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    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • WO2011068016A1
    • 2011-06-09
    • PCT/JP2010/070061
    • 2010-11-04
    • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.YAMAZAKI, ShunpeiKAWAE, DaisukeGODO, Hiromichi
    • YAMAZAKI, ShunpeiKAWAE, DaisukeGODO, Hiromichi
    • H01L29/786H01L21/28H01L21/8238H01L27/08H01L27/092H01L29/417
    • H01L29/45H01L27/1225H01L29/7869
    • One object is to provide a p-channel transistor including an oxide semiconductor. Another object is to provide a complementary metal oxide semiconductor (CMOS) structure of an n-channel transistor including an oxide semiconductor and a p-channel transistor including an oxide semiconductor. A p-channel transistor including an oxide semiconductor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, and a source and drain electrode layers in contact with the oxide semiconductor layer. When the electron affinity and the band gap of an oxide semiconductor used for the oxide semiconductor layer in the semiconductor device, respectively, are ϰ (eV) and E g (eV), the work function ( ϕ m ) of the conductor used for the source electrode layer and the drain electrode layer satisfies ϕ m >ϰ+E g /2 and the barrier for holes ( ϕ Bp ) represented by ( ϰ+E g - ϕ m ) is less than 0.25 eV.
    • 一个目的是提供一种包括氧化物半导体的p沟道晶体管。 另一个目的是提供包括氧化物半导体的n沟道晶体管和包括氧化物半导体的p沟道晶体管的互补金属氧化物半导体(CMOS)结构。 包括氧化物半导体的p沟道晶体管包括与氧化物半导体层接触的栅极电极层,栅极绝缘层,氧化物半导体层以及源极和漏极电极层。 当半导体器件中用于氧化物半导体层的氧化物半导体的电子亲和力和带隙分别为 (eV)和Eg(eV)时,用于源电极层和漏电极层的导体的功函数(Δm)满足θ m +β+ Eg / 2,由(α+ Eg-Δm)表示的空穴阻挡层(ΔBp)小于0.25eV。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • WO2011062057A1
    • 2011-05-26
    • PCT/JP2010/069545
    • 2010-10-27
    • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.YAMAZAKI, ShunpeiKAWAE, Daisuke
    • YAMAZAKI, ShunpeiKAWAE, Daisuke
    • H01L29/786H01L21/336
    • H01L29/7869H01L27/1225H01L29/42392H01L29/78606H01L29/78642H01L29/78696
    • Provided is a semiconductor device for high power application including a novel semiconductor material with high productivity. Alternatively, provided is a semiconductor device having a novel structure in which the novel semiconductor material is used. Provided is a vertical transistor including a channel formation region formed using an oxide semiconductor which has a wider band gap than a silicon semiconductor and is an intrinsic semiconductor or a substantially intrinsic semiconductor with impurities that can serve as electron donors (donors) in the oxide semiconductor removed. The thickness of the oxide semiconductor is greater than or equal to 1 m, preferably greater than 3 m, more preferably greater than or equal to 10 m, and end portions of one of electrodes that are in contact with the oxide semiconductor is placed inside end portions of the oxide semiconductor.
    • 提供了一种用于高功率应用的半导体器件,包括具有高生产率的新型半导体材料。 或者,提供了具有其中使用新型半导体材料的新颖结构的半导体器件。 提供了一种垂直晶体管,其包括使用具有比硅半导体更宽的带隙的氧化物半导体形成的沟道形成区,并且是本征半导体或具有可用作氧化物半导体中的电子给体(供体)的杂质的本质半导体 除去。 氧化物半导体的厚度大于或等于1μm,优选大于3μm,更优选大于或等于10μm,并且与氧化物半导体接触的电极中的一个的端部位于内侧 部分氧化物半导体。