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1. 发明申请

WO2005097882A1 THERMOSETTING COMPOSITION AND CURING METHOD THEREOF 审中-公开
标题翻译：热固化组合物及其固化方法
公开(公告)号：WO2005097882A1
公开(公告)日：2005-10-20
申请号：PCT/JP2005/007000
申请日：2005-04-05
申请人： SHOWA DENKO K.K. , KAMATA, Hirotoshi , KIMURA, Kazuya , UCHIDA, Hiroshi
发明人： KAMATA, Hirotoshi , KIMURA, Kazuya , UCHIDA, Hiroshi
IPC分类号： C08K5/00
CPC分类号： C08K5/3445 , C08L67/025 , C08L101/08 , C08L2666/02 , C09J167/025 , H05K3/287 , H05K3/4676 , C08L67/00
摘要： The invention relates to a thermosetting composition comprising (A) a compound having at least one oxetanyl group in the molecule, (B) a compound having at least two carboxyl groups in the molecule, and (C) an imidazolium salt, curing method thereof and products cured thereby. Cured products prepared from the composition of the invention are excellent in electrical isolation, flexibility, adhesiveness and mechanical strength.
摘要翻译：本发明涉及一种热固性组合物，其包含（A）分子中具有至少一个氧杂环丁烷基的化合物，（B）分子中具有至少两个羧基的化合物和（C）咪唑鎓盐，其固化方法和产品被固化。由本发明组合物制备的固化产品在电绝缘性，柔韧性，粘合性和机械强度方面是优异的。

2. 发明申请

WO2006093355A1 CARBOXYL GROUP-CONTAINING POLYURETHANE AND THERMOSETTING RESIN COMPOSITION USING THE SAME 审中-公开
标题翻译：含羧基的含聚氨酯和使用其的热固性树脂组合物
公开(公告)号：WO2006093355A1
公开(公告)日：2006-09-08
申请号：PCT/JP2006/304674
申请日：2006-03-03
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , KIMURA, Kazuya , SAKATA, Yuko
发明人： UCHIDA, Hiroshi , KIMURA, Kazuya , SAKATA, Yuko
IPC分类号： C08G18/44 , C08G18/66 , C08G18/28 , G03F7/035
CPC分类号： C08G18/44 , C08G18/0823 , C08G18/3212 , C08G18/672 , C08G18/73 , C08G18/757 , C08G18/758 , C08G18/7621 , C08G18/7642 , C08G59/4269 , C08L63/00 , C08L75/16 , C08G18/6659 , C08L2666/22
摘要： The invention relates to a carboxyl group-containing polyurethane, which is obtained by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol having a molecular weight of 300 to 50,000, (c) a dihydroxy compound having a carboxyl group and when necessary (d) a monohydroxy compound, a thermosetting composition using the carboxyl group-containing polyurethane and a paste for forming a film using thermosetting composition . The thermosetting composition of the invention is excellent in adhesion to a substrate, low warpage, flexibility, plating resistance and soldering heat resistance.
摘要翻译：本发明涉及含羧基的聚氨酯，其通过使（a）多异氰酸酯化合物，（b）分子量为300〜50,000的聚碳酸酯二醇，（c）具有羧基的二羟基化合物和必要的（d）单羟基化合物，使用含羧基的聚氨酯的热固性组合物和使用热固性组合物形成膜的糊剂。本发明的热固性组合物对基材的粘附性优异，翘曲性，柔韧性，耐电镀性和耐焊接性优异。

3. 发明申请

WO2006033439A1 HEAT-CURABLE URETHANE RESIN COMPOSITION 审中-公开
标题翻译：可热固化的URETHANE树脂组合物
公开(公告)号：WO2006033439A1
公开(公告)日：2006-03-30
申请号：PCT/JP2005/017659
申请日：2005-09-20
申请人： SHOWA DENKO K.K. , KIMURA, Kazuya , UCHIDA, Hiroshi
发明人： KIMURA, Kazuya , UCHIDA, Hiroshi
IPC分类号： C08G18/28
CPC分类号： H05K3/285 , C08G18/12 , C08G18/44 , C08G18/672 , C09D175/06 , C09D175/16 , H05K2203/124 , C08G18/281 , C08G18/6659 , C08G18/0823
摘要： The invention provides a heat-curable resin composition comprising (A) a polyurethane having two or more carboxyl groups in one molecule, in particular a polyurethane having one or more carboxyl groups at a molecular terminal and (B) a heat-curable component, a cured product thereof, a solder resist and a protective film consisting of the cured product and a printed wiring board coated with the cured product. The polyurethane(A), preferably has a number average molecular weight of 500 to 100, 000 and an acid value of 5 to 150 mgKOH/g. The heat-curable component (B) is preferably an epoxy resin. The heat-curable resin composition of the invention is excellent in adhesion with a substrate, low-warpage property, flexibility, resistance to moisture and heat, soldering heat resistance and resistance to tin plating.
摘要翻译：本发明提供一种热固性树脂组合物，其包含（A）在一个分子中具有两个或更多个羧基的聚氨酯，特别是在分子末端具有一个或多个羧基的聚氨酯和（B）可热固化组分，其固化产物，阻焊剂和由固化产物组成的保护膜和涂覆有固化产物的印刷线路板。聚氨酯（A）的数均分子量优选为500〜100,000，酸值为5〜150mgKOH / g。可热固化成分（B）优选为环氧树脂。本发明的热固性树脂组合物与基材的粘合性优异，翘曲性，柔软性，耐湿热性，耐焊接性，耐镀锡性优异。

4. 发明申请

WO2007043536A2 HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER 审中-公开
标题翻译：可固化树脂组合物，包括硅酮粉
公开(公告)号：WO2007043536A2
公开(公告)日：2007-04-19
申请号：PCT/JP2006/320233
申请日：2006-10-04
申请人： SHOWA DENKO K.K. , KIMURA, Kazuya , UCHIDA, Hiroshi
发明人： KIMURA, Kazuya , UCHIDA, Hiroshi
IPC分类号： C08G18/08 , C08L75/04
CPC分类号： H05K3/285 , C08G18/0823 , C08G18/0852 , C08G18/12 , C08G18/348 , C08G18/44 , C08G18/6659 , C08G18/758 , C08L75/04 , H05K2201/0162 , H05K2201/0212 , C08G18/282 , C08L2666/14
摘要： A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01 to 10 mm. The heat-curable resin (A) preferably includes a carboxyl group-containing polyurethane and a heat-curable component. The carboxyl group-containing polyurethane is obtained by reacting a polyisocyanate compound (a), a polyol compound (b) (other than compound (c)), and a carboxyl group-containing dihydroxy compound (c).
摘要翻译：热固性树脂组合物具有优异的印刷性，非粘性，无光泽和电性能。热固性树脂组合物包含热固性树脂（A）和硅氧烷粉末（B）。优选地，硅氧烷粉末（B）是球形或基本上球形的，比重为0.95至1.5，粒径为0.01至10mm。热固性树脂（A）优选包含含羧基的聚氨酯和可热固化组分。含羧基的聚氨酯通过使多异氰酸酯化合物（a），多元醇化合物（b）（化合物（c）以外）与含羧基的二羟基化合物（c）反应而得到。

5. 发明申请

WO2006123804A1 CARBOXYL GROUP-CONTAINING POLYURETHANE, HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：含羧基的聚氨酯，可固化树脂组合物及其用途
公开(公告)号：WO2006123804A1
公开(公告)日：2006-11-23
申请号：PCT/JP2006/310084
申请日：2006-05-16
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , HIRAKAWA, Ritsuko , MIYAJIMA, Yoshio , INOUE, Hirofumi , KIMURA, Kazuya , AZUMA, Yukihiko
发明人： UCHIDA, Hiroshi , HIRAKAWA, Ritsuko , MIYAJIMA, Yoshio , INOUE, Hirofumi , KIMURA, Kazuya , AZUMA, Yukihiko
IPC分类号： C08G18/65 , C08G18/34 , C08G18/62 , C08G18/08
CPC分类号： H05K3/285 , C08G18/0823 , C08G18/348 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G18/69 , C08G18/698 , C09D11/106 , C09D175/04 , H05K1/0393
摘要： Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol% (relative to the total (100 mol%) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.
摘要翻译：公开了由多元醇（b）生成的含有羧基的聚氨酯（A），该多元醇（b）含有多元醇（b1）的至少10摩尔％（相对于多元醇（b）的总量（100摩尔％））为：（ i）数均分子量为500〜50,000; （ii）每分子具有1至10个羟基; 和（iii）是选自聚丁二烯多元醇，聚异戊二烯多元醇，氢化聚丁二烯多元醇和氢化聚异戊二烯多元醇的一种或两种以上的多元醇的组合。含羧基的聚氨酯（A）适合作为与基材的粘合性优异，翘曲翘曲，柔韧性，耐电镀性，焊接耐热性，长期可靠性等固化物例如固化膜的材料。

6. 发明申请

WO2007142248A1 NOVEL EPOXY COMPOUNDS AND PROCESS FOR THEIR PRODUCTION 审中-公开
标题翻译：新型环氧化合物及其生产方法
公开(公告)号：WO2007142248A1
公开(公告)日：2007-12-13
申请号：PCT/JP2007/061398
申请日：2007-05-30
申请人： SHOWA DENKO K.K. , SASAKI, Nobutoshi , FUJITA, Toshio , UCHIDA, Hiroshi
发明人： SASAKI, Nobutoshi , FUJITA, Toshio , UCHIDA, Hiroshi
IPC分类号： C08G59/30 , C08G77/388
CPC分类号： C08G59/306 , C08G77/388
摘要： Novel epoxy compounds represented by the general formula (I) (wherein R 1 and R 2 each represent hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, each R 3 may be the same or different and each independently represents hydrogen, alkyl, aryl, aralkyl, alkenyl or fluoroalkyl, and n is 0 or a positive integer), and the general formula (II) (wherein R 3 represents the same groups specified above, R 4 represents hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, and n is 0 or a positive integer), and a process for their production.
摘要翻译：由通式（I）表示的新型环氧化合物（其中R 1和R 2各自表示氢，C 1-6烷基或C 1-4三烷基甲硅烷基，每个R 3可以相同或不同，并且各自独立地表示氢，烷基，芳基，芳烷基，烯基或氟烷基，n为0或正整数）和通式（II）（其中R 3表示与上述相同的基团，R 4表示氢，C 1-6烷基或C 1-4三烷基甲硅烷基，n为0或正整数），以及它们的生产过程。

7. 发明申请

WO2007108550A1 RESIN COMPOSITION 审中-公开
标题翻译：树脂组合物
公开(公告)号：WO2007108550A1
公开(公告)日：2007-09-27
申请号：PCT/JP2007/056131
申请日：2007-03-16
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , INOUE, Hirofumi
发明人： UCHIDA, Hiroshi , INOUE, Hirofumi
IPC分类号： C09D7/12 , C09D7/06
CPC分类号： H05K3/285 , C08L71/03 , C09D7/47 , C09D7/65 , C09D11/52 , H05K2201/015 , H05K2201/0209 , H05K2201/0212
摘要： The invention relates to a thermosetting resin composition comprising (A) 20 to 90 mass% of thermosetting resin, (B)IO to 80 mass% of inorganic and/or organic fine particles and (C) 0.1 to 5 mass% of fluorine-containing polyether, wherein (C) is polymer having fluorinated alkyl polyoxetane structure of formula (1) or (2) (m is an integer of 1 to 100, n is an integer of 1 to 6, R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R 2 and R 3 each represent a straight or branched chain alkyl group having 1 to 20 carbon atoms, with a proviso that at least 50% of hydrogen atoms present in the alkyl group is substituted by fluorine and the other hydrogen atoms are substituted by hydrogen, iodine, chlorine or bromine atoms) or a composition containing copolymer which consists of monomer having fluorinated alkyl polyoxetane structure and oxygen-containing monomer having 2 to 6 carbon atoms .
摘要翻译：本发明涉及一种热固性树脂组合物，其包含（A）20-90质量％的热固性树脂，（B）10至80质量％的无机和/或有机细颗粒和（C）0.1至5质量％的含氟聚醚，其中（C）为具有式（1）或（2）的氟化烷基聚氧杂环丁烷结构的聚合物（m为1〜100的整数，n为1〜6的整数，R 1〜表示氢原子或碳原子数1〜6的烷基，R 2和R 3各自表示碳原子数1〜20的直链或支链烷基，条件是存在于烷基中的至少50％的氢原子被氟取代，其他氢原子被氢，碘，氯或溴原子取代）或含有共聚物的组合物，其由具有氟化烷基聚氧杂环丁烷的单体组成结构和含2-6个碳原子的含氧单体。

8. 发明申请

WO2007105781A1 THERMOSETTING RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：热固性树脂组合物及其用途
公开(公告)号：WO2007105781A1
公开(公告)日：2007-09-20
申请号：PCT/JP2007/055158
申请日：2007-03-08
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , UMEZAWA, Tomokazu
发明人： UCHIDA, Hiroshi , UMEZAWA, Tomokazu
IPC分类号： C08L75/04 , C08G18/08 , C08G18/44 , C08G18/69 , C08G18/75 , C08G59/42
CPC分类号： C08G18/758 , C08G18/0823 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G59/4269 , C08K3/016 , C08K5/5313 , C08L63/00 , C08L75/04 , H05K3/285 , H05K2201/012 , H05K2201/0212 , C08L2666/14 , C08L2666/22
摘要： The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.
摘要翻译：根据本发明的热固性树脂组合物和阻焊油墨的特征在于包括：包含（A1）含有酸酐基和/或羧基的化合物的热固性树脂（A）和（A2）具有与上述（A1）反应的官能团和含有磷原子的有机填料（B），其中，含有磷原子的有机填料（B）的平均粒径为50μm以下。根据本发明，能够以低成本和高生产率提供的是具有能够形成固化材料的优异的热固性树脂组合物和阻焊油墨，其能够实现与基材的粘合性，低翘曲性，柔软性，电镀电阻，焊料耐热性和长期可靠性以及阻燃性，以及上述特性优异的固化材料和保护膜。此外，可以提供具有阻燃性优异且可靠性高的保护膜的电子部件。

9. 发明申请

WO2008099903A2 FINE PATTERN TRANSFER MATERIAL 审中-公开
标题翻译：精细图案转印材料
公开(公告)号：WO2008099903A2
公开(公告)日：2008-08-21
申请号：PCT/JP2008/052476
申请日：2008-02-07
申请人： SHOWA DENKO K.K. , FUJITA, Toshio , UCHIDA, Hiroshi , MORINAKA, Katsutoshi , HIROSE, Katsumasa
发明人： FUJITA, Toshio , UCHIDA, Hiroshi , MORINAKA, Katsutoshi , HIROSE, Katsumasa
IPC分类号： G03F7/00 , G03F7/075
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G11B5/855
摘要： [Purpose] To provide a transfer material that can favorably form a fine pattern by nanoimprinting. [Resolution Means] The nanoimprinting transfer material is a fine pattern resin composition that includes an organosilicon compound and a metal compound of a metal from groups 3 through 14 of the periodic table.
摘要翻译： [目的]提供可以通过纳米压印有利地形成精细图案的转印材料。分辨方法纳米压印转印材料是包含有机硅化合物和周期表第3〜14族金属的金属化合物的精细图案树脂组合物。

10. 发明申请

WO2007066816A1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION SOLUTION, FILM FORMING MATERIAL AND THEIR CURED PRODUCT 审中-公开
标题翻译：热固性树脂组合物，热固性树脂组合物溶液，成膜材料及其固化产品
公开(公告)号：WO2007066816A1
公开(公告)日：2007-06-14
申请号：PCT/JP2006/324887
申请日：2006-12-07
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , AZUMA, Ritsuko
发明人： UCHIDA, Hiroshi , AZUMA, Ritsuko
IPC分类号： C08G18/08 , C08G18/69 , C08G18/65 , C08G18/44 , C09D175/04 , C08L63/00
CPC分类号： C09D175/14 , C08G18/0823 , C08G18/12 , C08G18/44 , C08G18/4854 , C08G18/61 , C08G18/6576 , C08G18/69 , C08G18/698 , C08G18/758 , C08G59/423 , C08L63/00 , C08L75/04 , H05K1/0393 , H05K3/285 , H05K2203/124 , C08G18/6692 , C08G18/6659 , C08L2666/20
摘要： Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.
摘要翻译：公开了一种热固性树脂组合物，其包含：（A）通过使用（a）多异氰酸酯化合物（b）多元醇化合物（c），含羧基的二羟基化合物作为原料制备的含羧基的聚氨酯，（B）固化剂，其中多元醇化合物（b ）是选自组（I）的一种或多种多元醇化合物和选自组（II）的一种或多种多元醇化合物; 组I：聚碳酸酯多元醇，聚醚多元醇，聚酯多元醇和聚内酯多元醇，组II：聚丁二烯多元醇，具有末端羟基的聚硅氧烷，以及仅具有羟基的碳原子数为18〜72的多元醇和氧原子。热固性树脂组合物可以提供柔性印刷电路用保护膜，该保护膜具有优异的电绝缘性，长期可靠的电绝缘性，柔软性和低硬化收缩翘曲性，特别是低粘性。

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