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    • 5. 发明申请
    • LOW COST, HIGH STRENGTH ELECTRONICS MODULE FOR AIRBORNE OBJECT
    • 低成本,高强度电子模块用于AIRBORNE对象
    • WO2011014287A3
    • 2011-04-07
    • PCT/US2010034383
    • 2010-05-11
    • RAYTHEON COGESWENDER CHRIS E
    • GESWENDER CHRIS E
    • H05K7/14
    • H05K1/144F42B15/08F42B30/006F42C19/06H05K7/1434H05K2201/09027H05K2201/10378H05K2201/2018
    • An electronics module is provided for utilization on board an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive interconnect structure. The supportive interconnect structure includes a substantially annular insulative body and a plurality of vias. The substantially annular insulative body extends around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB. The plurality of vias is formed through the substantially annular insulative body and electrically couples the first PCB to the second PCB.
    • 提供电子模块用于机载物体上的利用。 在一个实施例中,电子模块包括其中具有空腔的壳体,设置在空腔中的第一印刷电路板(PCB),布置在第一PCB上方的空腔中的第二PCB以及支撑互连结构。 支撑互连结构包括基本环形的绝缘体和多个通孔。 基本上环形的绝缘体围绕第一PCB和第二PCB之间的壳体的内圆周部分延伸以支撑第二PCB并使第二PCB从第一PCB轴向空间。 多个通孔通过大体上环形的绝缘体形成,并将第一PCB电耦合到第二PCB。