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1. 发明申请

WO2019132941A1 HYBRID FILTER HAVING AN ACOUSTIC WAVE RESONATOR EMBEDDED IN A CAVITY OF A PACKAGE SUBSTRATE 审中-公开
公开(公告)号：WO2019132941A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068814
申请日：2017-12-28
申请人： INTEL CORPORATION , DOGIAMIS, Georgios C. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , SWAN, Johanna M.
发明人： DOGIAMIS, Georgios C. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , SWAN, Johanna M.
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07 , H01L23/485 , H01L23/498
摘要： A hybrid filter having an acoustic wave resonator embedded in a cavity of a package substrate is described. In an example, a packaged system includes a package substrate having a die side and a land side opposite the die side. An active die is physically and electrically coupled to the die side of the package substrate. An acoustic wave resonator (AWR) device is in a cavity on the die side of the package substrate, the AWR device including an acoustic wave resonator (AWR) die. The AWR die includes an acoustic wave resonator wherein the AWR device is directly electrically coupled to the active die.

2. 发明申请

WO2019132937A1 HYBRID FILTERS AND PACKAGES THEREFOR 审中-公开
公开(公告)号：WO2019132937A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068795
申请日：2017-12-28
申请人： INTEL CORPORATION , KAMGAING, Telesphor , EID, Feras , DOGIAMIS, Georgios C. , NAIR, Vijay K. , SWAN, Johanna M.
发明人： KAMGAING, Telesphor , EID, Feras , DOGIAMIS, Georgios C. , NAIR, Vijay K. , SWAN, Johanna M.
IPC分类号： H03H9/145 , H03H9/64
CPC分类号： H03H9/0542 , H03H7/09 , H03H7/1766 , H03H7/1775 , H03H9/0552 , H03H9/0557 , H03H9/0561 , H03H9/1014 , H03H9/1071 , H03H9/542 , H03H2001/0085
摘要： Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter incudes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

3. 发明申请

WO2019132921A1 HYBRID FILTER ARCHITECTURE WITH INTEGRATED PASSIVES, ACOUSTIC WAVE RESONATORS AND HERMETICALLY SEALED CAVITIES BETWEEN TWO RESONATOR DIES 审中-公开
公开(公告)号：WO2019132921A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068725
申请日：2017-12-28
申请人： INTEL CORPORATION , DOGIAMIS, Georgios C. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , SWAN, Johanna M.
发明人： DOGIAMIS, Georgios C. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , SWAN, Johanna M.
IPC分类号： H03H9/145 , H03H9/25
摘要： Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.

4. 发明申请

WO2019132926A1 A FRONT END SYSTEM HAVING AN ACOUSTIC WAVE RESONATOR (AWR) ON AN INTERPOSER SUBSTRATE 审中-公开
公开(公告)号：WO2019132926A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068754
申请日：2017-12-28
申请人： INTEL CORPORATION , KAMGAING, Telesphor , NAIR, Vijay K. , EID, Feras , DOGIAMIS, Georgios C. , SWAN, Johanna M. , LEUSCHNER, Stephan
发明人： KAMGAING, Telesphor , NAIR, Vijay K. , EID, Feras , DOGIAMIS, Georgios C. , SWAN, Johanna M. , LEUSCHNER, Stephan
IPC分类号： H03H9/145 , H03H9/02
摘要： RF front end systems or modules with an acoustic wave resonator (AWR) on an interposer substrate are described. In an example, an integrated system includes an active die, the active die comprising a semiconductor substrate having a plurality of active circuits therein. An interposer is also included, the interposer comprising an acoustic wave resonator (AWR). A seal frame couples the active die to the interposer, the seal frame surrounding the acoustic wave resonator and hermetically sealing the acoustic wave resonator between the active die and the interposer.

5. 发明申请

WO2019132924A1 RF FRONT END MODULE INCLUDING HYBRID FILTER AND ACTIVE CIRCUITS IN A SINGLE PACKAGE 审中-公开
公开(公告)号：WO2019132924A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068750
申请日：2017-12-28
申请人： INTEL CORPORATION , EID, Feras , KAMGAING, Telesphor , DOGIAMIS, Georgios C. , NAIR, Vijay K. , SWAN, Johanna M.
发明人： EID, Feras , KAMGAING, Telesphor , DOGIAMIS, Georgios C. , NAIR, Vijay K. , SWAN, Johanna M.
IPC分类号： H03H9/64 , H03H9/25 , H03H9/145
摘要： Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

6. 发明申请

WO2018057007A1 DIE WITH EMBEDDED COMMUNICATION CAVITY 审中-公开
标题翻译：带有嵌入式通信腔的模具
公开(公告)号：WO2018057007A1
公开(公告)日：2018-03-29
申请号：PCT/US2016/053503
申请日：2016-09-23
申请人： NAIR, Vijay K. , RAORANE, Digvijay
发明人： NAIR, Vijay K. , RAORANE, Digvijay
IPC分类号： H01L25/065 , H01L23/522 , H01L23/538 , H01L23/66 , H01L23/00
摘要： Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include a substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.
摘要翻译：这里一般讨论的是包括通信腔的系统，设备和方法。根据一个示例，装置可以包括衬底，衬底具有在其中形成的第一空腔，暴露在空腔中并且被空腔包围的第一天线和第二天线以及形成在衬底上的互连结构，互连结构包括交替的导电材料层和层间介质层。

7. 发明申请

WO2018057026A1 DIE WITH EMBEDDED COMMUNICATION CAVITY 审中-公开
标题翻译：带有嵌入式通信腔的模具
公开(公告)号：WO2018057026A1
公开(公告)日：2018-03-29
申请号：PCT/US2016/053681
申请日：2016-09-26
申请人： NAIR, Vijay K. , RAORANE, Digvijay
发明人： NAIR, Vijay K. , RAORANE, Digvijay
IPC分类号： H01L25/065 , H01L25/10 , H01L23/66 , H01L23/538 , H01L23/552 , H01L23/00
摘要： Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.
摘要翻译：这里一般讨论的是包括通信腔的系统，设备和方法。根据一个实例，器件可以包括具有在其中形成的第一腔的衬底，暴露在腔中并由腔包围的第一和第二天线以及形成在衬底中的互连结构，互连结构包括交替的导电材料层和层间电介质层。

8. 发明申请

WO2018182753A1 ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES 审中-公开
公开(公告)号：WO2018182753A1
公开(公告)日：2018-10-04
申请号：PCT/US2017/025652
申请日：2017-04-01
申请人： INTEL CORPORATION
发明人： NAIR, Vijay K. , EID, Feras , SOUNART, Thomas L.
IPC分类号： H01L21/60 , H01L25/10 , H01L25/16 , H01L21/98 , H01L21/56
摘要： Electronics package device technology is disclosed. In one example, an electronics package device (202) comprises a substrate (206) supporting an electronics component (208) and an interconnect via (216a-c) electrically coupled to the electronics component such that at least a portion of the electronics component is disposed between the interconnect via and the substrate. The interconnect via can be directly coupled to the electronics component such that the interconnect via and the electronics component are vertically disposed between a second electronics package device (204) and the substrate. A second electronics package device can be stacked to the first electronics package device, and can comprise similar architecture of the interconnect via attached to the electronics component as with the first electronics package. Thus, 3D package size is significantly reduced. Associated systems and processes are disclosed.

9. 发明申请

WO2017171893A1 SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFFENER WITH AN EMI SHIELD FOR RF INTEGRATION 审中-公开
标题翻译：用于实施RF整合的具有EMI屏蔽的有机加速器的系统，方法和设备
公开(公告)号：WO2017171893A1
公开(公告)日：2017-10-05
申请号：PCT/US2016/025789
申请日：2016-04-02
申请人： INTEL CORPORATION
发明人： NAIR, Vijay K. , MALATKAR, Pramod
IPC分类号： H01L23/552 , H01L23/48
摘要： In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces and a ground plane therein; a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer; a heat pipe thermally interfaced to a top surface of the functional semiconductor die; one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heat pipe; in which the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die; and further in which the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form. Other related embodiments are disclosed.
摘要翻译：根据所公开的实施例，提供了用于实现具有用于RF集成的EMI屏蔽的有机加强件的方法，系统和设备。例如，根据一个实施例，存在一种装置，其中具有：其中具有电迹线和接地平面的衬底层; 与所述衬底层的电迹线电接合的功能半导体管芯; 与功能半导体管芯的顶表面热接合的热管; 一个或多个有机介电材料的中介层，电连接到基底层的接地平面并电连接到热管; 其中所述一个或多个中介层形成所述电磁屏蔽以电屏蔽所述功能半导体管芯; 并且进一步地，其中形成有机加强件的一个或多个中介层将机械地保持平面形式的基底层。披露了其他相关的实施例。

10. 发明申请

WO2018125150A1 HIGH FREQUENCY WAVEGUIDE STRUCTURE 审中-公开
公开(公告)号：WO2018125150A1
公开(公告)日：2018-07-05
申请号：PCT/US2016/069248
申请日：2016-12-29
申请人： INTEL CORPORATION
发明人： NAIR, Vijay K. , RAORANE, Digvijay Ashokkumar
IPC分类号： H01P3/12 , H01P3/08
摘要： An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.

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