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    • 1. 发明申请
    • APPARATUS FOR HIGH SIDE TRANSISTOR BRIDGE DRIVER
    • 用于高边界晶体管桥驱动器的装置
    • WO2014135209A1
    • 2014-09-12
    • PCT/EP2013/054526
    • 2013-03-06
    • SiEVATRONTELJ, JanezERGAVER, GregorPODRZAJ, JurijSESEK, Aleksander
    • TRONTELJ, JanezERGAVER, GregorPODRZAJ, JurijSESEK, Aleksander
    • H02M1/08H03K17/691
    • H02M1/082H03K17/691H03K2217/0063
    • The invention relates to a power stage of various products in power electronics. These products consists of half bridge or of full bridge switches configuration. Isolated drivers are used to control, monitor the performance of power switches, especially such drivers are required in power systems where switching at high voltages is performed. Some of the prior art solutions introduce different realizations of isolated drivers where some offers integrated control and safety features, features which offer a higher level of controlling of the switching devices (e.g. detecting faults, temperature measurements). This patent introduces a new method of isolation driver realization which comprises both isolation features and controlling signals for connected high voltage devices. Besides ensuring high galvanic isolation between the controlling circuit and driver the proposed solution also introduces a solution how required electrical energy for isolated driver power supply is provided. Both, transmission path (controlling signals) and power supply path from/to isolation driver is realized with coupled resonance circuit. This new method using coupled resonance circuit provides several advantages compared to known solutions.
    • 本发明涉及电力电子设备中的各种产品的功率级。 这些产品由半桥或全桥开关组成。 隔离驱动器用于控制,监控电源开关的性能,特别是在执行高电压切换的电力系统中需要这样的驱动器。 一些现有技术的解决方案引入了隔离驱动器的不同实现,其中一些提供集成的控制和安全特征,其提供开关装置的更高级别的控制(例如检测故障,温度测量)。 该专利引入了隔离驱动器实现的新方法,其包括隔离特征和用于连接的高压器件的控制信号。 除了确保控制电路和驱动器之间的高电隔离之外,所提出的解决方案还提供了一种解决方案,如何提供隔离驱动器电源所需的电能。 通过耦合谐振电路实现传输路径(控制信号)和/或隔离驱动器的电源路径。 使用耦合谐振电路的这种新方法与已知解决方案相比提供了几个优点
    • 2. 发明申请
    • POWER SWITCHING MODULE
    • 电源开关模块
    • WO2009093982A1
    • 2009-07-30
    • PCT/SI2008/000006
    • 2008-01-25
    • ISKRALAB D.O.O.TRONTELJ, JanezPODRZAJ, Jurij
    • TRONTELJ, JanezPODRZAJ, Jurij
    • H01L25/07
    • H01L25/072H01L25/18H01L2924/0002H01L2924/19105H01L2924/00
    • Improved constructions of power modules (1) for switching high power electrical loads are proposed. The modules consist of three constructive parts: a base plate (2), a top plate (4) and a three dimensionally structured interconnection network (3). The top plate carries capacitors (41,42) and contact areas. The base plate comprises control electronics, connectors and contact areas (201-206). It has good thermal conducting and high electrical isolating properties. The interconnection network (3) carries power semiconductor devices (e.g. MOSFET, IGBT) (3101,3111) and diodes (3102,3112). It is a folded network of bridging metal structures separated by air gaps. It comprises contacts for battery and power loads. Each conductive element (301,302, 313-316) contacts the base plate's contact areas and the capacitors in the top plate are contacted by the conductive structures for supply potential (301,302). These modules allow improved performance at lower amount of active components.
    • 提出了用于开关大功率电力负载的功率模块(1)的改进结构。 模块由三个结构部分组成:底板(2),顶板(4)和三维结构的互连网络(3)。 顶板带有电容器(41,42)和接触区域。 底板包括控制电子器件,连接器和接触区域(201-206)。 它具有良好的导热性和高电气隔离性能。 互连网络(3)承载功率半导体器件(例如,MOSFET,IGBT)(3101,3111)和二极管(3102,3112)。 它是由气隙分隔的桥接金属结构的折叠网络。 它包含电池和电源负载的触点。 每个导电元件(301,302,313-316)接触基板的接触区域,并且顶板中的电容器与导电结构接触以获得供电电位(301,302)。 这些模块可以在更少量的活动组件上提高性能。