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    • 1. 发明申请
    • MASKLESS DIRECT WRITE OF COPPER USING AN ANNULAR AEROSOL JET
    • 使用环形气溶胶射流进行铜的直接写入
    • WO2006041657A9
    • 2006-06-29
    • PCT/US2005034323
    • 2005-09-27
    • OPTOMEC DESIGNRENN MICHAEL JKING BRUCE HGIRIDHARAN MANAMPATHY GSHEU JYH-CHERNG
    • RENN MICHAEL JKING BRUCE HGIRIDHARAN MANAMPATHY GSHEU JYH-CHERNG
    • B41J2/015B05D5/12C23C18/00
    • H05K3/105B05B17/0615C23C18/08H01L2924/14H05K3/14
    • Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three­ dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream. Also a method and apparatus for maskless deposition of copper lines on a target, specifically relating to localized solution-based deposition of copper using an annular aerosol jet and subsequent material processing using conventional thermal techniques or laser processing.
    • 公开了用于沉积源材料(10)的方法和装置。 雾化器(12)使源材料(10)供应成许多离散颗粒。 力施加器(14)推动颗粒以连续,平行的离散颗粒流。 准直仪(16)在其沉积在基底(18)上之前控制流中颗粒的飞行方向。 在本发明的一个可选实施例中,可以控制颗粒的粘度以实现非保形或三维表面的复杂沉积。 本发明还包括可以在沉积之前,期间或之后进行的各种衬底处理。 在本发明的又一个实施例中,可以采用虚拟或级联冲击器从沉积流中去除选定的颗粒。 还提供一种用于在目标上无掩模地沉积铜线的方法和设备,具体涉及使用环形气溶胶射流的局部溶液基沉积铜和随后使用常规热技术或激光处理的材料处理。
    • 3. 发明申请
    • MASKLESS DIRECT WRITE OF COPPER USING AN ANNULAR AEROSOL JET
    • 使用ANNULAR AEROSOL喷嘴的铜的直接写入
    • WO2006041657A3
    • 2008-01-10
    • PCT/US2005034323
    • 2005-09-27
    • OPTOMEC DESIGNRENN MICHAEL JKING BRUCE HGIRIDHARAN MANAMPATHY GSHEU JYH-CHERNG
    • RENN MICHAEL JKING BRUCE HGIRIDHARAN MANAMPATHY GSHEU JYH-CHERNG
    • H01L21/20B05D5/12B41J2/015C23C18/00
    • H05K3/105B05B17/0615C23C18/08H01L2924/14H05K3/14
    • Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three­ dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream. Also a method and apparatus for maskless deposition of copper lines on a target, specifically relating to localized solution-based deposition of copper using an annular aerosol jet and subsequent material processing using conventional thermal techniques or laser processing.
    • 公开了用于沉积源材料(10)的方法和装置。 雾化器(12)将源材料(10)供应到许多离散的颗粒中。 力施加器(14)推动颗粒处于连续的,平行的离散颗粒流中。 准直器(16)在其沉积在基底(18)上之前控制颗粒在流中的飞行方向。 在本发明的替代实施方案中,可以控制颗粒的粘度以使复合物沉积非保形或三维表面。 本发明还包括可以在沉积之前,期间或之后发生的各种各样的基底处理。 在本发明的另一个实施例中,可以使用虚拟或级联冲击器来从沉积流中去除所选择的颗粒。 还有一种用于将铜线无掩模沉积在靶上的方法和装置,特别涉及使用环形气溶胶射流的铜的局部溶液沉积,以及使用常规热技术或激光加工的随后材料处理。