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1. 发明申请

WO2006132382A2 FUNCTIONAL FILM CONTAINING STRUCTURE AND METHOD OF MANUFACTURING FUNCTIONAL FILM 审中-公开
标题翻译：功能膜包含结构和制造功能膜的方法
公开(公告)号：WO2006132382A2
公开(公告)日：2006-12-14
申请号：PCT/JP2006311669
申请日：2006-06-05
申请人： FUJI PHOTO FILM CO LTD , SAKASHITA YUKIO
发明人： SAKASHITA YUKIO
IPC分类号： C23C14/00
CPC分类号： H01L21/76251 , C23C14/0005 , Y10T428/24802
摘要： A method of manufacturing a functional film by which a functional film formed on a film formation substrate can be easily peeled from the film formation substrate. The method includes the steps of: (a) forming an electromagnetic wave absorbing layer (102) on a substrate (101) by using a material which absorbs an electromagnetic wave to generate heat; (b) forming a separation layer (103) on the electromagnetic wave absorbing layer (102) by using an inorganic material which is decomposed to generate a gas by being heated; (c) forming a layer to be peeled (104, 106, 107) containing a functional film (104, 106b, 107a); and (d) applying the electromagnetic wave toward the electromagnetic wave absorbing layer (102) so as to peel the layer to be peeled (104, 106, 107) from the substrate (101) or reduce bonding strength between the layer to be peeled (104, 106, 107) and the substrate (101).
摘要翻译：可以容易地从成膜基板剥离形成在成膜基板上的功能膜的功能膜的制造方法。该方法包括以下步骤：（a）通过使用吸收电磁波产生热量的材料在基板（101）上形成电磁波吸收层（102）; （b）通过使用通过加热分解产生气体的无机材料在电磁波吸收层（102）上形成分离层（103）; （c）形成含有功能膜（104,106b，107a）的被剥离层（104,106,107）; 和（d）向电磁波吸收层（102）施加电磁波，从基板（101）剥离被剥离层（104,106,107），或降低被剥离层 104,106,107）和基板（101）。

2. 发明申请

WO2006132379A3 STRUCTURE FOR FUNCTIONAL FILM PATTERN FORMATION AND METHOD OF MANUFACTURING FUNCTIONAL FILM 审中-公开
标题翻译：功能膜图形结构及制作功能薄膜的方法
公开(公告)号：WO2006132379A3
公开(公告)日：2007-05-03
申请号：PCT/JP2006311666
申请日：2006-06-05
申请人： FUJIFILM CORP , SAKASHITA YUKIO
发明人： SAKASHITA YUKIO
IPC分类号： H01L41/22 , H01L21/78 , H01L39/24 , H01L41/314
CPC分类号： H01L21/2007 , H01L21/31691 , H01L39/2422 , H01L41/313 , H01L41/314 , Y10T428/1486
摘要： A method of manufacturing a functional film which method enables formation of a fine pattern and endurance for a high-temperature process. The method includes the steps of: (a) preparing a substrate (101) in which a predetermined pattern is formed; (b) forming a separation layer (102, 202, 302) directly or indirectly on the substrate (101); (c) forming a layer to be peeled (103) containing a functional film (103), which is formed by using a functional material, on the separation layer (102); and (d) peeling the layer to be peeled (103) from the substrate (101) or reducing bonding strength between the layer to be peeled (103) and the substrate (101) by heating the separation layer (102), applying an electromagnetic wave toward the separation layer (202), or applying an external force to the separation layer (302).
摘要翻译：一种功能膜的制造方法，能够形成精细图案，耐久性高。该方法包括以下步骤：（a）制备其中形成预定图案的基底（101）; （b）在衬底（101）上直接或间接形成分离层（102,202,302）; （c）在分离层（102）上形成含有通过使用功能材料形成的功能膜（103）的要剥离的层（103）; 以及（d）通过加热所述分离层（102），从所述基板（101）剥离被剥离层（103）或降低所述被剥离层（103）与所述基板（101）之间的接合强度，朝向分离层（202）移动，或向分离层（302）施加外力。

3. 发明申请

WO2006132381A3 FUNCTIONAL FILM CONTAINING STRUCTURE AND METHOD OF MANUFACTURING FUNCTIONAL FILM 审中-公开
标题翻译：功能膜包含结构和制造功能膜的方法
公开(公告)号：WO2006132381A3
公开(公告)日：2007-04-12
申请号：PCT/JP2006311668
申请日：2006-06-05
申请人： FUJIFILM CORP , SAKASHITA YUKIO
发明人： SAKASHITA YUKIO
IPC分类号： H01L21/78 , H01L39/24 , H01L41/02 , H01L41/22 , H01L41/314 , H01L41/331
CPC分类号： H01L21/314 , H01L21/31691 , H01L21/318 , H01L21/76251 , H01L39/2422 , H01L41/313 , H01L41/314 , Y10T156/1158 , Y10T428/31815
摘要： A method of manufacturing a functional film by which a functional film formed on a film formation substrate can be easily peeled from the film formation substrate. The method includes the steps of: (a) forming a separation layer (102) on a substrate (101) by using an inorganic material which is decomposed to generate a gas by being applied with an electromagnetic wave; (b) forming a layer to be peeled (103, 105, 106) containing a functional film (103, 105b, 106a), which is formed by using a functional material, on the separation layer (102); and (c) applying the electromagnetic wave toward the separation layer (102) so as to peel the layer to be peeled (103, 105, 106) from the substrate (101) or reduce bonding strength between the layer to be peeled (103, 105, 106) and the substrate (101).
摘要翻译：可以容易地从成膜基板剥离形成在成膜基板上的功能膜的功能膜的制造方法。该方法包括以下步骤：（a）通过使用通过施加电磁波分解产生气体的无机材料在基板（101）上形成分离层（102）; （b）在分离层（102）上形成含有通过使用功能材料形成的功能膜（103,105b，106a）的被剥离层（103,105,106）; 和（c）向分离层（102）施加电磁波，以从基板（101）剥离被剥离层（103,105,106），或者降低被剥离层（103,105,106）的接合强度， 105,106）和基板（101）。

4. 发明申请

WO2006132380A3 FUNCTIONAL FILM CONTAINING STRUCTURE AND METHOD OF MANUFACTURING FUNCTIONAL FILM 审中-公开
标题翻译：功能膜包含结构和制造功能膜的方法
公开(公告)号：WO2006132380A3
公开(公告)日：2007-06-21
申请号：PCT/JP2006311667
申请日：2006-06-05
申请人： FUJIFILM CORP , SAKASHITA YUKIO
发明人： SAKASHITA YUKIO
IPC分类号： H01L41/22 , H01L21/78 , H01L39/24 , H01L41/02 , H01L41/24 , H01L41/314 , H01L41/331
CPC分类号： H01L21/31691 , H01L39/2422 , H01L41/314 , H01L41/331 , Y10T156/10 , Y10T428/1486 , Y10T428/31678
摘要： A method of manufacturing a functional film by which the functional film formed on a film formation substrate can be easily peeled from the film formation substrate. The method includes the steps of: (a) forming a separation layer (102) by using an inorganic material on a substrate (101) containing a material having heat tolerance to a predetermined temperature; (b) forming a layer to be peeled (103, 104) containing a functional film (103, 104b), which is formed by using a functional material, on the separation layer (102); and (c) performing heat treatment on a structure containing the substrate (101), the separation layer (102) and the layer to be peeled (103, 104) at the predetermined temperature so as to peel the layer to be peeled (103, 104) from the substrate (101) or reducing bonding strength between the layer to be peeled (103, 104) and the substrate (101).
摘要翻译：可以容易地从成膜基板剥离形成在成膜基板上的功能膜的功能膜的制造方法。该方法包括以下步骤：（a）通过在包含具有预定温度的耐热性的材料的基底（101）上使用无机材料形成分离层（102）; （b）在分离层（102）上形成含有通过使用功能材料形成的功能膜（103,104b）的要剥离的层（103,104）; 和（c）在预定温度下对包含基板（101），分离层（102）和待剥离层（103,104）的结构进行热处理，以剥离被剥离层（103,104） 104），或者降低被剥离层（103,104）与基板（101）之间的接合强度。

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