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1. 发明申请

WO2022081682A1 VERTICAL INTERCONNECT SYSTEM FOR HIGH-SPEED DATA TRANSMISSION 审中-公开
公开(公告)号：WO2022081682A1
公开(公告)日：2022-04-21
申请号：PCT/US2021/054745
申请日：2021-10-13
申请人： SAMTEC, INC.
发明人： ZBINDEN, Eric
IPC分类号： G02B6/42
摘要： A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

2. 发明申请

WO2019060817A2 OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING 审中-公开
公开(公告)号：WO2019060817A2
公开(公告)日：2019-03-28
申请号：PCT/US2018/052402
申请日：2018-09-24
申请人： SAMTEC INC.
发明人： ZBINDEN, Eric
IPC分类号： G02B6/122
摘要： An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

3. 发明申请

WO2013006499A3 TRANSCEIVER AND INTERFACE FOR IC PACKAGE 审中-公开
公开(公告)号：WO2013006499A3
公开(公告)日：2013-01-10
申请号：PCT/US2012/045127
申请日：2012-06-29
申请人： SAMTEC, INC. , ZBINDEN, Eric , MUSSER, Randall , VERDIELL, Jean-Marc André , MONGOLD, John , VICICH, Brian , GUETIG, Keith
发明人： ZBINDEN, Eric , MUSSER, Randall , VERDIELL, Jean-Marc André , MONGOLD, John , VICICH, Brian , GUETIG, Keith
IPC分类号： H01R12/71 , H01R24/58
摘要： An interconnect system includes a first circuit board (18), first (14) and second (18a) connectors connected to the first circuit board (18), and a transceiver (15) including an optical engine (15a) and arranged to receive and transmit electrical and optical signals through a cable (16), to convert optical signals received from the cable (16) into electrical signals, and to convert electrical signals received from the first connector (14) into optical signals to be transmitted through the cable (16). The transceiver (15) is arranged to mate with the first (14) and second (18a) connectors so that at least some converted electrical signals are transmitted to the first connector (14) and so that at least some electrical signals received from the cable (16) are transmitted to the second connector (18a).

4. 发明申请

WO2019099447A3 DATA COMMUNICATION SYSTEM 审中-公开
公开(公告)号：WO2019099447A3
公开(公告)日：2019-05-23
申请号：PCT/US2018/060923
申请日：2018-11-14
申请人： SAMTEC INC.
发明人： ZBINDEN, Eric , SHAH, Jignesh, H.
IPC分类号： G02B6/38
摘要： A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

5. 发明申请

WO2019099447A2 DATA COMMUNICATION SYSTEM 审中-公开
公开(公告)号：WO2019099447A2
公开(公告)日：2019-05-23
申请号：PCT/US2018/060923
申请日：2018-11-14
申请人： SAMTEC INC.
发明人： ZBINDEN, Eric , SHAH, Jignesh, H.
摘要： A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

6. 发明申请

WO2015200553A1 CONNECTOR ASSEMBLY 审中-公开
标题翻译：连接器总成
公开(公告)号：WO2015200553A1
公开(公告)日：2015-12-30
申请号：PCT/US2015/037539
申请日：2015-06-24
申请人： SAMTEC, INC.
发明人： ZBINDEN, Eric , MONGOLD, John Allen
IPC分类号： H01R12/79 , H01R13/629 , H01R13/639
CPC分类号： G02B6/4249 , G02B6/3879 , G02B6/3897 , G02B6/4269 , G02B6/4292
摘要： A system includes a substrate including a first row of first receptacles, a cradle including an opening and a spring member, connectors located within the opening, and cables connected to the connectors. The cradle is configured to connect each of the connectors simultaneously or nearly simultaneously to a corresponding first, and the spring member pushes on the connectors with a force greater than an insertion force of the first receptacle.
摘要翻译：一种系统包括：基板，包括第一排第一插座，支架，包括开口和弹簧构件，位于开口内的连接器以及连接到连接器的电缆。支架被构造成将每个连接器同时或几乎同时地连接到相应的第一个，并且弹簧构件以大于第一容器的插入力的力推动连接器。

7. 发明申请

WO2018191248A1 INTERCONNECT SYSTEM HAVING RETENTION FEATURES 审中-公开
公开(公告)号：WO2018191248A1
公开(公告)日：2018-10-18
申请号：PCT/US2018/026860
申请日：2018-04-10
申请人： SAMTEC INC.
发明人： BETTMAN, R., Brad , PARKES, Liam , ZBINDEN, Eric , GUETIG, Keith , SHAH, Jignesh, H. , WILLIAMS BARNETT, Jean, Karlo , FAITH, Chadrick, Paul
IPC分类号： G02B6/42 , G02B6/36
摘要： Interconnect systems having anti-backout latches and securement members are disclosed.

8. 发明申请

WO2018081398A1 INTERCONNECT MODULE FOR BOTH PANEL AND MID BOARD MOUNTING 审中-公开
标题翻译：互连模块用于面板和中间板的安装
公开(公告)号：WO2018081398A1
公开(公告)日：2018-05-03
申请号：PCT/US2017/058493
申请日：2017-10-26
申请人： SAMTEC INC.
发明人： SHAH, Jignesh , WILLIAMS BARNETT, Jean Karlo , ZBINDEN, Eric
IPC分类号： H01R12/51 , H01R13/24 , H01R13/629
摘要： An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.
摘要翻译：诸如收发器的互连模块被配置为与包括第一和第二电连接器的主模块配对。互连模块包括彼此间隔开的第一和第二多个焊盘。互连模块可以与主机模块配合，使得第一焊盘与第一电连接器配合，并且第二焊盘与第二电连接器配合。当互连模块与主机模块配合时，第一焊盘可以越过第二电连接器的电触点的配合区域而不擦拭配合区域。互连模块可用于前面板安装和中板安装应用。

9. 发明申请

WO2022081683A1 VERTICAL INSERTION INTERCONNECTION SYSTEM WITH RING CONNECTOR FOR HIGH-SPEED DATA TRANSMISSION 审中-公开
公开(公告)号：WO2022081683A1
公开(公告)日：2022-04-21
申请号：PCT/US2021/054749
申请日：2021-10-13
申请人： SAMTEC, INC.
发明人： ZBINDEN, Eric
IPC分类号： H01R12/88 , H01R13/11 , H01R12/71
摘要： An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

10. 发明申请

WO2020028737A1 TRANSCEIVER LATCH AND THERMAL BRIDGE 审中-公开
公开(公告)号：WO2020028737A1
公开(公告)日：2020-02-06
申请号：PCT/US2019/044773
申请日：2019-08-02
申请人： SAMTEC, INC.
发明人： BETTMAN, R., Brad , CARMONA ARAYA, Josue, Alfredo , NIGHTINGALE, John, Lawrence , WILLIAMS BARNETT, Jean Carlo , ZBINDEN, Eric
IPC分类号： G02B6/42
摘要： A variety of methods and arrangements for latching a transceiver to a host printed circuit board (PCB) are described. The transceiver is secured to its electrical sockets by a latch that does not extend or only minimally extends beyond the transceiver footprint and height. In some embodiments the latch includes a thermal bridge that provides a heat transfer path between the transceiver and host substrate.

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