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1. 发明申请

WO2018026321A1 PROCESS FOR ELECTRICALLY CONNECTING THE CONTACT SURFACES OF ELECTRONIC COMPONENTS BY A BONDING WIRE HAVING AN ELECTRICALLY INSULATING COATING 审中-公开
标题翻译：使用具有电绝缘涂层的接合线将电子元件的接触表面电连接的方法
公开(公告)号：WO2018026321A1
公开(公告)日：2018-02-08
申请号：PCT/SG2017/000007
申请日：2017-07-07
申请人： HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： WEI TOK, Chee , SU, Dan , SARANGAPANI, Murali
IPC分类号： H01L21/60 , H01L23/49
摘要： A process for electrically connecting a contact surface of a first electronic component with a contact surface of a second electronic component comprising the subsequent steps: (1) ball-bonding a bonding wire having a diameter in the range of from 12 to 80 μιτ> to the contact surface of the first electronic component, (2) raising the ball-bonded bonding wire to produce an elongated and narrowed wire region still connected to the bonded ball, (3) disconnecting the ball and the bonding wire at the elongated and narrowed wire region by means of an EFO spark to produce and leave back a ball bump connected to the contact surface of the first electronic component, (4) ball-bonding the bonding wire with its disconnected end formed in step (3) to the contact surface of the second electronic component, (5) forming a wire loop between the ball bond formed in step (4) and the ball bump left back in step (3), and (6) stitch-bonding the bonding wire to the ball bump left back in step (3), wherein the bonding wire comprises a metal core with an outer electrically insulating coating, optionally with at least one thin layer of metal other than the core metal between the metal core surface and the outer electrically insulating coating, and wherein the core metal is selected from the group consisting of copper, silver, gold, a copper-based alloy, a silver-based alloy and a gold-based alloy.
摘要翻译：一种用于将第一电子部件的接触表面与第二电子部件的接触表面电连接的方法，其包括以下步骤：（1）将直径在该范围内的接合线球焊接到从12到80μm> （2）提升球焊接的接合线以产生仍与连接的球连接的细长且变窄的线区域，（3）在伸长和变窄的位置处断开球和接合线（4）将键合线与其在步骤（3）中形成的其断开的端部球形键合到接触表面（4），其中，所述键合区域通过EFO火花产生并退回连接到第一电子部件的接触表面的球形凸起（5）在步骤（4）中形成的球接合和在步骤（3）中留下的球凸块之间形成线环，以及（6）将接合线缝合到左侧的球凸起在步骤（3）中返回，其中接合线包括具有外部电绝缘涂层的金属芯，可选地在金属芯表面和外部电绝缘涂层之间具有除了芯金属之外的至少一个金属薄层，并且其中核心我 tal选自铜，银，金，铜基合金，银基合金和金基合金。

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