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1. 发明申请

WO1985004817A1 APPARATUS AND METHOD FOR REMOVING DISSOLVED METALS FROM SOLUTIONS CONTAINING SAME 审中-公开
标题翻译：从含有该溶液的溶液中除去溶解的金属的装置和方法
公开(公告)号：WO1985004817A1
公开(公告)日：1985-11-07
申请号：PCT/US1985000255
申请日：1985-02-19
申请人： MacDERMID, INCORPORATED
发明人： MacDERMID, INCORPORATED , ARDZIJAUSKAS, Robert , TOLLER, William, H.
IPC分类号： B01D15/00
CPC分类号： C02F1/28 , B01D15/00 , C02F1/281 , C02F1/288 , C23C18/1617 , C25D21/16
摘要： An apparatus comprising a container (12) having a perforated bottom portion (10) and, arranged on and above a retaining member (14) in the container, a plurality of absorbent particles containing a metal or metal compound capable of catalyzing the deposition of the dissolved metal from the solution. The solution is first passed through dispersing or distributing means (18), which can be integral part of the container, prior to passing downward through the container for contact with the absorbent particles.
摘要翻译：一种包括具有穿孔底部（10）并且布置在容器中的保持构件（14）上和上方的容器（12）的装置，包含能够催化沉积的金属或金属化合物的多个吸收颗粒从溶液中溶解金属。该溶液首先通过分散或分配装置（18），该装置可以在通过容器与吸收剂颗粒接触之前，其可以是容器的一部分。

2. 发明申请

WO1987002791A1 PHOTOIMAGING PROCESSES AND COMPOSITIONS 审中-公开
标题翻译：光化过程和组合物
公开(公告)号：WO1987002791A1
公开(公告)日：1987-05-07
申请号：PCT/US1986002166
申请日：1986-10-10
申请人： MacDERMID, INCORPORATED
发明人： MacDERMID, INCORPORATED , CORDES, William, Frederick, III
IPC分类号： G03F09/00
CPC分类号： G03F9/7084 , G03F7/091 , G03F9/00
摘要： The step-on-wafer process, also known as the step-and-repeat alignment process, for the production of very large scale integration (VLSI) microcircuitry with multi-layer interconnects, is greatly facilitated by incorporating, into at least the first layer of photoresist, a dyestuff which meets certain criteria the chief of which is that it be transparent to radiation to which the photoresist system is sensitive and that it absorb radiation of a wavelength to which the photoresist system is not sensitive. The use of photoresist systems in association with such dyestuffs has additional advantages. For example, the thickness of the photoresist layer deposited on a substrate can be checked prior to imaging without activating the photoresist.

3. 发明申请

WO1986006754A1 METHOD AND COMPOSITION FOR ELECTROLESS NICKEL DEPOSITION 审中-公开
标题翻译：电沉积镍的方法和组合
公开(公告)号：WO1986006754A1
公开(公告)日：1986-11-20
申请号：PCT/US1986000367
申请日：1986-02-24
申请人： MacDERMID, INCORPORATED
发明人： MacDERMID, INCORPORATED , LEEVER, Harold , SLOMINSKI, Leo, J.
IPC分类号： C23C16/00
CPC分类号： C23C18/34 , Y10S428/936
摘要： An electroless nickel plating method and composition wherein a soluble acetylenic compound is included within the plating bath in small amounts effective to improve the specularity of the nickel deposit without substantially decreasing the electroless plating rate of the bath. The method and compositions of the invention are useful in producing mirror-bright electroless nickel coatings free of haze.

4. 发明申请

WO1987000938A1 METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：印刷电路板的制造方法
公开(公告)号：WO1987000938A1
公开(公告)日：1987-02-12
申请号：PCT/US1986001270
申请日：1986-06-09
申请人： MacDERMID, INCORPORATED
发明人： MacDERMID, INCORPORATED , LARSON, Gary, B. , RUSZCZYK, Stanley, J. , CASTALDI, Steven, A.
IPC分类号： G03C05/00
CPC分类号： H05K3/243 , H05K3/064 , H05K3/244 , H05K3/28 , H05K3/3473 , H05K3/427 , H05K2201/09736 , H05K2203/043
摘要： Printed circuit boards having solder coated pads and through-holes (140) and bare copper traces (160) protected by a directly applied solder mask (260) or by a coating of non-reflowable metal and a solder mask thereover, are manufactured by a process which avoids the need for tin-lead stripping and the need for separate application and leveling of molten solder. In the preferred process, liquid resists (240) are applied to circuit boards having tin-lead (220) over copper plated holes (140) and pads so as to define and etch-protect bare copper traces (160) of desired pattern circuitry (as well as other desired configurations). Copper areas other than those protected by the etch-resist (240) and tin-lead plating (220) are etched away, the etch-resist (240) removed and solder mask (260) applied over the bare copper traces (160) or other desired bare copper areas or, alternatively, to bare copper first coated with a non-reflowable metal. The tin-lead plating (220) is then preferably reflowed and solidified to provide the pads and through-holes with solder coating.
摘要翻译：具有焊接涂覆的焊盘和通过直接施加的焊接掩模（260）保护的通孔（140）和裸铜迹线（160）的印刷电路板或由不可回流金属和其上的焊接掩模涂覆的印刷电路板由这种方法避免了锡铅剥离的需要以及熔融焊料的单独应用和调平的需要。在优选的方法中，将液体抗蚀剂（240）施加到具有镀锡孔（140）和焊盘上的锡 - 铅（220）的电路板上，以便限定和蚀刻保护所需图案电路的裸铜迹线（160）以及其它所需的配置）。蚀刻除了由抗蚀刻剂（240）和锡 - 铅电镀（220）保护的铜区域以外的铜区域，蚀刻抗蚀剂（240）被去除并且焊接掩模（260）施加在裸铜迹线（160）或其他所需的裸铜区域，或者替代地，首先涂覆有不可回流金属的裸铜。然后优选将锡铅电镀（220）回流并固化，以提供具有焊料涂层的焊盘和通孔。

5. 发明申请

WO1985000387A1 OXIDIZING ACCELERATOR 审中-公开
标题翻译：氧化加速器
公开(公告)号：WO1985000387A1
公开(公告)日：1985-01-31
申请号：PCT/US1984000779
申请日：1984-05-21
申请人： MacDERMID, INCORPORATED
发明人： MacDERMID, INCORPORATED , KUKANSKIS, Peter, E. , GRUNWALD, John, J. , SAWOSKA, David
IPC分类号： C23C03/02
CPC分类号： C23C18/28 , H05K3/422
摘要： A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an accelerator bath containing an agent which oxidizes the tin.
摘要翻译：公开了一种在非导电基底上无电沉积金属的方法，包括在用含有混合锡 - 钯催化剂的催化剂组合物进行无电沉积之前处理基底。通过使经处理的基板与含有氧化锡的试剂的加速槽接触来获得金属沉积的改进。

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