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1. 发明申请

WO0199194A2 SEMICONDUCTOR ARRANGEMENT 审中-公开
标题翻译：半导体安排
公开(公告)号：WO0199194A2
公开(公告)日：2001-12-27
申请号：PCT/US0119242
申请日：2001-06-14
申请人： INFINEON TECHNOLOGIES CORP
发明人： REITHINGER MANFRED , KILLIAN MIKE , FRANKOWSKY GERD , TERLETZKI HARTMUND , STAHL ERNST , KIEHL OLIVER , VOGELSANG THOMAS , MUELLER GERHARD
IPC分类号： H01L21/8242 , H01L23/50 , H01L23/538 , H01L25/18 , H01L27/105 , H01L27/10 , H01L21/78 , H01L23/528
CPC分类号： H01L25/18 , H01L23/50 , H01L23/5382 , H01L27/105 , H01L27/10894 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted to the printed circuit board. The semiconductor package includes a fractional portion of a semiconductor wafer having a plurality of integrated circuit chips thereon, such chips being separated by regions in the fractional portion of the wafer. The fractional portion of the wafer has a plurality of electrical contacts electrically connected to the chips. The package also includes a dielectric member having an electrical conductor thereon. The electrical conductor are electrically connected to the plurality of electrical contacts of the plurality of chips to electrically interconnect such plurality of chips with portions of the electrical conductor spanning the regions in the fractional portion of the wafer. A connector is provided for electrically connecting the electrical conductor of the package to the electrical interconnect of the printed circuit board.
摘要翻译：半导体封装装置或模块包括其上具有电互连的印刷电路板和安装到印刷电路板的半导体封装。半导体封装包括其上具有多个集成电路芯片的半导体晶片的分数部分，这些芯片由晶片的部分部分中的区域分开。晶片的分数部分具有电连接到芯片的多个电触点。封装还包括其上具有电导体的电介质构件。电导体电连接到多个芯片的多个电触点，以将这种多个芯片与穿过晶片的分数部分中的区域的电导体的部分电互连。提供一种用于将封装的电导体电连接到印刷电路板的电互连的连接器。

2. 发明申请

WO0199188A3 SEMICONDUCTOR PACKAGE AND METHOD 审中-公开
标题翻译：半导体封装和方法
公开(公告)号：WO0199188A3
公开(公告)日：2003-04-24
申请号：PCT/US0119438
申请日：2001-06-18
申请人： INFINEON TECHNOLOGIES CORP
发明人： REITHINGER MANFRED , MUELLER GERHARD , KILLIAN MIKE , STAHL ERNST , FRANKOWSKY GERD , TERLETZKI HARTMUND , KIEHL OLIVER , VOGELSANG THOMAS
IPC分类号： H01L23/50 , H01L23/538 , H01L25/18 , H01L23/498 , H01L27/10
CPC分类号： H01L23/5382 , H01L23/50 , H01L25/18 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted to the printed circuit board. The semiconductor package includes a fractional portion of a semiconductor wafer 76having a plurality of integrated circuit chips thereon, such chips being separated by regions in the fractional portion of the wafer. The fractional portion of the wafer has a plurality of electrical contacts electrically connected to the chips. The package also includes a dielectric member having an electrical conductor thereon. The electrical conductor are electrically connected to the plurality of electrical contacts of the plurality of chips to electrically interconnect such plurality of chips with portions of the electrical conductor spanning the regions in the fractional portion of the wafer. A connector is provided for electrically connecting the electrical conductor of the package to the electrical interconnect of the printed circuit board.
摘要翻译：半导体封装装置或模块包括其上具有电互连的印刷电路板和安装到印刷电路板的半导体封装。半导体封装包括在其上具有多个集成电路芯片的半导体晶片76的分数部分，这些芯片由晶片的部分部分中的区域分隔开。晶片的分数部分具有电连接到芯片的多个电触点。封装还包括其上具有电导体的电介质构件。电导体电连接到多个芯片的多个电触头，以将这些多个芯片与跨越晶片的分数部分中的区域的电导体的部分电互连。提供一种用于将封装的电导体电连接到印刷电路板的电互连的连接器。

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