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1. 发明申请

WO2013081693A1 FEEDTHROUGH ASSEMBLY INCLUDING CHIP CAPACITORS 审中-公开
标题翻译：丰富的组装，包括芯片电容器
公开(公告)号：WO2013081693A1
公开(公告)日：2013-06-06
申请号：PCT/US2012/052019
申请日：2012-08-23
申请人： MEDTRONIC, INC. , IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
发明人： IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
IPC分类号： A61N1/375 , H01G4/35
CPC分类号： A61N1/3754 , H01G4/35 , H01G4/38 , H01G4/40 , Y10T29/49117
摘要： A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening and attached to the ferrule, and a plurality of chip capacitors. In some examples, the feedthrough may include a plurality of feedthrough conductive pathways extending between an externally-facing side of the feedthrough and an internally-facing side of the feedthrough. In some examples, respective ones of the plurality of chip capacitors are electrically connected to respective ones of the plurality of feedthrough conductive pathways and electrically connected to the ferrule.
摘要翻译：馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内并附接到套圈的馈通，以及多个芯片电容器。在一些示例中，馈通可以包括在馈通的外部相对侧和馈通的面向内侧之间延伸的多个馈通导电路径。在一些示例中，多个片状电容器中的相应的片状电容器电连接到多个馈通导电路径中的相应的，并电连接到套圈。

2. 发明申请

WO2012087370A1 MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREOF 审中-公开
标题翻译：多电极可植入系统及其组合
公开(公告)号：WO2012087370A1
公开(公告)日：2012-06-28
申请号：PCT/US2011/034455
申请日：2011-04-29
申请人： MEDTRONIC, INC. , SOMMER, John, Louis , D'SA, Joseph, Michael , YAMAMOTO, Joyce, K. , TISCHENDORF, Brad, C. , REINKE, James, D. , THOM, Andrew, J. , MILTICH, Thomas, P. , TAYLOR, William, John , GARDESKI, Kenneth, C. , TYLER, Larry, Earl , YORK, Jeffrey, O. , MUNNS, Gordon, O.
发明人： SOMMER, John, Louis , D'SA, Joseph, Michael , YAMAMOTO, Joyce, K. , TISCHENDORF, Brad, C. , REINKE, James, D. , THOM, Andrew, J. , MILTICH, Thomas, P. , TAYLOR, William, John , GARDESKI, Kenneth, C. , TYLER, Larry, Earl , YORK, Jeffrey, O. , MUNNS, Gordon, O.
IPC分类号： A61N1/05
CPC分类号： A61N1/362 , A61N1/05 , A61N1/056 , A61N1/372
摘要： Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi- electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
摘要翻译：例如，包括IC芯片的密封组件被配置为并入可植入医疗电线的连接器端子内，优选地在端子的接触构件内。组件可以包括焊接到接触构件的任一端的两个馈通子组件，以形成封闭IC芯片的密封胶囊，以及允许内腔沿着端子的长度延伸穿过的管状构件。多电极引线可以包括多路复用器电路，优选地是开关矩阵元件和通信，控制和电源元件，其电耦合到接触构件和端子的另一接触构件。每对开关矩阵开关允许选择任何两个电极，以便通过来自连接器端子连接到的装置/脉冲发生器的刺激脉冲传送刺激矢量。

3. 发明申请

WO2013032878A1 FEEDTHROUGH ASSEMBLY INCLUDING A CAPACITIVE FILTER ARRAY 审中-公开
标题翻译：包括电容滤波器阵列在内的组装
公开(公告)号：WO2013032878A1
公开(公告)日：2013-03-07
申请号：PCT/US2012/052191
申请日：2012-08-24
申请人： MEDTRONIC, INC. , IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
发明人： IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
IPC分类号： A61N1/375
CPC分类号： A61N1/3754 , A61N1/3968 , H03H7/0138 , H03H2001/0042 , H05K13/00 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49165 , Y10T29/49171 , Y10T29/49208
摘要： A feedthrough assembly (14) may include a ferrule (16) defining a ferrule opening (30), a feedthrough (18) at least partially disposed within the ferrule opening, and a capacitive filter array (20) at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway (44) and the capacitive filter array may include at least one filter array conductive pathway (62). In some examples, the feedthrough assembly includes a thick film conductive paste (48a 48b, 48c) electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact (72) and a capacitive filter (64) electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste (48d, 48e) electrically connecting the perimeter conductive contact and the ferrule.
摘要翻译：馈通组件（14）可以包括限定套圈开口（30）的套圈（16），至少部分地设置在套圈开口内的馈通（18）和至少部分地设置在套圈内的电容式过滤器阵列（20）开幕。馈通可以包括至少一个馈通导电路径（44），并且电容滤波器阵列可以包括至少一个滤波器阵列导电路径（62）。在一些示例中，馈通组件包括电连接至少一个馈通导电路径和至少一个滤波器阵列导电路径的厚膜导电浆料（48a 48b，48c）。在一些示例中，电容馈通阵列包括周边导电触点（72）和电耦合至少一个滤波器阵列导电路径和周边导电触点的电容滤波器（64）。在这些示例中的一些示例中，馈通组件包括电连接周边导电触点和套圈的厚膜导电膏（48d，48e）。

4. 发明申请

WO2003090862A1 ELECTRICALLY INSULATED COMPONENT SUB-ASSEMBLIES OF IMPLANTABLE MEDICAL DEVICES 审中-公开
标题翻译：可植入医疗器械的电气绝缘部件组件
公开(公告)号：WO2003090862A1
公开(公告)日：2003-11-06
申请号：PCT/US2003/012987
申请日：2003-04-24
申请人： MEDTRONIC, INC.
发明人： RIES, Andrew, J. , NORTON, John, D. , MAY, Steven, J. , BREYEN, Mark, D. , MILTICH, Thomas, P. , RODGERS, Angela
IPC分类号： A61N1/375
CPC分类号： A61N1/375 , A61N1/3758 , B33Y80/00
摘要： Implantable medical devices (IMDs) and their various components, particularly methods and apparatus for electrically isolating and supporting components of an IMD IPG, e.g., capacitors of a capacitor sub-assembly, thereof in volumetrically efficient ways. A capacitor sub-assembly comprising two or more capacitors stacked side-by-side such that the facing capacitor case major sides are separated by a reliable and simple to apply insulation layer of minimal thickness is disclosed for assembly with other components of an ICD IPG into an IPG housing. A shape conforming insulating spacer is formed of an insulating polymer to conform to the shape of a first capacitor case major side and the perimeter of that major side. The shape conforming insulating spacer is simply applied or adhered by adhesive layers, bands or patterns to one or both of the facing capacitor case major sides.
摘要翻译：可植入医疗器械（IMD）及其各种部件，特别是用于以体积有效的方式电气隔离和支撑IMD IPG的部件（例如电容器子组件的电容器）的方法和装置。电容器子组件包括并排堆叠的两个或更多个电容器，使得面对的电容器壳体主侧面被可靠且简单地施加最小厚度的绝缘层分开，用于与ICD IPG的其它部件组装成 IPG住房。形状一致的绝缘隔离物由绝缘聚合物形成以符合第一电容器壳体主侧和该主要侧面的周边的形状。形状一致的绝缘间隔物通过粘合剂层，带或图案简单地施加或粘附到面向电容器壳体主侧中的一个或两个。

5. 发明申请

WO2007101083A2 SEPARATOR SYSTEMS FOR ELECTROCHEMICAL CELLS 审中-公开
标题翻译：电化学细胞分离系统
公开(公告)号：WO2007101083A2
公开(公告)日：2007-09-07
申请号：PCT/US2007/062645
申请日：2007-02-23
申请人： MEDTRONIC, INC , NORTON, John, D. , MILTICH, Thomas, P. , RORVICK, Anthony, W. , NIELSEN, Christian, S. , BREYEN, Mark, D. , LESSAR, Joseph, F. , PIGNATO, Paul, A.
发明人： NORTON, John, D. , MILTICH, Thomas, P. , RORVICK, Anthony, W. , NIELSEN, Christian, S. , BREYEN, Mark, D. , LESSAR, Joseph, F. , PIGNATO, Paul, A.
IPC分类号： H01G9/02
CPC分类号： H01G9/02
摘要： A capacitor cell is presented. The capacitor cell includes an anode, a cathode spaced from and operatively associated with the anode, an electrolyte operatively associated with the anode and the cathode. A layered separator includes a plurality of separator material layers disposed between the anode and cathode. The plurality of separator material layers includes a first layer and a second layer. The first layer is characterized by a first value of a physical property and the second layer is characterized by a second value of the physical property.
摘要翻译：提出了一个电容器单元。电容器单元包括阳极，与阳极间隔开并且与阳极可操作地相关联的电解质，与阳极和阴极可操作地连接的电解质。分层分离器包括设置在阳极和阴极之间的多个隔板材料层。多个隔板材料层包括第一层和第二层。第一层的特征在于物理性质的第一值，第二层的特征在于物理性质的第二值。

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