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    • 2. 发明申请
    • AN INTEGRATED CIRCUIT AND A MISALIGNMENT DETERMINATION SYSTEM FOR CHARACTERIZING THE SAME
    • 集成电路和用于表征其的MISALIGNMENT确定系统
    • WO2009130627A1
    • 2009-10-29
    • PCT/IB2009/051408
    • 2009-04-03
    • NXP B.V.HAUSSER, StefanEICHLER, ChristophVERMANDEL, Miguel
    • HAUSSER, StefanEICHLER, ChristophVERMANDEL, Miguel
    • G03F7/20
    • G03F7/70475G03F7/70633
    • A method comprising forming a first integrated circuit component (102) and a first misalignment test structure (104) on and/or in a first surface portion (106) of a substrate (108) using a first mask (110), forming a second integrated circuit component (112) and a second misalignment test structure (114) on and/or in a second surface portion (116) of the substrate (108) using a second mask (118), wherein the first misalignment test structure (104) and the second misalignment test structure (114) are formed to overlap one another, and determining potential misalignment between the first integrated circuit component (102) and the second integrated circuit component (112) based on an evaluation of an electric measurement indicative of a potential misalignment between the first misalignment test structure (104) and the second misalignment test structure (114).
    • 一种方法,包括使用第一掩模(110)在衬底(108)的第一表面部分(106)上和/或第一表面部分(106)上形成第一集成电路部件(102)和第一未对准测试结构(104),形成第二 使用第二掩模(118)在所述基板(108)的第二表面部分(116)上和/或第二表面部分(116)上的第二未对准测试结构(114)和第二未对准测试结构(114) 并且第二未对准测试结构(114)形成为彼此重叠,并且基于表示电位的电测量的评估来确定第一集成电路部件(102)和第二集成电路部件(112)之间的潜在的未对准 第一未对准测试结构(104)和第二未对准测试结构(114)之间的未对准。