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1. 发明申请

WO2017109677A1 BIOCOMPATIBLE ELECTRO-OPTICS PACKAGE FOR IN VIVO USE 审中-公开
标题翻译：用于体内使用的生物相容性电光学包装
公开(公告)号：WO2017109677A1
公开(公告)日：2017-06-29
申请号：PCT/IB2016/057790
申请日：2016-12-19
申请人： NOVARTIS AG
发明人： MATTES, Michael F. , ZIELKE, Mark A. , MCCANN, Jonathan , LINTERN, Richard , POLLOCK, Samuel
IPC分类号： A61F2/16 , A61N1/375
CPC分类号： A61F2/1624 , A61F2/1691 , A61F2250/0069 , A61N1/375
摘要： A bio-compatible packaging for an optoelectronic device is presented, to essentially eliminate moisture ingress and corrosion of the internal electronics of the device after it is implanted for in-vivo use. In some implementations, the optoelectronic device includes an optoelectronic assembly that includes an electronic module, an optoelectronic module, a power source, configured to energize the electronic module and the optoelectronic module, and an electronic interconnect to provide electronic couplings between the electronic module, the optoelectronic module, and the power source. The device further includes a bio-compatible packaging, having a transparent front window and a transparent back window, the bio-compatible packaging configured to enable light to enter the optoelectronic device through the front window, propagate through the optoelectronic module, and leave the optoelectronic device through the back window, and to hermetically seal the optoelectronic assembly.
摘要翻译：提出了一种用于光电子装置的生物兼容包装，其基本上消除了在植入体内使用后的装置的内部电子器件的湿气侵入和腐蚀。在一些实施方式中，光电子装置包括光电子组件，该光电子组件包括电子模块，光电模块，被配置为激励电子模块和光电模块的电源以及电子互连，以提供电子模块，电子模块光电模块和电源。该装置还包括具有透明前窗和透明后窗的生物兼容包装，该生物兼容包装被配置为使得光能够通过前窗进入光电装置，传播通过光电模块，并且离开光电子器件装置通过后窗，并密封光电组件。

2. 发明申请

WO2017103734A1 FLEXIBLE, HERMETIC ELECTRICAL INTERCONNECT FOR ELECTRONIC AND OPTOELECTRONIC DEVICES FOR IN VIVO USE 审中-公开
标题翻译：用于体内电子和光电子器件的柔性，密封电连接
公开(公告)号：WO2017103734A1
公开(公告)日：2017-06-22
申请号：PCT/IB2016/057383
申请日：2016-12-06
申请人： NOVARTIS AG
发明人： ZIELKE, Mark A. , MATTES, Michael F.
IPC分类号： A61F2/16 , B29D11/00 , G02C7/08 , A61N1/375 , A61N1/36
CPC分类号： A61F2/1624 , A61F2/16 , A61F2002/1681 , A61F2220/0025 , A61F2250/0069 , A61N1/36046 , A61N1/3754 , B29D11/00807 , B29D11/00817 , B29D11/00826 , B29D11/023 , G02C7/083 , H05K3/007 , H05K3/28 , H05K3/4038
摘要： An electronic device can comprise a first electronic module; a second electronic module; and a hermetic electric interconnect to hermetically couple them, The hermetic electric interconnect can comprise a bottom metal layer; a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer; an interconnect metal layer, deposited on the bottom insulating layer, and deposited to form a bottom sealing ring; and patterned to form electrical connections between contact pads, and to form a middle sealing ring: a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer; and patterned to form feedthrough holes; and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes; and patterned to complete forming contacts through the feedthrough holes, to form a separate barrier layer, and to complete forming the top sealing ring.
摘要翻译：电子设备可以包括第一电子模块; 第二电子模块; 以及密封的电互连件以气密地耦合它们。密封电互连件可以包括底部金属层; 底部绝缘层，沉积在底部金属层上以绝缘底部金属层; 沉积在底部绝缘层上并沉积以形成底部密封环的互连金属层; 并且被图案化以形成接触垫之间的电连接，并且形成中间密封环：沉积在互连金属层上以使互连金属层绝缘的图案化顶部绝缘层; 并被图案化以形成馈通孔; 以及顶部金属层，沉积在顶部绝缘层上以通过填充馈通孔开始形成接触; 并构图以完成通过穿通孔形成触点，形成单独的阻挡层，并完成形成顶部密封环。

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