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1. 发明申请

WO2017091144A1 COATED WIRE 审中-公开
标题翻译：涂层电线
公开(公告)号：WO2017091144A1
公开(公告)日：2017-06-01
申请号：PCT/SG2016/000017
申请日：2016-09-16
申请人： HERAEUS ORIENTAL HITEC CO., LTD , HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： KANG, Il Tae , TARK, Yong-Deok , CHO, Mong Hyun , KIM, Jong Su , JUNG, Hyun Seok , KIM, Tae Yeop , ZHANG, Xi , SARANGAPANI, Murali
IPC分类号： B23K35/30 , B23K35/02 , C22C5/06 , H01L23/00 , C23C28/00 , C23C30/00
CPC分类号： B23K35/3006 , B23K35/0227 , B23K35/0261 , C22C5/06 , C22C5/08 , C23C28/021 , C25D5/10 , C25D5/12 , C25D5/50 , C25D7/0607 , H01L24/42 , H01L24/43 , H01L24/44 , H01L24/45 , H01L24/85 , H01L2224/05624 , H01L2224/45015 , H01L2224/45139 , H01L2224/45565 , H01L2224/45572 , H01L2224/45655 , H01L2224/45664 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2224/45644 , H01L2924/01029
摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface.
摘要翻译：包括具有表面的线芯的线，线芯具有在其表面上叠加的涂层。

2. 发明申请

WO2016091718A1 IMPROVED COATED COPPER WIRE FOR BONDING APPLICATIONS 审中-公开
标题翻译：改进的涂层铜线焊接应用
公开(公告)号：WO2016091718A1
公开(公告)日：2016-06-16
申请号：PCT/EP2015/078555
申请日：2015-12-03
申请人： HERAEUS DEUTSCHLAND GMBH & CO KG , HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： SARANGAPANI, Murali , SCHARF, Jürgen , THIRUNARAYANAN, Rajkumar , HARON, Ahmad Abdillah
IPC分类号： C23C28/02 , C25D3/48 , C25D3/50 , C25D7/06 , H01L23/00
CPC分类号： C23C28/023 , C23C18/1637 , C23C18/1651 , C25D3/48 , C25D3/50 , C25D5/10 , C25D5/34 , C25D7/0607 , H01L24/43 , H01L24/45 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45147 , H01L2224/4554 , H01L2224/45572 , H01L2224/45644 , H01L2224/45944 , H01L2224/45964 , H01L2224/48091 , H01L2224/48247 , H01L2224/48847 , H01L2224/49425 , H01L2224/49429 , H01L2924/00011 , H01L2924/181 , H01L2924/01203 , H01L2924/01047 , H01L2924/01079 , H01L2924/01015 , H01L2924/01012 , H01L2924/01058 , H01L2224/45664 , H01L2224/45639 , H01L2224/45669 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/00014 , H01L2924/00012 , H01L2924/013 , H01L2924/00 , H01L2924/2011 , H01L2924/01033
摘要： The present invention relates to a wire comprising a core with a surface, a first coating layer with a layer surface and a further coating layer, wherein A) the core comprises a) at least 99.95 wt.% of copper, b) an amount X of at least one element selected from silver and gold, c) an amount Y of at least one element selected from phosphorus, magnesium and cerium, wherein the ratio of X and Y is in the range of from 0.03 to 50; B) the first coating layer is composed of at least one element selected from the group comprising of palladium, platinum and silver, wherein the first coating layer is superimposed over the surface of the core, C) the further coating layer is superimposed over the layer surface of the first coating layer, wherein the further coating layer is composed of gold. The present invention further relates to a method for manufacturing a wire as aforementioned and to an electric device comprising the wire of the invention.
摘要翻译：本发明涉及包括具有表面的芯，具有层表面的第一涂层和另外的涂层的导线，其中A）芯包括a）至少99.95重量％的铜，b）量X 的至少一种选自银和金的元素，c）选自磷，镁和铈中的至少一种元素的量Y，其中X和Y的比例在0.03至50的范围内; B）第一涂层由选自钯，铂和银的组中的至少一种元素组成，其中第一涂层叠加在芯的表面上，C）另外的涂层叠加在该层上所述第一涂层的表面，其中所述另外的涂层由金构成。本发明还涉及如上所述的线材的制造方法以及包括本发明的线材的电气装置。

3. 发明申请

WO2018048344A1 COATED WIRE 审中-公开
标题翻译：涂层电线
公开(公告)号：WO2018048344A1
公开(公告)日：2018-03-15
申请号：PCT/SG2017/000008
申请日：2017-08-18
申请人： HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： LIM, Yee Weon , ZHANG, Xi , BALASUBRAMANIAN, Senthil Kumar , TAN, Suat Teng , LIAO, Jin Zhi , SU, Dan , TOK, Chee Wei , SARANGAPANI, Murali , SCHARF, Jurgen
IPC分类号： C25D5/10 , C25D7/06 , H01B1/02 , B23K35/30 , B23K35/02 , C22C5/06
摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1 ) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1 ) silver in an amount in the range of from > 99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 200 to 1000 nm thick outer layer of gold.
摘要翻译：一种包括具有表面的线芯的线，所述线芯具有叠加在其表面上的涂层，其中所述线芯本身由以下组成：（a）由（a1）银（a2）总量为0-100重量ppm的其它组分，或（b）由（b1）银以（b1）范围从＆gt; （b2）至少一种选自钙，镍，铂，钯，金，铜，铑和钌的掺杂元素，其总量为30-99.99重量％（b）总量为0-100重量ppm的（b）其他组分，或（c）由（d）含量为89.99-99.5重量％的银（c2）总量为0.5-10重量％的至少一种选自镍，铂，钯，金，铜，铑和钌的合金元素和（c3））总量为0-100重量ppm的其它组分，或（d）由（d1）银构成的掺杂银合金，其量在> （d2）至少一种选自钙，镍，铂，钯，金，铜，铑和钌的掺杂元素，其总量为30-90重量％（d3）总量为0.5-10重量％的至少一种选自镍，铂，钯，金，铜，铑和钌的合金元素和（d4）总量为0-100重量ppm的其他组分，其中所述至少一种掺杂元素（d2）不是所述至少一种合金元素（d3），其中所述单独量的任何其他组分小于30重量ppm，其中任何掺杂元素的单独量为至少30重量ppm，其中所有重量 - 重量％和重量-ppm的量都基于所述核的总重量，并且其中所述涂层是由1至1000nm的金内层和相邻的0.5至100nm厚的钯外层或由0.5至100nm厚的钯内层组成的双层组成的双层，和相邻的＆gt; 200至1000纳米厚的外层金。

4. 发明申请

WO2018026321A1 PROCESS FOR ELECTRICALLY CONNECTING THE CONTACT SURFACES OF ELECTRONIC COMPONENTS BY A BONDING WIRE HAVING AN ELECTRICALLY INSULATING COATING 审中-公开
标题翻译：使用具有电绝缘涂层的接合线将电子元件的接触表面电连接的方法
公开(公告)号：WO2018026321A1
公开(公告)日：2018-02-08
申请号：PCT/SG2017/000007
申请日：2017-07-07
申请人： HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： WEI TOK, Chee , SU, Dan , SARANGAPANI, Murali
IPC分类号： H01L21/60 , H01L23/49
摘要： A process for electrically connecting a contact surface of a first electronic component with a contact surface of a second electronic component comprising the subsequent steps: (1) ball-bonding a bonding wire having a diameter in the range of from 12 to 80 μιτ> to the contact surface of the first electronic component, (2) raising the ball-bonded bonding wire to produce an elongated and narrowed wire region still connected to the bonded ball, (3) disconnecting the ball and the bonding wire at the elongated and narrowed wire region by means of an EFO spark to produce and leave back a ball bump connected to the contact surface of the first electronic component, (4) ball-bonding the bonding wire with its disconnected end formed in step (3) to the contact surface of the second electronic component, (5) forming a wire loop between the ball bond formed in step (4) and the ball bump left back in step (3), and (6) stitch-bonding the bonding wire to the ball bump left back in step (3), wherein the bonding wire comprises a metal core with an outer electrically insulating coating, optionally with at least one thin layer of metal other than the core metal between the metal core surface and the outer electrically insulating coating, and wherein the core metal is selected from the group consisting of copper, silver, gold, a copper-based alloy, a silver-based alloy and a gold-based alloy.
摘要翻译：一种用于将第一电子部件的接触表面与第二电子部件的接触表面电连接的方法，其包括以下步骤：（1）将直径在该范围内的接合线球焊接到从12到80μm> （2）提升球焊接的接合线以产生仍与连接的球连接的细长且变窄的线区域，（3）在伸长和变窄的位置处断开球和接合线（4）将键合线与其在步骤（3）中形成的其断开的端部球形键合到接触表面（4），其中，所述键合区域通过EFO火花产生并退回连接到第一电子部件的接触表面的球形凸起（5）在步骤（4）中形成的球接合和在步骤（3）中留下的球凸块之间形成线环，以及（6）将接合线缝合到左侧的球凸起在步骤（3）中返回，其中接合线包括具有外部电绝缘涂层的金属芯，可选地在金属芯表面和外部电绝缘涂层之间具有除了芯金属之外的至少一个金属薄层，并且其中核心我 tal选自铜，银，金，铜基合金，银基合金和金基合金。

5. 发明申请

WO2017123153A2 COATED WIRE 审中-公开
标题翻译：涂层电线
公开(公告)号：WO2017123153A2
公开(公告)日：2017-07-20
申请号：PCT/SG2017/000001
申请日：2017-01-13
申请人： HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： LIAO, Jin Zhi , ZHANG, Xi , BAYARAS, Abito Danila , VINOBAJI, Sureshkumar , LIM, Yee Weon , TOK, Chee Wei
CPC分类号： H01L24/45 , B23K35/22 , B23K35/302 , B23K35/40 , C22C9/00 , C22F1/08 , H01L24/05 , H01L24/43 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45147 , H01L2224/45572 , H01L2924/01047 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/01015 , H01L2924/01029 , H01L2224/45664 , H01L2224/45644 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/01079 , H01L2924/01028 , H01L2924/01046 , H01L2924/01078 , H01L2924/01026 , H01L2924/01014 , H01L2924/01025 , H01L2924/01024 , H01L2924/01058 , H01L2924/01012 , H01L2924/01057 , H01L2924/01013 , H01L2924/01005 , H01L2924/0104 , H01L2924/01022 , H01L2924/01016 , H01L2924/013
摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) silver in an amount of from 0.1 to 0.3 wt.-%, (b) copper in an amount in the range of from 99.64 to 99.9 wt.-%, (c) phosphorus in an amount in the range of from 0 to 100 wt.-ppm, and (d) further components (components other than silver, copper and phosphorus) in an amount in the range of from 0 to 500 wt.-ppm, wherein the individual amount of any further component is less than 30 wt.-ppm, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, and wherein the coating layer is a double-layer comprised of an inner layer of palladium and an adjacent outer layer of gold, wherein the weight of the inner palladium layer is in the range of 1.5 to 2.5 wt.-%, relative to the weight of the wire core, and wherein the weight of the outer gold layer is in the range of 0.09 to 0.18 wt.-%, relative to the weight of the wire core.
摘要翻译：包括具有表面的线芯的线，所述线芯具有叠加在其表面上的涂层，其中线芯本身由以下组成：（a）0.1至0.3 （b）99.64至99.9重量％范围内的铜，（c）0至100重量ppm范围内的磷，和（d）进一步其中组分（银，铜和磷以外的组分）的量在0至500重量ppm的范围内，其中任何其他组分的单独量小于30重量ppm， - ％和wt.-ppm基于芯的总重量，并且其中涂层是由钯的内层和相邻的金的外层组成的双层，其中内钯层的重量相对于所述线芯的重量在1.5重量％至2.5重量％的范围内，并且其中所述外层金层的重量相对于所述线的重量在0.09重量％至0.18重量％的范围内 e线芯的重量。

6. 发明申请

WO2016022068A1 BALL-BOND ARRANGEMENT 审中-公开
标题翻译： BALL BOND ARRANGEMENT
公开(公告)号：WO2016022068A1
公开(公告)日：2016-02-11
申请号：PCT/SG2015/000134
申请日：2015-07-28
申请人： HERAEUS DEUTSCHLAND GMBH & CO. KG , HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： SARANGAPANI, Murali , ZHANG, Xi , YEUNG, Ping Ha , MILKE, Eugen
IPC分类号： H01L23/49
CPC分类号： H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48463 , H01L2224/48507 , H01L2224/48824 , H01L2224/85207 , H01L2924/00011 , H01L2924/14 , H01L2924/00015 , H01L2924/01201 , H01L2924/01014 , H01L2924/01029 , H01L2924/013 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/01046 , H01L2924/01204 , H01L2924/00014 , H01L2924/01013 , H01L2924/01078 , H01L2924/00013 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/01005
摘要： A ball-bond arrangement comprising an aluminum bond pad of a semiconductor device and a wire ball-bonded to the aluminum bond pad, wherein the wire has a diameter of 10 to 80 pm and comprises a core consisting of a copper alloy consisting of 0.05 to 3 wt.-% of palladium and/or platinum with copper as the remainder to make up 100 wt.-%.
摘要翻译：一种球形接合装置，包括半导体器件的铝接合焊盘和与所述铝接合焊盘接合的线材，其中所述电线具有10至80μm的直径，并且包括由铜合金构成的芯体，所述铜合金由0.05至 3重量％的钯和/或铂，其余为铜，以构成100重量％。

7. 发明申请

WO2017123153A3 COATED WIRE 审中-公开
公开(公告)号：WO2017123153A3
公开(公告)日：2017-07-20
申请号：PCT/SG2017/000001
申请日：2017-01-13
申请人： HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： LIAO, Jin Zhi , ZHANG, Xi , BAYARAS, Abito Danila , VINOBAJI, Sureshkumar , LIM, Yee Weon , TOK, Chee Wei
IPC分类号： C21D9/52 , C22C9/00 , H01L23/00 , B23K35/30 , B23K35/40 , B23K35/22
摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) silver in an amount of from 0.1 to 0.3 wt.-%, (b) copper in an amount in the range of from 99.64 to 99.9 wt.-%, (c) phosphorus in an amount in the range of from 0 to 100 wt.-ppm, and (d) further components (components other than silver, copper and phosphorus) in an amount in the range of from 0 to 500 wt.-ppm, wherein the individual amount of any further component is less than 30 wt.-ppm, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, and wherein the coating layer is a double-layer comprised of an inner layer of palladium and an adjacent outer layer of gold, wherein the weight of the inner palladium layer is in the range of 1.5 to 2.5 wt.-%, relative to the weight of the wire core, and wherein the weight of the outer gold layer is in the range of 0.09 to 0.18 wt.-%, relative to the weight of the wire core.

8. 发明申请

WO2017044042A1 CO-BASED ALLOY SPUTTERING TARGET HAVING BORIDE AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：具有硼的CO基合金溅射靶及其制造方法
公开(公告)号：WO2017044042A1
公开(公告)日：2017-03-16
申请号：PCT/SG2016/050407
申请日：2016-08-23
申请人： HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： LEE, Sanghak , XU, Jinling , KARUPPANNAGOUNDER, Arul Kumar , SURI, Pavan Kumar , OLSZEWSKI, James , APARNADEVI, Minisankar
IPC分类号： C22C19/07 , C22F1/10 , B22F9/00 , C23C14/34
CPC分类号： C22C32/0073 , B22F2003/1051 , B22F2998/10 , C22C19/07 , C22F1/10 , C23C14/3414 , C22C1/1042 , B22F3/105 , B22F3/15
摘要： The present invention relates to a sputtering target, comprising a single phase of a cobalt-based alloy, wherein the cobalt-based alloy comprises chromium and optionally platinum as an alloying element, and boride particles, wherein the boride particles have an average particle size of 10 µm or less and are dispersed in the cobalt-based alloy.
摘要翻译：本发明涉及一种溅射靶，其包括钴基合金的单相，其中所述钴基合金包含铬和任选的铂作为合金元素，以及硼化物颗粒，其中所述硼化物颗粒的平均粒径为 10μm以下，分散在钴系合金中。

9. 发明申请

WO2016091719A2 BONDING WIRE FOR A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于半导体器件的接合线
公开(公告)号：WO2016091719A2
公开(公告)日：2016-06-16
申请号：PCT/EP2015078557
申请日：2015-12-03
申请人： HERAEUS DEUTSCHLAND GMBH & CO KG , HERAEUS MATERIALS SINGAPORE PTE LTD
发明人： SARANGAPANI MURALI , PISIGAN LEGASPI , ZHANG XI , YEUNG PING HA , MILKE EUGEN
IPC分类号： C22C9/00
CPC分类号： C22C9/00 , C22F1/08 , C23C28/02 , H01B1/026 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/745 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45664 , H01L2224/45669 , H01L2224/48247 , H01L2924/00011 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01046 , H01L2924/01201 , H01L2224/45644 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/01204 , H01L2924/01028 , H01L2924/01078 , H01L2924/01033 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01026 , H01L2924/0104 , H01L2924/01057 , H01L2924/01058 , H01L2924/01202 , H01L2924/01203
摘要： The present invention relates to a wire, comprising a copper core comprising: al.silver in an amount in the range of from 0.05 to 1.3 wt.%; or a2. Palladium, and further at least one element selected from silver and gold, wherein the amount of silver is in the range of from 100 ppm to 1.3 wt.%, wherein the amount of gold is in the range of from 100 to 1500 ppm, and wherein the amount of palladium is in the range of from 0.5 to 1.5 wt.%; wherein all amounts in wt.% and ppm are based on the total weight of the core; wherein the core has an average size of crystal grains is in the range of from 3 to 30 μιη, the average size determined according to the line intercept method. The present invention further relates to a method for manufacturing a wire as aforementioned and to an electric device comprising the wire of the invention.
摘要翻译：本发明涉及一种电线，其包括铜芯，其包含：银的量在0.05至1.3重量％的范围内; 或a2。钯和另外至少一种选自银和金的元素，其中银的量在100ppm至1.3重量％的范围内，其中金的量在100至1500ppm的范围内，以及其中钯的量在0.5至1.5重量％的范围内; 其中以wt。％和ppm计的所有量都是基于芯的总重量计算的; 其中所述芯具有晶粒的平均尺寸在3至30μm的范围内，所述平均尺寸根据线截距法确定。本发明还涉及如上所述的线材的制造方法以及包括本发明的线材的电气装置。

10. 发明申请

WO2017095323A2 SILVER ALLOYED COPPER WIRE 审中-公开
标题翻译：银合金铜线
公开(公告)号：WO2017095323A2
公开(公告)日：2017-06-08
申请号：PCT/SG2016/000021
申请日：2016-11-11
申请人： HERAEUS MATERIALS SINGAPORE PTE., LTD.
发明人： LIAO, Jin Zhi , ZHANG, Xi , SARANGAPANI, Murali , TIRTONADY, Anthon , BAYARAS, Abito Danila , VINOBAJI, Sureshkumar , LOKE, Chee Keong , PHYU PHYU, Theint El , TOK, Chee Wei
IPC分类号： C22C9/00 , C22F1/08
CPC分类号： C22C9/00 , C22F1/08
摘要： A silver alloyed copper wire comprising a wire core, the wire core itself consisting of: (a) silver in an amount of from 0.3 to 0.7 wt.-%, (b) copper in an amount in the range of from 99.25 to 99.7 wt.-%, and (c) 0 to 500 wt.-ppm of further components, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core.
摘要翻译：包含线芯的银合金铜线，所述线芯本身由以下组成：（a）0.3至0.7重量％的银，（b） 99.25-99.7重量％的范围，和（c）0-500重量ppm的其它组分，其中所有重量％和wt.-ppm都基于芯的总重量。

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