专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2012166709A2 CAPACITOR INCLUDING REGISTRATION FEATURE FOR ALIGNING AN INSULATOR LAYER 审中-公开
标题翻译：电容器包括用于对准绝缘层的注册特征
公开(公告)号：WO2012166709A2
公开(公告)日：2012-12-06
申请号：PCT/US2012/039826
申请日：2012-05-29
申请人： MEDTRONIC, INC. , IYER, Rajesh V.
发明人： IYER, Rajesh V.
IPC分类号： H01G4/35 , H01B19/00
CPC分类号： H01G4/35 , A61N1/3754 , H01G4/40
摘要： In one example, a capacitor structure may include a capacitor comprising a surface that defines at least one feedthrough aperture and a ceramic insulator layer attached to the surface. The surface of the capacitor may include a capacitor registration feature, and the ceramic insulator layer may include a ceramic insulator layer registration feature. The capacitor registration feature and the ceramic insulator layer registration feature may cooperate to substantially align the ceramic insulator layer to the capacitor, e.g., prior to the ceramic layer being attached to surface of the capacitor.
摘要翻译：在一个示例中，电容器结构可以包括包括限定至少一个馈通孔的表面的电容器和附接到表面的陶瓷绝缘体层。电容器的表面可以包括电容器配准特征，并且陶瓷绝缘体层可以包括陶瓷绝缘体层配准特征。电容器配准特征和陶瓷绝缘体层对准特征可以协调以将陶瓷绝缘体层基本上对准电容器，例如在陶瓷层附着到电容器的表面之前。

2. 发明申请

WO2010117846A1 ELECTRONIC MODULE ASSEMBLY FOR FILTERED FEEDTHROUGHS 审中-公开
标题翻译：电子模块组件用于过滤的FEEDTHROUGHS
公开(公告)号：WO2010117846A1
公开(公告)日：2010-10-14
申请号：PCT/US2010/029345
申请日：2010-03-31
申请人： MEDTRONIC, INC. , IYER, Rajesh V. , NYGREN, Lea A. , MCCRACKEN, Stephanie L. , MUKUL, Jain , KRONICH, Christine G.
发明人： IYER, Rajesh V. , NYGREN, Lea A. , MCCRACKEN, Stephanie L. , MUKUL, Jain , KRONICH, Christine G.
IPC分类号： A61N1/375 , H01B17/26 , H01R13/52 , H01G4/35
CPC分类号： A61N1/3754 , H01G4/35 , H01R13/03 , H01R43/20 , H01R2201/12
摘要： An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA comprises a non-conductive block having a top side, a bottom side, a front side and a back side. A plurality of conductive strips are coupled to the non-conductive block. Each conductive strip possesses a front side and a back side. The back side of each conductive strip is directly connected or embedded into the surfaces of the front side, the top side and the back side of the non-conductive block.
摘要翻译：公开了一种用于可植入医疗装置的电子模块组件（EMA）。 EMA包括具有顶侧，底侧，前侧和后侧的非导电块。多个导电条耦合到非导电块。每个导电带具有前侧和后侧。每个导电条的背面直接连接或嵌入到非导电块的前侧，顶侧和后侧的表面中。

3. 发明申请

WO2007087487A1 METHOD AND APPARATUS FOR MINIMIZING EMI COUPLING IN A FEEDTHROUGH ARRAY HAVING AT LEAST ONE UNFILTERED FEEDTHROUGH 审中-公开
标题翻译：用于最小化至少一个未充分馈送的有源阵列中的EMI耦合的方法和装置
公开(公告)号：WO2007087487A1
公开(公告)日：2007-08-02
申请号：PCT/US2007/060611
申请日：2007-01-17
申请人： MEDTRONIC, INC. , IYER, Rajesh V. , KOCH, Daniel J. , GOLDMAN, Simon E. , KNOWLES, Shawn D. , TAYLOR, William J. , YAMAMOTO, Joyce K. , HAUBRICH, Gregory J. , NOWAK, Michael , NGHIEM, David , HUBING, Roger L. , TWETAN, Len D.
发明人： IYER, Rajesh V. , KOCH, Daniel J. , GOLDMAN, Simon E. , KNOWLES, Shawn D. , TAYLOR, William J. , YAMAMOTO, Joyce K. , HAUBRICH, Gregory J. , NOWAK, Michael , NGHIEM, David , HUBING, Roger L. , TWETAN, Len D.
IPC分类号： A61N1/375 , A61N1/37
CPC分类号： A61N1/3754 , A61N1/3718
摘要： An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.
摘要翻译：提供了可植入医疗装置，其包括壳体，从壳体向外延伸的外部电路元件，由壳体包围的内部电路，沿壳体设置的馈通阵列，具有至少一个滤波的馈通和至少一个未滤波的馈通，其中，未过滤的馈通适于连接到向外延伸的电路元件; 并且包括用于最小化经滤波的馈通和未过滤的馈通之间的电磁耦合的装置。

4. 发明申请

WO2013081693A1 FEEDTHROUGH ASSEMBLY INCLUDING CHIP CAPACITORS 审中-公开
标题翻译：丰富的组装，包括芯片电容器
公开(公告)号：WO2013081693A1
公开(公告)日：2013-06-06
申请号：PCT/US2012/052019
申请日：2012-08-23
申请人： MEDTRONIC, INC. , IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
发明人： IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
IPC分类号： A61N1/375 , H01G4/35
CPC分类号： A61N1/3754 , H01G4/35 , H01G4/38 , H01G4/40 , Y10T29/49117
摘要： A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening and attached to the ferrule, and a plurality of chip capacitors. In some examples, the feedthrough may include a plurality of feedthrough conductive pathways extending between an externally-facing side of the feedthrough and an internally-facing side of the feedthrough. In some examples, respective ones of the plurality of chip capacitors are electrically connected to respective ones of the plurality of feedthrough conductive pathways and electrically connected to the ferrule.
摘要翻译：馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内并附接到套圈的馈通，以及多个芯片电容器。在一些示例中，馈通可以包括在馈通的外部相对侧和馈通的面向内侧之间延伸的多个馈通导电路径。在一些示例中，多个片状电容器中的相应的片状电容器电连接到多个馈通导电路径中的相应的，并电连接到套圈。

5. 发明申请

WO2010129731A2 CAPACITOR ASSEMBLY AND ASSOCIATED METHOD 审中-公开
标题翻译：电容器组装及相关方法
公开(公告)号：WO2010129731A2
公开(公告)日：2010-11-11
申请号：PCT/US2010033810
申请日：2010-05-06
申请人： MEDTRONIC INC , IYER RAJESH V
发明人： IYER RAJESH V
IPC分类号： A61N1/375 , H01G2/10 , H01G4/35
CPC分类号： H01G2/20 , A61N1/3754 , H01G2/106 , H01G4/236 , H01G4/35 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49004
摘要： A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.
摘要翻译：一种电容器组件，用于组装滤波后的馈通。电容器包括固定地附接到其底部的绝缘构件，以抑制高电压电弧。存在于电容器的内径和外径上的端接材料不存在靠近底部的电容器的一部分，例如在绝缘构件上。

6. 发明申请

WO2009042537A2 NOVEL CAPACITIVE ELEMENTS AND FILTERED FEEDTHROUGH ELEMENTS FOR IMPLANTABLE MEDICAL DEVICES 审中-公开
标题翻译：用于植入式医疗设备的新型电容元件和过滤元件
公开(公告)号：WO2009042537A2
公开(公告)日：2009-04-02
申请号：PCT/US2008/077179
申请日：2008-09-22
申请人： MEDTRONIC, INC , IYER, Rajesh V.
发明人： IYER, Rajesh V.
IPC分类号： H03H7/00
CPC分类号： A61N1/3754 , H01G2/04 , H01G2/106 , H01G4/35 , H03H2001/0014
摘要： A capacitive element for an implantable medical device feedthrough element includes a bore, to receive a feedthrough member, or pin of the filtered feedthrough element, an external surface extending laterally outward from a first opening of the bore, and a recessed area formed in the external surface and extending about an outer perimeter thereof. The recessed area may provide a location on which to apply a conductive material to form a joint that electrically couples the capacitive element to a ferrule of the filtered feedthrough element.
摘要翻译：用于可植入医疗设备馈通元件的电容性元件包括孔，以容纳过滤构件或过滤馈通元件的引脚，从孔的第一开口横向向外延伸的外表面，以及形成在外表面中并围绕其外周延伸的凹陷区域。凹陷区域可以提供在其上施加导电材料以形成将电容元件电耦合到滤波的馈通元件的套圈的接头的位置。

7. 发明申请

WO2007100995A3 FILTERED FEEDTHROUGH ASSEMBLY 审中-公开
公开(公告)号：WO2007100995A3
公开(公告)日：2007-09-07
申请号：PCT/US2007/062371
申请日：2007-02-19
申请人： MEDTRONIC, INC. , IYER, Rajesh, V. , KNOWLES, Shawn, D.
发明人： IYER, Rajesh, V. , KNOWLES, Shawn, D.
IPC分类号： A61N1/375 , A61N1/37
摘要： A filter apparatus for use with an implantable medical device includes a printed circuit board having a first trace connected to ground and adjacent feedthrough conductors extending through the printed circuit board. A chip capacitor is electrically connected between the adjacent feedthrough conductors, and is further electrically connected to the first trace on the printed circuit board.

8. 发明申请

WO2013032878A1 FEEDTHROUGH ASSEMBLY INCLUDING A CAPACITIVE FILTER ARRAY 审中-公开
标题翻译：包括电容滤波器阵列在内的组装
公开(公告)号：WO2013032878A1
公开(公告)日：2013-03-07
申请号：PCT/US2012/052191
申请日：2012-08-24
申请人： MEDTRONIC, INC. , IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
发明人： IYER, Rajesh, V. , GOLDMAN, Simon, E. , MILTICH, Thomas, P.
IPC分类号： A61N1/375
CPC分类号： A61N1/3754 , A61N1/3968 , H03H7/0138 , H03H2001/0042 , H05K13/00 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49165 , Y10T29/49171 , Y10T29/49208
摘要： A feedthrough assembly (14) may include a ferrule (16) defining a ferrule opening (30), a feedthrough (18) at least partially disposed within the ferrule opening, and a capacitive filter array (20) at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway (44) and the capacitive filter array may include at least one filter array conductive pathway (62). In some examples, the feedthrough assembly includes a thick film conductive paste (48a 48b, 48c) electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact (72) and a capacitive filter (64) electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste (48d, 48e) electrically connecting the perimeter conductive contact and the ferrule.
摘要翻译：馈通组件（14）可以包括限定套圈开口（30）的套圈（16），至少部分地设置在套圈开口内的馈通（18）和至少部分地设置在套圈内的电容式过滤器阵列（20）开幕。馈通可以包括至少一个馈通导电路径（44），并且电容滤波器阵列可以包括至少一个滤波器阵列导电路径（62）。在一些示例中，馈通组件包括电连接至少一个馈通导电路径和至少一个滤波器阵列导电路径的厚膜导电浆料（48a 48b，48c）。在一些示例中，电容馈通阵列包括周边导电触点（72）和电耦合至少一个滤波器阵列导电路径和周边导电触点的电容滤波器（64）。在这些示例中的一些示例中，馈通组件包括电连接周边导电触点和套圈的厚膜导电膏（48d，48e）。

9. 发明申请

WO2011065989A1 LTCC/HTCC HYBRID FEEDTHROUGH 审中-公开
标题翻译： LTCC / HTCC混合发送
公开(公告)号：WO2011065989A1
公开(公告)日：2011-06-03
申请号：PCT/US2010/030662
申请日：2010-04-12
申请人： MEDTRONIC, INC. , FRANCIS, Richard W.A. , IYER, Rajesh V.
发明人： FRANCIS, Richard W.A. , IYER, Rajesh V.
IPC分类号： A61N1/375
CPC分类号： A61N1/3754 , C04B37/001 , C04B2235/75 , C04B2237/34 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/36 , C04B2237/361 , C04B2237/365 , C04B2237/368 , C04B2237/58 , C04B2237/62 , C04B2237/68 , Y10T428/24744
摘要： The present invention is directed to a ceramic monolith for use as a feedthrough in medical devices and method of making. The monolith includes a first surface, a second surface, and a passageway extending from the first surface to the second surface. The first surface is high temperature co-fired ceramic and the second surface is low temperature co-fired ceramic, and the two ceramics are intermixed in a blended interface located between the first and second surfaces.
摘要翻译：本发明涉及一种用作医疗装置中的馈通件的陶瓷整料和制造方法。整料包括第一表面，第二表面和从第一表面延伸到第二表面的通道。第一表面是高温共烧陶瓷，第二表面是低温共烧陶瓷，两个陶瓷混合在位于第一和第二表面之间的混合界面中。

10. 发明申请

WO2011017688A1 CAPACITOR ASSEMBLY AND ASSOCIATED METHOD 审中-公开
标题翻译：电容器组装及相关方法
公开(公告)号：WO2011017688A1
公开(公告)日：2011-02-10
申请号：PCT/US2010/044824
申请日：2010-08-09
申请人： MEDTRONIC, INC. , IYER, Rajesh V.
发明人： IYER, Rajesh V.
IPC分类号： H01G4/35 , A61N1/375
CPC分类号： H01G4/35 , A61N1/3754 , Y10T29/43
摘要： A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the outer diameter of the capacitor proximate an unfiltered terminal pin, such that high voltage arcing between the unfiltered terminal pin and capacitor is inhibited.
摘要翻译：一种电容器组件，用于组装滤波后的馈通装置。存在于电容器的内径和外径上的终端材料不存在靠近未过滤的端子引脚的电容器的外径的一部分，使得未滤波的端子引脚和电容器之间的高电压电弧被抑制。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式