会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • SELECTIVE REMOVAL OF NOBLE METALS USING ACIDIC FLUIDS, INCLUDING FLUIDS CONTAINING NITRATE IONS
    • 使用酸性液体,包括含有硝酸根离子的液体选择性去除金属
    • WO2016210051A8
    • 2017-02-02
    • PCT/US2016038896
    • 2016-06-23
    • GREENE LYON GROUP INC
    • MOSKOVCHENKO SVITLANABROSSEAU ANDRE
    • C22B3/06C01G5/00C01G7/00C22B3/08C22B3/10C22B11/00
    • C01G5/00C22B3/065C22B3/08C22B11/04C25C1/20C25C7/00Y02P10/234
    • The recovery of noble metal(s) from noble-metal-containing material is generally described. The noble metal(s) can be recovered selectively, in some cases, such that noble metal(s) is at least partially separated from non-noble-metal material within the material. Noble metal(s) may be recovered from noble-metal-containing material using mixtures of acids, in some instances. In some cases, the mixture can comprise nitric acid and/or another source of nitrate ions and at least one supplemental acid, such as sulfuric acid, phosphoric acid, and/or a sulfonic acid. The amount of nitrate ions within the mixture can be, in some instances, relatively small compared to the amount of supplemental acid within the mixture. In some cases, the recovery of noble metal(s) using the acid mixtures described herein can be enhanced by transporting an electric current between an electrode and the noble metal(s) of the noble-metal-containing material. In some cases, acid mixtures can be used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and/or scrap material comprising silver metal and tungsten metal.
    • 一般来说,从含贵金属的材料回收贵金属。 可以选择性地回收贵金属,在某些情况下,贵金属至少部分地与材料内的非贵金属材料分离。 在某些情况下,使用酸的混合物可以从含贵金属的材料中回收贵金属。 在一些情况下,混合物可以包含硝酸和/或另外的硝酸根离子源和至少一种补充酸,例如硫酸,磷酸和/或磺酸。 在一些情况下,与混合物内的补充酸的量相比,混合物内的硝酸根离子的量可以相对较小。 在一些情况下,可以通过在电极和含贵金属的材料的贵金属之间传输电流来增强使用本文所述的酸混合物回收贵金属。 在一些情况下,酸混合物可用于从特定类型的废料回收银,例如包含银金属和氧化镉的废料和/或包含银金属和钨金属的废料。
    • 3. 发明申请
    • ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PRINTED WIRE BOARDS USING LIQUID HEAT MEDIA
    • 使用液体热媒体从印刷电路板转移电子芯片和其他组件
    • WO2016022755A3
    • 2016-03-31
    • PCT/US2015043930
    • 2015-08-06
    • GREENE LYON GROUP INC
    • BROSSEAU ANDREMOSKOVCHENKO SVITLANA
    • B23K1/018
    • H05K13/0486B03B5/04B03B5/30B07C5/342B23K1/0016B23K1/018B23K2201/42
    • Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.
    • 通常描述使用液体热介质从PWB去除电子芯片和其它部件的系统和方法。 根据某些实施例,包括焊料的PWB可以定位在可旋转外壳内。 在一些实施例中,可旋转壳体可以至少部分地浸入液体热介质中。 液体热介质可以被加热和/或保持在足够高的温度以熔化焊料。 在一些实施例中,可旋转壳体可以在其至少部分地浸入液体热介质中的同时旋转。 根据一些实施例,旋转力可以帮助去除焊料,电子芯片(包括其中集成电路位于半导体材料如硅片上的那些)和/或附接到一个半导体材料的其它电子部件 或多个表面。