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    • 2. 发明申请
    • HEMT DEVICE AND METHOD
    • HEMT设备和方法
    • WO2015009576A1
    • 2015-01-22
    • PCT/US2014/046438
    • 2014-07-11
    • HRL LABORATORIES, LLC
    • KHALIL, Sameh G.CORRION, AndreaBOUTROS, Karim S.
    • H01L29/778
    • H01L29/66462H01L21/2654H01L21/30612H01L21/76895H01L29/2003H01L29/4236H01L29/7788H01L29/7789
    • A HEMT device comprising a III-Nitride material substrate, the surface of which follows a plane not parallel to the C-plane of the III-Nitride material; an epitaxial layer of III-Nitride material grown on said substrate; a recess etched in said epitaxial layer, having at least one plane wall parallel to a polar plane of the III-Nitride material; a carrier supply layer formed on a portion of the plane wall of the recess, such that a 2DEG region is formed along the portion of the plane wall of the recess; a doped source region formed at the surface of said epitaxial layer such that the doped source region is separated from said 2DEG region by a channel region of the epitaxial layer; a gate insulating layer formed on the channel region of the epitaxial layer; and a gate contact layer formed on the gate insulating layer.
    • 一种HEMT器件,其包括III-氮化物材料衬底,其表面遵循不平行于III-氮化物材料的C面的平面; 在所述衬底上生长的III-氮化物材料的外延层; 蚀刻在所述外延层中的凹槽,其具有平行于所述III-氮化物材料的极平面的至少一个平面壁; 形成在凹部的平面壁的一部分上的载体供给层,使得沿着凹部的平面壁的部分形成2DEG区域; 掺杂源区,形成在所述外延层的表面,使得所述掺杂源区与所述2DEG区分离由所述外延层的沟道区; 形成在所述外延层的沟道区上的栅极绝缘层; 以及形成在所述栅极绝缘层上的栅极接触层。