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    • 2. 发明申请
    • INK JET PRINTHEAD AND ITS MANUFACTURING PROCESS
    • 喷墨喷头及其制造工艺
    • WO2005039880A1
    • 2005-05-06
    • PCT/IT2004/000586
    • 2004-10-27
    • OLIVETTI I-JET S.P.A.CONTA, RenatoGIOVANOLA, Lucia
    • CONTA, RenatoGIOVANOLA, Lucia
    • B41J2/155
    • B41J2/155B41J2/14072B41J2/1603B41J2/1623B41J2/1625B41J2/1628B41J2/1629B41J2/1631B41J2/1632B41J2/1634B41J2/1635B41J2/1639B41J2/1643
    • Ink jet printhead (130) comprising one or more ejection modules (131), each with a silicon chip (134), a plurality of ejector nozzles (139) arranged adjacent to a front (133) of the module, ejection cells (137) for the nozzles and delivery channels (138) for the ink of the cells (137). The module or modules each include a distribution channel (149) adjacent to the front (133) and in fluid communication with the delivery channels (138) and a nozzle layer (152) integrated with the relative chip (134) and in which the ejector nozzles (139) parallel to the front are made. The head (130) also comprises a support (132) on which the module or modules (131) are mounted and which defines a feeding duct (143) for the ink in fluid communication with the delivery channels (138) and sealing means (150) between the module or modules and the support to guarantee fluid tightness between the feeding duct (143) and the ejection cells (139).
    • 喷墨打印头(130)包括一个或多个喷射模块(131),每个喷射模块(131)具有硅芯片(134),与模块的前部(133)相邻布置的多个喷射器喷嘴(139) 用于单元(137)的墨水的喷嘴和输送通道(138)。 模块或模块各自包括与前部(133)相邻并与输送通道(138)流体连通的分配通道(149)和与相关芯片(134)集成的喷嘴层(152),并且其中喷射器 制成平行于前面的喷嘴(139)。 头部(130)还包括支撑件(132),模块或模块(131)安装在支撑件上,并且其限定用于与输送通道(138)和密封装置(150)流体连通的墨水的进料管道(143) )与所述支撑件之间,以确保所述进料管道(143)和所述喷射单元(139)之间的流体密封性。
    • 3. 发明申请
    • PROCESS FOR PROTECTIVELY COATING HYDRAULIC MICROCIRCUITS AGAINST AGGRESSIVE LIQUIDS, PARTICULARLY FOR AN INK JET PRINTHEAD
    • 保护性液体微生物防止液体流动的方法,特别适用于喷墨打印机
    • WO2004056573A1
    • 2004-07-08
    • PCT/IT2003/000843
    • 2003-12-19
    • OLIVETTI I-JET S.P.A.GIOVANOLA, LuciaCONTA, Renato
    • GIOVANOLA, LuciaCONTA, Renato
    • B41J2/14
    • B41J2/1606B41J2/1404B41J2/1603B41J2/1629B41J2/1632B41J2/1635B41J2/1639B41J2/164
    • Process for protectively coating against aggressive liquids hydraulic microcircuits made in a resin (32), particularly for an ink jet printhead, consisting of: a9 disposing of a silicon substrate (20) comprising a sacrificial layer (26) of copper, deposited on the substrate and defining the inner shape of the hydraulic microcircuits (35, 36, 37); b) depositing on top of the outer surface of the sacrificial layer (26), by means of an electrochemical process, at least one protective, metallic coating layer (30); c) applying on the sacrificial layer (26) a non-photosensitive epoxy or polyamide resin (32), having a predetermined thickness and suitable for completely covering the sacrificial layer (26); d) effecting a polymerization of the resin (32) to increase its mechanical resistance to mechanical and thermal stresses and performing a planarization of the outer surface (33) of the resin (32), by means of a mechanical lapping and simultaneous chemical treatment; e) removing the sacrificial layer (26) through a chemical etching, in a highly acid bath; f) depositing a metallic, protective layer (39) on the outer surface (33) of the resin (32), through vacuum evaporation.
    • 特别是用于喷墨打印头的树脂(32)中制备的液体微电路的防护性液体的保护性涂覆方法,包括:a9设置包括沉积在基底上的铜的牺牲层(26)的硅衬底(20) 并限定液压微电路(35,36,37)的内部形状; b)通过电化学工艺沉积在牺牲层(26)的外表面的顶部上,至少一个保护性金属涂层(30); c)在牺牲层(26)上施加具有预定厚度且适于完全覆盖牺牲层(26)的非感光性环氧树脂或聚酰胺树脂(32); d)通过机械研磨和同时化学处理来实现树脂(32)的聚合以增加其对机械和热应力的机械性能并进行树脂(32)的外表面(33)的平坦化; e)通过化学蚀刻在高酸浴中去除牺牲层(26); f)通过真空蒸发在所述树脂(32)的外表面(33)上沉积金属保护层(39)。
    • 4. 发明申请
    • INK-JET PRINTHEAD MANUFACTURING PROCESS
    • INK-JET PRINTHEAD制造工艺
    • WO2008077419A1
    • 2008-07-03
    • PCT/EP2006/012453
    • 2006-12-22
    • TELECOM ITALIA S.P.A.GIOVANOLA, Lucia
    • GIOVANOLA, Lucia
    • B41J2/16
    • B41J2/162B41J2/1603B41J2/1623B41J2/1628B41J2/1629B41J2/1631B41J2/1632B41J2/1635B41J2/1642B41J2/1645H01L21/2007Y10T29/49401Y10T29/49432
    • A process for manufacturing an ink- jet print head comprising the steps of a) providing a print head wafer (100) comprising a plurality of print head dice (110) coated with a barrier layer (115) , each print head die comprising a plurality of actuators (140) and interconnections (135) , said barrier layer comprising a plurality of openings (120,130) in correspondence with said plurality of actuators and interconnections/ b) providing a debondable SOI wafer (150) comprising a handle layer (160) , a buried layer (170) , and a device layer (180) , c) forming a protective layer (190) on the surface of said device layer, d) bonding said device layer to said barrier layer, e) debonding said handle layer from said SOI wafer, f) etching said device layer so as to realize a plurality of openings (200,145) in correspondence with said plurality of actuators and interconnections, and g) removing said protective layer in correspondence of said plurality of openings .
    • 一种用于制造喷墨打印头的方法,包括以下步骤:a)提供包括涂覆有阻挡层(115)的多个打印头骰子(110)的打印头晶片(100),每个打印头模具包括多个 的致动器(140)和互连(135),所述阻挡层包括与所述多个致动器和互连对应的多个开口(120,130),b)提供包括手柄层(160)的可脱离SOI晶片(150) 掩埋层(170)和器件层(180),c)在所述器件层的表面上形成保护层(190),d)将所述器件层粘合到所述阻挡层,e)使所述手柄层脱离 所述SOI晶片,f)蚀刻所述器件层,以实现与所述多个致动器和互连对应的多个开口(200,145),以及g)根据所述多个开口去除所述保护层。