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1. 发明申请

WO2005015970A3 COOLING DEVICE FOR AN ELECTRONIC COMPONENT, ESPECIALLY FOR A MICROPROCESSOR 审中-公开
标题翻译： COOLER用于电子元件，特别是对微处理器
公开(公告)号：WO2005015970A3
公开(公告)日：2007-07-05
申请号：PCT/DE2004001361
申请日：2004-06-28
申请人： KERMI GMBH , FONFARA HARALD , GOESTL HERBERT , MILTKAU THORSTEN , EBERL MARKUS , MOLLIK RALF
发明人： FONFARA HARALD , GOESTL HERBERT , MILTKAU THORSTEN , EBERL MARKUS , MOLLIK RALF
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L23/427 , H01L2924/0002 , H05K7/20009 , H01L2924/00
摘要： The invention relates to a cooling device (1) for an electronic component (3), especially for a microprocessor, comprising a cooling body (7,9) which can be connected to the electronic component (3) to be cooled in such a way that the lost heat generated by the electronic component (3) is transferred to the cooling body (7,9) by means of a thermal interface of said electronic component (3) and is evacuated. According to the invention, the cooling body (7,9) comprises a first part (7) which can be connected to the electronic component, and a second part (9) which can be detachably connected to the first part (7) of the cooling body in such a way that the heat transition resistance is low. The predominant part of the lost heat is transferred via the second cooling body (9) to a cooling medium. The invention also relates to a rack for receiving several electronic components such as servers for data processing systems,whereby at least one electronic component (3) to be cooled is arranged on or inside several electronic components. The electronic components to be cooled are respectively fitted with a cooling device (1) according to the invention. Said cooling device is embodied in the form of cooling devices through which a liquid medium flows.
摘要翻译：本发明涉及一种用于电子元件（3）的冷却装置（1），特别是用于与散热器的微处理器（7,9），其被如此连接到要被冷却的电子元件（3），所述电子元件的（3）经由所述电子装置（3）到所述散热器的热界面产生的废热（7,9）通过与被运走。根据本发明的散热装置（7,9）包括适于连接到所述电子部件的第一散热器部分（7），和第二热沉部分（9），其可释放地连接到所述第一热沉部分（7），使得低是给定的，其中，至少经由第二热沉部分（9）的冷却介质的热损失的主要部分被排出的传热阻力。此外，本发明提供了一种用于接收多个电子部件的齿条而言，诸如用于数据处理设备的服务器，其特征在于，上或几个电子元件的冷却电子元件（3）被布置至少。待冷却的电子部件分别配备有根据本发明的，这是因为与液体介质通过形成冷却装置流入装有一个冷却装置（1）。

2. 发明申请

WO2011107464A3 HEATING SYSTEM AND METHOD FOR OPERATING A HEATING SYSTEM 审中-公开
标题翻译：供热体制和运行方法加热系统
公开(公告)号：WO2011107464A3
公开(公告)日：2012-06-28
申请号：PCT/EP2011053009
申请日：2011-03-01
申请人： KERMI GMBH , FONFARA HARALD , WEISMANN LARS
发明人： FONFARA HARALD , WEISMANN LARS
IPC分类号： F24D19/10
CPC分类号： F24D19/1024 , F24D19/1006
摘要： The invention relates to a heating system and to a method for operating such a heating system in a building with multiple heating surfaces, in particular a heating system with a heat generator. The heating system for a building with multiple heating surfaces (5a, b, c) comprises at least one heat generator (1); a circulating pump (2); a central regulator for detecting the operating states of the heat generator and for detecting the required operating parameters, such as the flow temperature and/or return temperature of the heating surfaces; control elements (6a, b, c); flow and return lines (VL, RL) for the fluidic connection between the heat generator and the heating surfaces in a cycle; and at least one room regulating device that acts on the control elements. The heating surfaces (5a, b, c) can be used as buffer stores for the heat generator (1). The control elements (6a, b, c) of the heating surfaces allow switching the flow direction of the heating surfaces, and a bypass line (3) branches from the central return line (RL) upstream of the inlet into the heat generator (1), said bypass line being fluidically connected to a switching valve (4), which lies in the flow line (VL) that leads away from the heat generator (1), in order to bypass the heat generator (1).
摘要翻译：本发明涉及加热系统和这样的加热系统的操作的方法，在具有多个加热面，特别是加热系统的热发生器的建筑物。一种用于具有多个加热表面的建筑物的加热系统（图5a，B，C），一个在至少一个热发生器（1），循环泵（2），用于检测所述发热体的操作状态，以及用于确定要求的操作参数，如入口温度的中央控制器和/或加热表面，致动器的返回温度（6A，b，C）以及供应和返回流体连通线（VL，RL）在发热体和所述加热表面和至少一个房间控制之间的一个循环装置，作用在致动器，其中所述加热表面（图5a，b，C）（对于发热体1）作为缓冲存储器可以被使用，其中，所述致动器（6A，b，C）的加热表面允许加热表面的流动方向的切换和（从中央回流管线RL）之前进入热发生器（1）关闭从发热体（1）连接Vorlaufl到传出在旁通管路（3）的分支报（VL），其设置开关阀（4），以绕过所述热发生器（1）流体连接。

3. 发明申请

WO2009015629A2 TUBE RADIATOR 审中-公开
标题翻译：管式散热器
公开(公告)号：WO2009015629A2
公开(公告)日：2009-02-05
申请号：PCT/DE2008001139
申请日：2008-07-10
申请人： KERMI GMBH , FOLGER CHRISTIAN , FONFARA HARALD , GRAU VOLKER , FELDMEIER DIETER
发明人： FOLGER CHRISTIAN , FONFARA HARALD , GRAU VOLKER , FELDMEIER DIETER
CPC分类号： F28F9/262 , F24D19/0002 , F24D19/0073 , F28D1/05333 , F28D1/05383 , F28D2021/0035 , F28F9/0217
摘要： The present invention relates to a tube radiator for the targeted and serial approach flow of at least two groups of essentially tubular heating elements.
摘要翻译：本发明涉及用于靶向和串行流动的散热管上的至少两个基团基本上管状加热元件。

4. 发明申请

WO9819085A3 VALVE BLOCK AND ASSOCIATED HEATING ELEMENT 审中-公开
标题翻译：阀块和相关加热元件
公开(公告)号：WO9819085A3
公开(公告)日：1998-10-29
申请号：PCT/EP9705967
申请日：1997-10-29
申请人： KERMI GMBH
发明人： FONFARA HARALD
IPC分类号： F16K11/20 , F24H9/12 , G05D23/02 , F16K1/00
CPC分类号： F24D19/0012 , F16K11/20 , G05D23/022
摘要： Disclosed is a valve block with a casing, comprising an inlet and an outlet as well as a closing device and, preferably, a valve head and a valve seat. Such a valve block has at least two inlets and at least two outlets (16a, 16b), while the closing device (18a, 24a) connects with each inlet and each outlet.

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