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    • 4. 发明申请
    • WIRELESS DOCKING MAT FOR ELECTRONIC DEVICES
    • 电子设备的无线对接垫
    • WO2018014284A1
    • 2018-01-25
    • PCT/CN2016/090837
    • 2016-07-21
    • INTEL CORPORATIONWONG, Hong W.NGUYEN, TimothyZHOU, ShaorongLIANG, XiaoguoKUO, Chia-Hung
    • WONG, Hong W.NGUYEN, TimothyZHOU, ShaorongLIANG, XiaoguoKUO, Chia-Hung
    • H02J50/00
    • In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.
    • 在一个示例中,用于电子设备的对接垫包括电子设备可定位于其上的第一主表面,无线电力传输设备以及包括逻辑的控制器,所述控制器至少部分地包括硬件逻辑 ,确定电子设备在对接垫的第一主表面上的位置,建立与电子设备的通信连接,从电子设备接收至少一个电荷参数,并且响应于电子设备激活无线电力发送设备 确定电子设备位于无线电力发送设备附近,并且至少一个电荷参数指示电子设备处于从无线电力发送设备接收电力的状态。 其他例子可以描述。
    • 5. 发明申请
    • REMEDIATION OF THERMAL IRREGULARITIES IN COMPUTING ENVIRONMENT
    • 在计算环境中解决热不便问题
    • WO2015149272A1
    • 2015-10-08
    • PCT/CN2014/074523
    • 2014-04-01
    • INTEL CORPORATIONZHOU, ShaorongWONG, Hong W.
    • ZHOU, ShaorongWONG, Hong W.
    • H05K7/20
    • G06F1/203G06F1/20H05K7/20154H05K7/20436
    • In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area.In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.
    • 在一个示例中,公开了一种计算设备,其中处理元件和其它有源设备可以产生诸如计算设备的外壳上的热点之类的热不规则性。 在某些情况下,这些热点可能从舒适性和可用性的观点来看是不希望的,或者因为它们可能导致对系统部件的热损伤。 为了修复包括热点在内的热不规则,可以在壳体或底盘中设置局部凹陷,以扩大热源周围的热源与底壳之间的气隙,使得热点处的底壳表皮温度可以 随着气隙的增加而降低。 散热器也可以设置在局部凹陷上方以更好地在表面区域上分布热量。在一些情况下,可以提供肋条以为布置在局部凹陷处的散热器提供结构支撑。