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    • 2. 发明申请
    • A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • WO0077828A2
    • 2000-12-21
    • PCT/EP0005012
    • 2000-05-31
    • KONINKL PHILIPS ELECTRONICS NV
    • STOLK PETER APONOMAREV YOURI
    • H01L21/00H01L21/28H01L21/336H01L21/8238H01L27/092H01L29/423H01L29/43H01L29/49H01L29/51H01L29/78H01L
    • H01L29/4983H01L21/2807H01L21/28105H01L29/4966H01L29/517H01L29/66545H01L29/66553H01L29/66583H01L29/6659
    • In a method of manufacturing a semiconductor device comprising a transistor having a gate (22) insulated from a channel (13) by a gate dielectric (17), which channel (13) is provided in an active region (4) of a first conductivity type provided at a surface (2) of a semiconductor body (1) and has a length L over which it extends between a source zone (11,9) and a drain zone (12,9) of a second conductivity type, the active region (4) of the first conductivity type is defined in the semiconductor body (1), and a dielectric layer (14) is applied which is provided with a recess at the area of the gate (22) planned to be provided at a later stage, in which recess an insulating layer is applied, forming the gate dielectric (17) of the transistor. Then, a first conductive layer and a second conductive layer are applied, the first conductive layer being relatively thin compared to the width of the recess, which first conductive layer and second conductive layer jointly form the gate (22) of the transistor and fill the recess in the dielectric layer (14). The gate comprises a central portion (21) and side end portions (19) positioned along either side of the central portion (21), which central portion (21) and side end portions (19) are in contact with the gate dielectric (17) and jointly establish a work function of the gate (22) varying across the length L of the channel (13).
    • 在制造半导体器件的方法中,该半导体器件包括具有通过栅极电介质(17)与沟道(13)绝缘的栅极(22)的晶体管,该沟道(13)设置在第一导电性的有源区(4)中 类型设置在半导体本体(1)的表面(2)处,并且具有在第二导电类型的源极区(11,9)和漏极区(12,9)之间延伸的长度L,活性 第一导电类型的区域(4)被限定在半导体本体(1)中,并且施加介电层(14),其在门(22)的区域处设置有凹口,该区域被设计成稍后 在其中施加绝缘层的凹部中,形成晶体管的栅极电介质(17)。 然后,施加第一导电层和第二导电层,第一导电层与凹槽的宽度相比较薄,第一导电层和第二导电层共同形成晶体管的栅极(22),并填充 凹陷在介电层(14)中。 门包括中心部分(21)和沿中心部分(21)的任一侧定位的侧端部分(19),该中心部分(21)和侧端部分(19)与栅极电介质(17)接触 )并且共同建立在通道(13)的长度L上变化的门(22)的功能。