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    • 3. 发明申请
    • FLAME-RETARDANT COMPOSITION FOR SOLDER RESIST AND CURED PRODUCT THEREOF
    • 用于焊接电阻的阻燃组合物及其固化产品
    • WO2006106892A1
    • 2006-10-12
    • PCT/JP2006/306767
    • 2006-03-24
    • SHOWA DENKO K.K.MIYAJIMA, Yoshio
    • MIYAJIMA, Yoshio
    • G03F7/038G03F7/035G03F7/032
    • G03F7/032G03F7/0047G03F7/035G03F7/038G03F7/0388H05K3/287Y10T428/31511
    • There is provided a flame retardant composition for a solder resist which is halogen-free and has a high level of flame retardance and flexibility, while exhibiting excellent heat resistance, moisture resistance and high-temperature reliability. The flame retardant composition for a solder resist according to the invention comprises (A) an alkali-soluble resin comprising either or both (A1) a carboxyl group-containing epoxy (meth)acrylate or (A2) a carboxyl group-containing urethane (meth)acrylate obtained by reacting an epoxy resin with two or more epoxy groups in the molecule (a), an unsaturated group-containing monocarboxylic acid (b) and a polybasic acid anhydride (c), (B) a compound having an ethylenic unsaturated group in the molecule, (C) a photopolymerization initiator, (D) a phosphorus-containing epoxy resin having a specific structure and (E) a hydrated metal compound. The composition of the invention can be suitably used as a solder resist or cover lay film for an FPC.
    • 本发明提供阻燃剂的阻燃剂组合物,其为无卤素且具有高水平的阻燃性和柔韧性,同时具有优异的耐热性,耐湿性和高温可靠性。 根据本发明的阻焊剂用阻燃剂组合物包含(A)包含(A1)含羧基的环氧(甲基)丙烯酸酯或(A2)含羧基的氨基甲酸酯(甲基)丙烯酸酯中的任一种或两者的碱溶性树脂 )丙烯酸酯通过环氧树脂与分子(a)中的两个或更多个环氧基反应获得,不饱和基团的一元羧酸(b)和多元酸酐(c),(B)具有烯属不饱和基团 在分子中,(C)光聚合引发剂,(D)具有特定结构的含磷环氧树脂和(E)水合金属化合物。 本发明的组合物可以适合用作FPC的阻焊层或覆盖膜。