPC分类号： H01J17/49
CPC分类号： B29C35/02 , B29C65/70 , H01J9/245 , H01J11/18 , H01J65/046 , H05H1/2406 , H05H2001/2412
摘要： A microplasma device includes a substrate (12) and either or both of a microchannel (50) or microcavity (16) defined in a polymer layer (18) supported by the substrate. Electrodes (14, 24) arranged with respect to the polymer material can excite a plasma in a discharge medium contained in the microchannel or the microcavity or both. A method of forming a microplasma device places a curable polymer material between a mold having a negative volume impression of microcavities and/or microchannels and a substrate. The polymer is cured and then the mold is separated from the solid polymer.
摘要翻译：微型装置包括基板（12）以及限定在由基板支撑的聚合物层（18）中限定的微通道（50）或微腔（16）中的一个或两者。相对于聚合物材料布置的电极（14,24）可以在包含在微通道或微腔中的放电介质或两者中激发等离子体。形成微等离子体装置的方法将可固化的聚合物材料放置在具有负的体积的微腔和/或微通道的印模和基底之间。聚合物固化，然后将模具与固体聚合物分离。

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