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    • 7. 发明申请
    • PROCESS FOR FORMING CONDUCTIVE TRACK OR COATING
    • 形成导电迹线或涂层的工艺
    • WO2017081449A1
    • 2017-05-18
    • PCT/GB2016/053485
    • 2016-11-08
    • JOHNSON MATTHEY PUBLIC LIMITED COMPANY
    • CELA GREVEN, BeatrizBOOTH, Jonathan Charles ShepleyNOWAK, NicolasJOHNSON, SimonDROSTE, Tobias
    • H01B1/22
    • H01B1/22
    • The invention relates to a process for forming a conductive track or coating on a substrate, comprising: applying a conductive paste to the substrate, the conductive paste comprising a solids portion dispersed in an organic medium, the solids portion comprising particles of electrically conductive material and an inorganic particle mixture comprising substantially crystalline particles of two or more different metal compounds, wherein the inorganic particle mixture includes substantially crystalline particles of a tellurium compound and is substantially lead free; and firing the applied conductive paste on the surface of the substrate with a firing profile in which the temperature of the surface of the applied conductive paste exceeds 500ºC for a period of two minutes or less. The invention further relates to a substrate having a conductive track or coating formed thereon.
    • 本发明涉及一种在基底上形成导电迹线或涂层的方法,包括:将导电膏施加到基底上,所述导电膏包含分散在有机介质中的固体部分,固体 其包含导电材料颗粒和包含两种或更多种不同金属化合物的基本结晶颗粒的无机颗粒混合物,其中所述无机颗粒混合物包括基本上碲化合物的结晶颗粒并且基本上无铅; 以及用所述导电糊表面的温度超过500℃的焙烧轮廓在所述基底的表面上焙烧涂覆的导电浆料两分钟或更少的时间。 本发明还涉及一种在其上形成有导电迹线或涂层的基底。