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1. 发明申请

WO2022261227A1 WAFER CONTAINER AND PURGE SYSTEM 审中-公开
公开(公告)号：WO2022261227A1
公开(公告)日：2022-12-15
申请号：PCT/US2022/032698
申请日：2022-06-08
申请人： ENTEGRIS, INC.
发明人： FULLER, Matthew A. , HARR, Colton J. , GALLAGHER, Gary , DOENGES, Peter D. , WILKIE, Thomas H.
IPC分类号： H01L21/673
摘要： In a wafer container, diffusers are positioned such that they are closer to a center line of the wafer container. This improves the distribution of purge gas within the wafer container. The diffusers can be positioned such that their position corresponds to a recessed central panel of the back wall. The diffusers can be positioned such that an angle between the diffusers relative to a center of a wafer contained within the wafer container is 60 degrees or less. The diffusers can be joined to purge ports by offset connectors oriented such that the diffusers are closer to the center line of the wafer container than the purge ports. The distance from each of the diffusers to the center line of the wafer container can be less than one fourth of a diameter of the wafer that the wafer container is configured to accommodate.

2. 发明申请

WO2023076156A1 METHOD AND DEVICE TO REGULATE PURGE INTO A CONTAINER 审中-公开
公开(公告)号：WO2023076156A1
公开(公告)日：2023-05-04
申请号：PCT/US2022/047562
申请日：2022-10-24
申请人： ENTEGRIS, INC.
发明人： FULLER, Matthew A. , SMITH, Mark V. , EGGUM, Shawn D. , WILKIE, Thomas H. , HARR, Colton J. , ZABKA, Michael C.
IPC分类号： H01L21/673
摘要： Substrate containers include purge flow distribution systems. The purge flow distribution systems can divide one or more input flows of purge gas to a plurality of gas distribution surfaces of a network of gas distribution devices. Methods of controlling purge can include configuring the substrate containers to provide determined purge gas flow rates at each of the gas distribution surfaces. The configuration can be performed using flow controls of the purge flow distribution systems. The purge gas flow rates can be determined based on purge performance parameters. A controller can direct the operation of the purge flow distribution systems. The controller and the substrate container can be combined in a substrate container purging system.

3. 发明申请

WO2017136743A8 CUSHION RETAINER FOR SUBSTRATE CONTAINER 审中-公开
公开(公告)号：WO2017136743A8
公开(公告)日：2017-08-10
申请号：PCT/US2017/016534
申请日：2017-02-03
申请人： ENTEGRIS, INC.
发明人： FULLER, Matthew , HARR, Colton J.
IPC分类号： H01L21/673
摘要： A substrate retainer (110) is provided which presents a substantially uniform contact face (128) that can accommodate a large variation in the location of substrate registration thereon. The uniform contact face (128) is allowed to deflect and compress in order to eliminates the prospect of substrates (114) being damaged by or becoming inadvertently pinched within the substrate retainer (110) or from being pressed too hard by the uniform contact face (128). With this arrangement, no adhesives or tapes are utilized, so there is no attendant out gassing of volatile organic compounds to contaminate the microenvironment, or complications due to incompatibility of such adhesives and tapes with washing processes.

4. 发明申请

WO2021178703A1 MANIFOLD FOR A SUBSTRATE CONTAINER 审中-公开
公开(公告)号：WO2021178703A1
公开(公告)日：2021-09-10
申请号：PCT/US2021/020924
申请日：2021-03-04
申请人： ENTEGRIS, INC.
发明人： FULLER, Matthew A. , HARR, Colton J. , DUTRO, Ian
IPC分类号： H01L21/673 , H01L21/677 , H01L21/67379 , H01L21/67386 , H01L21/67389 , H01L21/67393
摘要： A substrate container includes a shell defining an interior space and a manifold with an inlet and a gas distributing surface. The shell includes a front opening, a bottom wall, and a rear wall. The manifold is attached to the bottom wall and is closer to the front opening than the rear wall. The gas distributing surface is configured to distribute purge gas into the interior space. A method of purging an open substrate container includes supplying a first stream of purge gas to a manifold and supplying a second stream of purge gas to an interior space of the substrate container. The method also including the manifold distributing the purge gas of the first stream within the interior space of the substrate container.

5. 发明申请

WO2017136743A1 CUSHION RETAINER FOR SUBSTRATE CONTAINER 审中-公开
标题翻译：衬底容器用衬垫保持器
公开(公告)号：WO2017136743A1
公开(公告)日：2017-08-10
申请号：PCT/US2017/016534
申请日：2017-02-03
申请人： ENTEGRIS, INC. , FULLER, Matthew , HARR, Colton J.
发明人： FULLER, Matthew , HARR, Colton J.
IPC分类号： H01L21/673
CPC分类号： H01L21/67369
摘要： A substrate retainer (110) is provided which presents a substantially uniform contact face (128) that can accommodate a large variation in the location of substrate registration thereon. The uniform contact face (128) is allowed to deflect and compress in order to eliminates the prospect of substrates (114) being damaged by or becoming inadvertently pinched within the substrate retainer (110) or from being pressed too hard by the uniform contact face (128). With this arrangement, no adhesives or tapes are utilized, so there is no attendant out gassing of volatile organic compounds to contaminate the microenvironment, or complications due to incompatibility of such adhesives and tapes with washing processes.
摘要翻译：提供衬底保持器（110），该衬底保持器（110）具有基本上均匀的接触面（128），该接触面能够适应其上的衬底配准位置的大的变化。允许均匀的接触面（128）偏转和压缩，以消除衬底（114）被衬底保持器（110）损坏或无意中夹住或被均匀接触面（ 128）。采用这种安排，不使用粘合剂或胶带，因此没有伴随的挥发性有机化合物气体污染微环境，或由于这些粘合剂和胶带与洗涤过程不相容而引起的并发症。

6. 发明申请

WO2023076286A1 PURGE FLOW DISTRIBUTION SYSTEM FOR A SUBSTRATE CONTAINER AND METHOD FOR PERFORMING THE SAME 审中-公开
公开(公告)号：WO2023076286A1
公开(公告)日：2023-05-04
申请号：PCT/US2022/047746
申请日：2022-10-25
申请人： ENTEGRIS, INC.
发明人： SMITH, Mark V. , WILKIE, Thomas H. , HARR, Colton J. , FULLER, Matthew A. , EGGUM, Shawn D. , ZABKA, Michael C.
IPC分类号： H01L21/673
摘要： A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.

7. 发明申请

WO2022147114A1 REMOTE OPTIMIZATION OF PURGE FLOW RATES IN A CONTAINER 审中-公开
公开(公告)号：WO2022147114A1
公开(公告)日：2022-07-07
申请号：PCT/US2021/065497
申请日：2021-12-29
申请人： ENTEGRIS, INC.
发明人： FULLER, Matthew A. , BURGET, Nathan , REYNOLDS, Katerina Alexe , HARR, Colton J. , ZABKA, Michael C.
IPC分类号： H01L21/673 , H01L21/67 , H01L21/677
摘要： Optimizing purge flow parameters in a substrate container, includes streaming a purge working fluid into an interior of the substrate container, discharging the purge working fluid from the interior of the substrate container, and varying purge flow parameters of the purge working fluid for a predetermined period of time, detecting at least one environmental condition in the interior of the substrate container during the predetermined period of time, determining optimized purge flow parameters based on the varied purge flow parameters and the at least one detected environmental condition during the predetermined period of time, and adjusting the streaming and the discharging in accordance with the optimized purge flow parameters. The substrate container may include, for example, a front opening unified pod or a reticle pod.

8. 发明申请

WO2021016008A1 WAFER CUSHION 审中-公开
公开(公告)号：WO2021016008A1
公开(公告)日：2021-01-28
申请号：PCT/US2020/042060
申请日：2020-07-15
申请人： ENTEGRIS, INC.
发明人： HARR, Colton J. , FULLER, Matthew A.
IPC分类号： H01L21/673
摘要： Wafer cushions for use in wafer carriers include spring beams that include a first arm extending from the frame of the wafer cushion in a first direction and a second arm extending from the first arm in a second direction, and a wafer contact at the end of the second arm opposite where the second arm is joined to the first arm. The wafer cushion may contact a substrate within the wafer carrier only at the wafer contacts during normal conditions. The substrate may also contact secondary contact points on the second arm when a shock event occurs. The wafer contact can be v-groove style wafer contact. The wafer contact may include a contact surface having a convex surface where it is configured to contact the wafer.

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