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1. 发明申请

WO2009058794A3 THERMAL INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热界面材料，生产方法及其用途
公开(公告)号：WO2009058794A3
公开(公告)日：2009-08-13
申请号：PCT/US2008081487
申请日：2008-10-29
申请人： HONEYWELL INT INC , BURNHAM KIKUE S , FAN WENYA
发明人： BURNHAM KIKUE S , FAN WENYA
IPC分类号： C08L83/04 , C08G77/00 , C08K3/08
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L71/02 , C08L2666/14 , C08L83/00
摘要： Thermal interface materials comprise at least one silicon-based polymer and are formed from a combination of at least one silicon-based material, at least one catalyst and at least one elasticity promoter. In some embodiments, contemplated materials are also formed utilizing at least one polymerization component. Thermal interface materials are also disclosed that are capable of withstanding temperatures of at least 250C where the material comprises at least one silicon-based polymer coupled with at least one elasticity promoter. Methods of forming these thermal interface materials comprise providing each of the at least one silicon-based material, at least one catalyst and at least one elasticity promoter, blending the components and optionally including the at least one polymerization component. Contemplated thermal interface materials disclosed are thermally stable, sticky, and elastic, and show a good thermal conductivity and strong adhesion when deposited on the high thermally conductive material. The thermal interface materials may then be utilized as formed or the materials may be cured pre- or post-application of the thermal interface material to the surface, substrate or component.
摘要翻译：热界面材料包括至少一种硅基聚合物，并且由至少一种硅基材料，至少一种催化剂和至少一种弹性促进剂的组合形成。在一些实施方案中，还使用至少一种聚合组分形成预期的材料。还公开了热界面材料，其能够耐受至少25℃的温度，其中该材料包含至少一种与至少一种弹性促进剂偶联的硅基聚合物。形成这些热界面材料的方法包括提供至少一种硅基材料，至少一种催化剂和至少一种弹性促进剂中的每一种，共混组分和任选地包含至少一种聚合组分。所公开的考虑的热界面材料是热稳定的，粘性的和弹性的，并且当沉积在高导热材料上时显示出良好的导热性和强粘附性。然后可以将热界面材料用作形成的材料，或者材料可以在将热界面材料施加到表面，基底或部件之前或之后固化。

2. 发明申请

WO2009058794A2 THERMAL INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热界面材料，其制造方法和用途
公开(公告)号：WO2009058794A2
公开(公告)日：2009-05-07
申请号：PCT/US2008081487
申请日：2008-10-29
申请人： HONEYWELL INT INC , BURNHAM KIKUE S , FAN WENYA
发明人： BURNHAM KIKUE S , FAN WENYA
IPC分类号： C08L83/04 , C08G77/00 , C08K3/08
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L71/02 , C08L2666/14 , C08L83/00
摘要： Thermal interface materials comprise at least one silicon-based polymer and are formed from a combination of at least one silicon-based material, at least one catalyst and at least one elasticity promoter. In some embodiments, contemplated materials are also formed utilizing at least one polymerization component. Thermal interface materials are also disclosed that are capable of withstanding temperatures of at least 250C where the material comprises at least one silicon-based polymer coupled with at least one elasticity promoter. Methods of forming these thermal interface materials comprise providing each of the at least one silicon-based material, at least one catalyst and at least one elasticity promoter, blending the components and optionally including the at least one polymerization component. Contemplated thermal interface materials disclosed are thermally stable, sticky, and elastic, and show a good thermal conductivity and strong adhesion when deposited on the high thermally conductive material. The thermal interface materials may then be utilized as formed or the materials may be cured pre- or post-application of the thermal interface material to the surface, substrate or component.
摘要翻译：热界面材料包含至少一种硅基聚合物并且由至少一种硅基材料，至少一种催化剂和至少一种弹性促进剂的组合形成。在一些实施例中，预期的材料也利用至少一种聚合组分形成。还公开了能够承受至少25℃的温度的热界面材料，其中材料包含至少一种与至少一种弹性促进剂偶联的基于硅的聚合物。形成这些热界面材料的方法包括提供所述至少一种硅基材料，至少一种催化剂和至少一种弹性促进剂中的每一种，混合所述组分并任选地包含所述至少一种聚合组分。所公开的热界面材料是热稳定的，粘性的和弹性的，并且当沉积在高导热材料上时显示出良好的导热性和强粘附性。然后可以如所形成的那样利用热界面材料，或者可以在将热界面材料应用到表面，衬底或部件之前或之后对材料进行固化。

3. 发明申请

WO2006101578A8 VAPOR PHASE TREATMENT OF DIELECTRIC MATERIALS 审中-公开
标题翻译：电介质材料的蒸汽相处理
公开(公告)号：WO2006101578A8
公开(公告)日：2008-02-07
申请号：PCT/US2006001561
申请日：2006-01-17
申请人： HONEYWELL INT INC , BHANAP ANIL S , GOLECKI ILAN , ENDISCH DENIS H , DANIELS BRIAN J , BURNHAM KIKUE S , ROTH ROBERT R
发明人： BHANAP ANIL S , GOLECKI ILAN , ENDISCH DENIS H , DANIELS BRIAN J , BURNHAM KIKUE S , ROTH ROBERT R
IPC分类号： H01L21/316 , C23C16/40 , C23C16/56 , H01L21/3105
CPC分类号： H01L21/02126 , C23C16/56 , H01L21/02203 , H01L21/02216 , H01L21/02219 , H01L21/02222 , H01L21/02282 , H01L21/02337 , H01L21/02359 , H01L21/3105 , H01L21/76814
摘要： The invention concerns a method for applying a surface modification agent composition for organosilicat
摘要翻译：本发明涉及一种应用有机硅酸盐的表面改性剂组合物的方法

4. 发明申请

WO2009131913A2 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：WO2009131913A2
公开(公告)日：2009-10-29
申请号：PCT/US2009041052
申请日：2009-04-18
申请人： HONEYWELL INT INC , BURNHAM KIKUE S , DANKERS LEA , WEISER MARTAIN WILLIAM
发明人： BURNHAM KIKUE S , DANKERS LEA , WEISER MARTAIN WILLIAM
IPC分类号： C08L63/00 , B32B27/38 , C08J5/00 , C08K3/10 , H01L21/00
CPC分类号： H01L24/31 , C08K3/10 , C08L63/00 , C08L2666/54 , C09J163/00 , H01L23/3737 , H01L23/42 , H01L24/29 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29393 , H01L2224/294 , H01L2224/29439 , H01L2224/29498 , H01L2224/83101 , H01L2224/83801 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01054 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/01083 , H01L2924/01064 , H01L2924/3512 , H01L2924/00014 , H01L2924/05032 , H01L2924/0503 , H01L2924/00012
摘要： A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent.
摘要翻译：可固化的热界面材料组合物包括环氧聚合物粘合剂基质; 高导电性填料; 低熔点焊料材料; 和基质材料改性剂。

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