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1. 发明申请

WO2011069844A2 METHOD FOR CONTACTING A LIGHTING DEVICE, TOOL FOR PERFORMING THE METHOD AND CONNECTION ELEMENT FOR ATTACHMENT ON A LIGHTING DEVICE 审中-公开
标题翻译：方法用于联系的照明设备，工具，实施过程和连接元件用于连接到照明灯装置
公开(公告)号：WO2011069844A2
公开(公告)日：2011-06-16
申请号：PCT/EP2010068315
申请日：2010-11-26
申请人： OSRAM GMBH , KAMPFRATH ANDREAS , STRAUSS STEFFEN
发明人： KAMPFRATH ANDREAS , STRAUSS STEFFEN
IPC分类号： F21S4/00
CPC分类号： F21S6/001 , F21S4/10 , F21V23/04 , F21V23/06 , F21V31/04 , F21Y2115/10 , H05K1/118 , H05K3/0052 , H05K3/28 , H05K3/325 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , H05K2203/0195 , H05K2203/1322 , Y10T29/49105 , Y10T29/49124 , Y10T29/49128 , Y10T29/49155 , Y10T29/49169 , Y10T29/49798
摘要： The invention relates to a method serving to bond a lighting device, wherein the lighting device has a circuit board which is covered by a sealing compound layer and can be separated at a separating point into two lighting device sections and each of the lighting device sections each has at least one electrical contact adjacent to the separating point; wherein the method comprises at least the following steps: removing of at least the sealing compound layer on both sides of the separating point beyond the adjacent contacts of the lighting device sections so that the contacts remain covered by a thinner, remaining sealing compound layer; separating the lighting device on the separating point; fastening a connection element at least on the remaining sealing compound layer of at least one of the lighting device sections, wherein the connection element has at least one contacting element, which contacts a respective contact covered by the remaining sealing compound layer after separation or breaking through the remaining sealing compound layer. The tool according to the invention is a pair of cutting pliers having a vertical double cutting edge and a horizontally movable cutting edge. The connection element has at least one contacting element for separating or breaking through a remaining sealing compound layer of the lighting device.
摘要翻译：该方法被用于照明装置接触，所述包括电路板，它是由一个密封化合物层和在分离点所成两个发光装置的部分的照明装置可以被分离，并且每个靠近在每种情况下，至少一个电接触分离点的发光装置部分; 所述方法至少包括以下步骤：至少除去所述分离点的两侧上的所述封装层，超出所述发光器件部分的相邻接触点，使得所述接触点保持被更薄的剩余封装层覆盖; 在分离点处分离照明装置; 剩余的流延层的发光装置的部分中的至少一个，其中，所述连接元件具有至少一个接触元件，在至少固定一个端子部件，其接触的相应的覆盖有对剩余的浇铸层的切割或刺穿剩余流延层接触。该工具是一种具有垂直双刀刃和水平活动刀刃的切割钳。连接元件具有用于切断或刺穿照明装置的剩余封装层的至少一个接触元件。

2. 发明申请

WO2010089218A2 LIGHTING MODULE 审中-公开
标题翻译：光模块
公开(公告)号：WO2010089218A2
公开(公告)日：2010-08-12
申请号：PCT/EP2010050792
申请日：2010-01-25
申请人： OSRAM GMBH , STRAUSS STEFFEN , SCILLA GIOVANNI , MAIER CHRISTINE , KRAUS ROBERT , DONAUER THOMAS
发明人： STRAUSS STEFFEN , SCILLA GIOVANNI , MAIER CHRISTINE , KRAUS ROBERT , DONAUER THOMAS
IPC分类号： F21S4/00 , F21V31/00
CPC分类号： F21S4/006 , F21S4/24 , F21V31/005 , F21Y2115/10
摘要： The invention relates to a lighting module having a lighting band having a band-shaped, flexible substrate, wherein at least one semiconductor light source, in particular LED, is attached on the front side of the substrate, wherein the lighting module is supplied with a protective layer such that at least one radiation emission surface of the at least one semiconductor light source is exposed.
摘要翻译：本发明涉及包括具有一个带形柔性衬底上的光带中的发光模块中，被施加到衬底的前侧上的至少一个半导体光源，尤其是LED，所述发光模块被提供有保护层是这样的，至少一个发射辐射的所述至少一个半导体光源的表面被暴露，

3. 发明申请

WO2009071313A3 SUBSTRATE FOR AN LED SUBMOUNT, AND LED SUBMOUNT 审中-公开
标题翻译：基板LED底座和LED底座
公开(公告)号：WO2009071313A3
公开(公告)日：2009-08-13
申请号：PCT/EP2008010342
申请日：2008-12-05
申请人： OSRAM GMBH , MARFELD JAN , STRAUSS STEFFEN
发明人： MARFELD JAN , STRAUSS STEFFEN
IPC分类号： H01L25/075 , F21K7/00 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a substrate for an LED submount, having a plurality of mounting slots on the substrate surface thereof, and a plurality of pairs, each consisting of an electric anode connection and an electric cathode connection, wherein the anode connections are disposed on a first side section of the substrate surface, and the cathode connections are disposed on a second side section of the substrate surface, comprising at least one connection distribution conductor, leading from a mounting slot to an electric connection past at least two further mounting slots.
摘要翻译：对于一个LED次粘着基台（1）的基板（2）在其上基板侧上的多个放置台和多个对在每种情况下的电阳极连接（12）和阴极电端子（13），其中，所述阳极端子布置在所述上基板侧的第一侧部中的和阴极端子被设置在所述上基板侧的第二侧部，其包含通过从嵌合站中的电连接器的至少两个其它插入位置的至少一个Anschlussauf分布导体轨道（14，15）。

4. 发明申请

WO2012152640A3 LIGHT-EMITTING DIODE ARRAY AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE ARRAY 审中-公开
标题翻译： LED和一种用于生产LED的配置
公开(公告)号：WO2012152640A3
公开(公告)日：2013-01-03
申请号：PCT/EP2012058088
申请日：2012-05-03
申请人： OSRAM AG , REISS MARTIN , STRAUSS STEFFEN , HOLZAPFEL GERHARD , RIEGER THOMAS
发明人： REISS MARTIN , STRAUSS STEFFEN , HOLZAPFEL GERHARD , RIEGER THOMAS
IPC分类号： F21V31/04 , F21S4/00 , F21Y101/02 , F21Y103/00
CPC分类号： H05K3/284 , F21S4/22 , F21V31/04 , F21Y2103/10 , F21Y2115/10 , H05K2201/10106
摘要： The invention relates to a light-emitting diode array (10) comprising at least one light-emitting diode (14) that is arranged on a printed circuit board (12). An exit direction (16) of radiation originating from the at least one light-emitting diode (14) during the operation thereof coincides with an extension direction of the printed circuit board (12) that is different from a thickness of the printed circuit board (12). At least some regions of the at least one light-emitting diode (14) and/or the printed circuit board (12) are embedded in at least one protective material (18, 20). The light-emitting diode array (10) comprises a profiled part (22), which allows the radiation to exit the light-emitting diode array (10) and surrounds the at least one protective material (18, 20) at least in some regions. The invention further relates to a method for producing a light-emitting diode array (10).
摘要翻译：本发明涉及一种布置在印刷电路板（12）的发光二极管阵列（10），具有至少一个发光二极管（14）。从这个发射的辐射的出口方向（16），其厚度的电路板（12）的电路板（12）一起的不同延伸方向中的一个的所述至少一个发光二极管（14）的操作过程中降低到在这种情况下。所述至少一个发光二极管（14）和/或印刷电路板（12）在至少一个保护材料（18，20）至少部分地嵌入。这里，发光二极管布置（10）包括辐射从发光二极管装置（10）-permitting部（22），其包括在区域至少围绕至少一个保护性材料（18，20）的泄漏。此外，本发明涉及一种用于制造发光二极管阵列（10）的方法。

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