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    • 4. 发明申请
    • EMBEDDED WAVEGUIDE DETECTORS
    • 嵌入式波形检测器
    • WO2005001519A2
    • 2005-01-06
    • PCT/US2004/017061
    • 2004-05-28
    • APPLIED MATERIALS, INC.LEON, Francisco, A.MOFFAT, StephenWEST, Lawrence, C.WADA, Yuichi
    • LEON, Francisco, A.MOFFAT, StephenWEST, Lawrence, C.WADA, Yuichi
    • G02B
    • G02B6/12004G02B2006/12061H01L31/0232H01L31/0288H01L31/105H01L31/1812Y02E10/50
    • A method of fabricating a detector that involves: forming a trench in a substrate, the substrate having an upper surface; forming a first doped semiconductor layer on the substrate and in the trench; forming a second semiconductor layer on the first doped semiconductor layer and extending into the trench, the second semiconductor layer having a conductivity that is less than the conductivity of the first doped semiconductor layer; forming a third doped semiconductor layer on the second semiconductor layer and extending into the trench; removing portions of the first, second and third layers that are above a plane defined by the surface of the substrate to produce an upper, substantially planar surface and expose an upper end of the first doped semiconductor layer in the trench; forming a first electrical contact to the first semiconductor doped layer; and forming a second electrical contact to the third semiconductor doped layer.
    • 一种制造检测器的方法,包括:在衬底中形成沟槽,所述衬底具有上表面; 在所述衬底和所述沟槽中形成第一掺杂半导体层; 在所述第一掺杂半导体层上形成第二半导体层并延伸到所述沟槽中,所述第二半导体层的导电率小于所述第一掺杂半导体层的导电性; 在所述第二半导体层上形成第三掺杂半导体层并延伸到所述沟槽中; 去除在由衬底的表面限定的平面之上的第一层,第二层和第三层的部分,以产生上部基本平坦的表面,并且暴露沟槽中的第一掺杂半导体层的上端; 形成第一电接触到第一半导体掺杂层; 以及向所述第三半导体掺杂层形成第二电接触。