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    • 1. 发明申请
    • IMPROVED INK JET PRINTHEADS AND METHODS THEREFOR
    • 改进的喷墨打印头及其方法
    • WO02057084A2
    • 2002-07-25
    • PCT/US0147666
    • 2001-10-22
    • LEXMARK INT INC
    • POWERS JAMES HAROLDSULLIVAN CARL EDMOND
    • B41J2/05B41J2/16B41J2/04
    • B41J2/1603B41J2/1623B41J2/1628B41J2/1631B41J2/1634B41J2/1645B41J2/1646
    • The invention provides a method for making ink feed vias (14) in semiconductor silicon substrate chips (10) for an ink jet printhead (26) and ink jet printheads containing silicon chips made by the method. The method includes applying an etch stop layer to a first surface of the silicon chip having a thickness ranging from about 300 to 800 microns, dry etching individual ink vias through the thickness of the silicon chip up to the etch stop layer from a surface opposite the first surface and forming holes in the etch stop layer to individually fluidly connect with the ink vias using a mechanical technique. Substantially vertical wall vias are etched through the thickness of the silicon chip using the method. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
    • 本发明提供一种用于在用于喷墨打印头(26)的半导体硅衬底芯片(10)中制造墨水供给通路(14)的方法以及通过该方法制造的含有硅芯片的喷墨打印头。 该方法包括将蚀刻停止层施加到厚度范围为约300至800微米的硅芯片的第一表面,从与所述硅芯片相对的表面直到蚀刻停止层的干蚀刻单独的墨通孔 第一表面和在蚀刻停止层中形成孔以使用机械技术单独地与油墨通孔流体连接。 使用该方法通过硅芯片的厚度蚀刻基本上垂直的壁通孔。 与传统的油墨通孔形成技术相反,该方法显着提高了硅芯片的生产量,并减少了由于断屑和破裂造成的损耗。 所得到的芯片对于长期打印头使用更可靠。
    • 4. 发明申请
    • ENERGY EFFICIENT HEATER STACK USING DLC ISLAND
    • 使用DLC ISLAND的能源效率的加热器堆叠
    • WO03103969B1
    • 2004-09-16
    • PCT/US0317487
    • 2003-06-04
    • LEXMARK INT INC
    • CORNELL ROBERT WILSONPARISH GEORGE KEITHPOWERS JAMES HAROLD
    • B41J2/14B41J2/05
    • B41J2/14129B41J2202/03
    • The present invention is directed toward an improved heater chip for an ink jet printer. The heater chip has a diamond-like-carbon (12) coating that functions as the cavitation and passivation layers of the heating elements (10) on the heater chip. To improve the efficiency of the heater chip, the diamond-like-carbon coating is surrounded by a material that has a lower thermal conductivity than diamond. This surrounding layer limits thermal diffusion from the heating elements into the heater chip. A smoothing layer of tantalum is deposited over the diamond-like-carbon layer to insure that vaporization of the ink occurs at the ink's superheat limit. The diamond-like-carbon layer is preferably less than 8700 Angstroms in thickness such that less than 1 microjoule of energy is required to expel of ink droplet having a mass between 2-4 nanograms.
    • 本发明涉及一种用于喷墨打印机的改进的加热器芯片。 加热器芯片具有类似金刚石的碳(12)涂层,其用作加热器芯片上的加热元件(10)的空化和钝化层。 为了提高加热器芯片的效率,类金刚石碳涂层被具有比金刚石更低的热导率的材料包围。 该周围层限制从加热元件到加热器芯片的热扩散。 在金刚石碳层上沉积钽的平滑层,以确保油墨在油墨的过热极限下发生蒸发。 金刚石碳层的厚度优选小于8700埃,使得需要少于1微焦的能量来排出质量在2-4纳克之间的墨滴。
    • 5. 发明申请
    • ENERGY EFFICIENT HEATER STACK USING DLC ISLAND
    • 使用DLC ISLAND的能源效率的加热器堆叠
    • WO03103969A2
    • 2003-12-18
    • PCT/US0317487
    • 2003-06-04
    • LEXMARK INT INC
    • CORNELL ROBERT WILSONPARISH GEORGE KEITHPOWERS JAMES HAROLD
    • B41J2/14B41J
    • B41J2/14129B41J2202/03
    • The present invention is directed toward an improved heater chip for an ink jet printer. The heater chip has a diamond-like-carbon coating that functions as the cavitation and passivation layers of the heating elements on the heater chip. To improve the efficiency of the heater chip, the diamond-like-carbon coating is surrounded by a material that has a lower thermal conductivity than diamond. This surrounding layer limits thermal diffusion from the heating elements into the heater chip. A smoothing layer of tantalum is deposited over the diamond-like-carbon layer to insure that vaporization of the ink occurs at the ink's superheat limit. The diamond-like-carbon layer is preferably less than 8700 Angstroms in thickness such that less than 1 microjoule of energy is required to expel of ink droplet having a mass between 2-4 nanograms.
    • 本发明涉及一种用于喷墨打印机的改进的加热器芯片。 加热器芯片具有类金刚石碳涂层,其用作加热器芯片上的加热元件的空化和钝化层。 为了提高加热器芯片的效率,类金刚石碳涂层被具有比金刚石更低的热导率的材料包围。 该周围层限制从加热元件到加热器芯片的热扩散。 在金刚石碳层上沉积钽的平滑层,以确保油墨在油墨的过热极限下发生蒸发。 金刚石碳层的厚度优选小于8700埃,使得需要少于1微焦的能量来排出质量在2-4纳克之间的墨滴。