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    • 2. 发明申请
    • COOLING APPARATUS
    • 冷却装置
    • WO2010087825A1
    • 2010-08-05
    • PCT/US2009/032350
    • 2009-01-29
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.PETERSON, Eric, C.RUBENSTEIN, Brandon
    • PETERSON, Eric, C.RUBENSTEIN, Brandon
    • G06F1/20H05K7/20G06F1/16
    • G06F1/20G06F2200/201H01L23/4006H01L23/473H01L2924/0002Y10T29/49002H01L2924/00
    • A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.
    • 公开了一种冷却装置。 该冷却装置包括印刷电路板(PC),其具有安装在PC板的顶侧上的集成电路(IC)插座。 大体上为板状的安装框架,其中穿过板的中心的第一开口安装在PC板的顶侧,IC插座位于第一开口的内部。 冷板连接到安装框架上,冷板具有穿过冷板的开口。 冷板中的开口尺寸设计成允许IC通过开口插入到IC插座中。 在冷板内形成流体通道。 流体入口和流体出口分别安装在冷板上并分别连接到流体通道的第一端和第二端。 其中所述散热器的底侧被配置成当IC安装在IC插座以接触的IC的顶侧的散热器可拆卸地附连到冷板的顶侧。