专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2013006499A3 TRANSCEIVER AND INTERFACE FOR IC PACKAGE 审中-公开
公开(公告)号：WO2013006499A3
公开(公告)日：2013-01-10
申请号：PCT/US2012/045127
申请日：2012-06-29
申请人： SAMTEC, INC. , ZBINDEN, Eric , MUSSER, Randall , VERDIELL, Jean-Marc André , MONGOLD, John , VICICH, Brian , GUETIG, Keith
发明人： ZBINDEN, Eric , MUSSER, Randall , VERDIELL, Jean-Marc André , MONGOLD, John , VICICH, Brian , GUETIG, Keith
IPC分类号： H01R12/71 , H01R24/58
摘要： An interconnect system includes a first circuit board (18), first (14) and second (18a) connectors connected to the first circuit board (18), and a transceiver (15) including an optical engine (15a) and arranged to receive and transmit electrical and optical signals through a cable (16), to convert optical signals received from the cable (16) into electrical signals, and to convert electrical signals received from the first connector (14) into optical signals to be transmitted through the cable (16). The transceiver (15) is arranged to mate with the first (14) and second (18a) connectors so that at least some converted electrical signals are transmitted to the first connector (14) and so that at least some electrical signals received from the cable (16) are transmitted to the second connector (18a).

2. 发明申请

WO2013006499A2 TRANSCEIVER AND INTERFACE FOR IC PACKAGE 审中-公开
标题翻译： IC封装的收发器和接口
公开(公告)号：WO2013006499A2
公开(公告)日：2013-01-10
申请号：PCT/US2012045127
申请日：2012-06-29
申请人： SAMTEC INC , ZBINDEN ERIC , MUSSER RANDALL , VERDIELL JEAN-MARC ANDRE , MONGOLD JOHN , VICICH BRIAN , GUETIG KEITH
发明人： ZBINDEN ERIC , MUSSER RANDALL , VERDIELL JEAN-MARC ANDRE , MONGOLD JOHN , VICICH BRIAN , GUETIG KEITH
CPC分类号： G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
摘要： An interconnect system includes a first circuit board (18), first (14) and second (18a) connectors connected to the first circuit board (18), and a transceiver (15) including an optical engine (15a) and arranged to receive and transmit electrical and optical signals through a cable (16), to convert optical signals received from the cable (16) into electrical signals, and to convert electrical signals received from the first connector (14) into optical signals to be transmitted through the cable (16). The transceiver (15) is arranged to mate with the first (14) and second (18a) connectors so that at least some converted electrical signals are transmitted to the first connector (14) and so that at least some electrical signals received from the cable (16) are transmitted to the second connector (18a).
摘要翻译：互连系统包括连接到第一电路板（18）的第一电路板（18），第一（14）和第二（18a）连接器，以及包括光学引擎（15a）的收发器（15）通过电缆（16）传输电和光信号，以将从电缆（16）接收的光信号转换为电信号，并将从第一连接器（14）接收的电信号转换成光信号以通过电缆（ 16）。收发器（15）布置成与第一（14）和第二（18a）连接器配合，使得至少一些转换的电信号被传输到第一连接器（14），并且使得从电缆接收的至少一些电信号（16）被传送到第二连接器（18a）。

3. 发明申请

WO2005066680A1 ETALON POSITIONING USING SOLDER BALLS 审中-公开
标题翻译： ETALON定位使用焊枪
公开(公告)号：WO2005066680A1
公开(公告)日：2005-07-21
申请号：PCT/US2004/041550
申请日：2004-12-08
申请人： INTEL CORPORATION , ZBINDEN, Eric , EPITAUX, Marc , NIM, Tea
发明人： ZBINDEN, Eric , EPITAUX, Marc , NIM, Tea
IPC分类号： G02B7/00
CPC分类号： G02B7/006 , G02B6/4206 , G02B6/4238 , Y10T29/49769
摘要： Two etalons (10, 12) in series may be angled to reduce parasitic reflections in the space between the two. The etalons (10, 12) may be soldered on either side of a post (30) having an aperture (23) there through to allow light to pass. Various sized solder balls (38, 40) and/or solder pads (62) may be used to create the desired angle and to secure the etalons (10, 12) to the post (30). Alternatively, a lip (52) on the post may create the desired angle. Once secured to the post (30), rather than aligning the etalons by pick and place methods individually, the post (30) and attached etalons (10, 12) may be secured as a single unit to an optical system, such as within the cavity of an external cavity diode laser (ECDL).
摘要翻译：串联的两个标准具（10,12）可以成角度以减少两者之间的空间中的寄生反射。标准具（10,12）可以在其上具有孔（23）的柱（30）的任一侧焊接，以允许光通过。可以使用各种尺寸的焊球（38,40）和/或焊盘（62）来产生所需的角度并将标准具（10,12）固定到柱（30）上。或者，柱上的唇缘（52）可产生所需的角度。一旦固定到柱（30），而不是单独地通过拾取和放置方法对准标准具，则可以将柱（30）和附接的标准具（10,12）作为单个单元固定到光学系统，例如在外腔二极管激光器（ECDL）的腔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式