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1. 发明申请

WO2005022607A1 COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD 审中-公开
标题翻译：组件安装和组件安装方法
公开(公告)号：WO2005022607A1
公开(公告)日：2005-03-10
申请号：PCT/JP2004/012600
申请日：2004-08-25
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , KABESHITA, Akira , HAMASAKI, Kurayasu , TANI, Noriyuki , MINAMITANI, Shozo , MAKINO, Yoichi
发明人： KABESHITA, Akira , HAMASAKI, Kurayasu , TANI, Noriyuki , MINAMITANI, Shozo , MAKINO, Yoichi
IPC分类号： H01L21/00
CPC分类号： H01L21/67144 , H01L21/67132 , H01L2221/68322 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A component mounting apparatus (101) is provided with a board holding device (5, 6) for holding a board (8) at a board holding position (A, B, C and D), a first mounting head (4) for holding and taking out a component (2) fed from a first component feeding position (E) and mounting the component on the board held at the board holding position, a second mounting head (34) for holding and taking out the component fed from a second component feeding position (F) and mounting the component on the held board, and a component feeding device (11) having a wafer holding table (12) for holding a wafer (1) on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要翻译：部件安装装置（101）具有用于将板（8）保持在板保持位置（A，B，C和D）的板保持装置（5,6），用于保持取出从第一部件供给位置（E）进给并将部件安装在保持在板保持位置的板上的部件（2），第二安装头（34），用于保持和取出从第二部件元件供给位置（F）并将部件安装在保持板上;以及部件供给装置（11），具有用于保持晶片（1）的晶片保持台（12），在该晶片保持台（12）上供给各个部件，使得晶片保持工作台可以在第一部件供给位置和第二部件供给位置之间往复移动。

2. 发明申请

WO2007021029A2 CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING APPARATUS AND CHIP MOUNTING METHOD 审中-公开
标题翻译：芯片复位装置及芯片复位方法及芯片安装装置及芯片安装方法
公开(公告)号：WO2007021029A2
公开(公告)日：2007-02-22
申请号：PCT/JP2006/316442
申请日：2006-08-16
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MAKINO, Yoichi , KABESHITA, Akira
发明人： MAKINO, Yoichi , KABESHITA, Akira
IPC分类号： H01L21/00
CPC分类号： H01L21/67144 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53478 , Y10T156/1702
摘要： In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.
摘要翻译：在芯片安装装置中使用的芯片反转装置中，该芯片安装装置用于保持和垂直反转通过接合喷嘴放置的芯片，芯片被保持在设置在反转构件中的芯片保持单元上并且被竖直反转通过在反转轴上向下转动换向构件。在芯片接收单元接收到反转芯片后，该芯片接收单元下降到缩回位置以使反转构件返回到原始位置。在这种状态下，芯片接收单元被升起以将芯片定位在高度水平L处以进行芯片传送动作。结果，反转部件不会突出到用于芯片转移的高度水平以上，从而与另一个机构发生干涉，使得芯片安装动作可以变得高效。

3. 发明申请

WO2005024932A2 APPARATUS AND METHOD FOR REMOVING SEMICONDUCTOR CHIP AND APPARATUS FOR FEEDING SEMICONDUCTOR CHIPS 审中-公开
标题翻译：用于去除半导体芯片的装置和方法以及用于馈送半导体芯片的装置
公开(公告)号：WO2005024932A2
公开(公告)日：2005-03-17
申请号：PCT/JP2004/013281
申请日：2004-09-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , KABESHITA, Akira , HAMASAKI, Kurayasu , MINAMITANI, Shozo , MAKINO, Yoichi , TANI, Noriyuki
发明人： KABESHITA, Akira , HAMASAKI, Kurayasu , MINAMITANI, Shozo , MAKINO, Yoichi , TANI, Noriyuki
IPC分类号： H01L21/50
CPC分类号： H01L21/67132 , Y10T156/1132 , Y10T156/1944
摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.
摘要翻译：在与半导体芯片（1）的粘合区域（R1）对应的粘合片（3）的底面侧区域附近被吸住并保持的情况下，将多个突起部（30）移除部件（21）通过该区域的粘合片与半导体芯片的底面接触。此外，粘合片被吸入各个突出部分之间，以便通过粘附到点粘合来改变半导体芯片与粘合片的表面粘合，并且还可以沿着半导体芯片的底面移动去除构件从而通过粘合改变点粘合的位置并降低粘合力。然后，将半导体芯片从粘合片上取出。

4. 发明申请

WO2006132428A1 LIQUID SUBSTANCE SUPPLYING DEVICE 审中-公开
标题翻译：液体物质供应装置
公开(公告)号：WO2006132428A1
公开(公告)日：2006-12-14
申请号：PCT/JP2006/311967
申请日：2006-06-08
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , NAKATSUJI, Hachiro , IIZUKA, Akira , KABESHITA, Akira
发明人： NAKATSUJI, Hachiro , IIZUKA, Akira , KABESHITA, Akira
IPC分类号： B05B15/06
CPC分类号： B05C5/0216 , B05C11/10 , B05C17/015
摘要： It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.
摘要翻译：本发明的目的是提供一种在具有大容量的容器的处理中具有高可操作性的液体物质供给装置。用于供应保留在垂直细长容器30中的液体物质的液体物质供给装置具有这样的结构，其中用于保持容器的底部部分通过设置在保持器主体16的顶侧上的插入孔插入通过铰链部分19枢转在基座支架14上，以支撑容器支架15，使得它可以采取直立姿态或倾斜姿势，并且容器保持器15通过保持器固定机构20以直立姿态固定在其中。结果，容器保持器15能够在容器更换操作时以倾斜状态安装和拆卸保持器本体16，这使得即使在处理具有伟大的高度尺寸。

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