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1. 发明申请

WO2003046951A3 PERFORMANCE POLYMER FILM INSERT MOLDING FOR FLUID CONTROL DEVICES 审中-公开
公开(公告)号：WO2003046951A3
公开(公告)日：2003-06-05
申请号：PCT/US2002/037966
申请日：2002-11-26
申请人： ENTEGRIS, INC. , BHATT, Sanjiv, M. , EGGUM, Shawn, D.
发明人： BHATT, Sanjiv, M. , EGGUM, Shawn, D.
IPC分类号： F16K25/00
摘要： The present invention relates generally to a system and method for including a thin protective containment polymer film (100), such as Peek in the molding process for fluid processing devices utilized in the semiconductor processing industry. The thermoplastic film of predetermined size and shape is selectively placed along a shaping surface (110) in a mold cavity (106) for alignment with a desired target surface of a molded material. The molding processes causes a surface of the film (100) to bond to a contact surface of the moldable material such that the film (100) is permanently adhered to the moldable material. As a result, a comparable polymer film can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing prevention, rigidity enhancement, fluid absorption prevention, ultraviolet resistance, friction reduction and the like is needed.

2. 发明申请

WO2003046952A3 SEMICONDUCTOR COMPONENT HANDLING DEVICE HAVING AN ELECTROSTATIC DISSIPATING FILM 审中-公开
公开(公告)号：WO2003046952A3
公开(公告)日：2003-06-05
申请号：PCT/US2002/038076
申请日：2002-11-26
申请人： ENTEGRIS, INC , BHATT, Sanjiv, M. , EGGUM, Shawn, D.
发明人： BHATT, Sanjiv, M. , EGGUM, Shawn, D.
IPC分类号： B29C45/14
摘要： A system and method for including a thin conductive polymer film (10), such as carbon-filled PEEK, in the molding process for handlers (34), transporters, carriers, trays (36) and like devices utilized in the semiconductor processing industry. The conductive film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material (30). The molding process causes a surface of the film (10) to bond to a contact surface of the moldable material (30) such that the film is permanently adhered to the moldable material. As a result, a compatible conductive polymer can be selectively bonded only to those target surfaces where electrostatic dissipation is needed.

3. 发明申请

WO2003046952A2 SEMICONDUCTOR COMPONENT HANDLING DEVICE HAVING AN ELECTROSTATIC DISSIPATING FILM 审中-公开
标题翻译：具有静电消散薄膜的半导体元器件处理器件
公开(公告)号：WO2003046952A2
公开(公告)日：2003-06-05
申请号：PCT/US2002/038076
申请日：2002-11-26
申请人： ENTEGRIS, INC , BHATT, Sanjiv, M. , EGGUM, Shawn, D.
发明人： BHATT, Sanjiv, M. , EGGUM, Shawn, D.
IPC分类号： H01L
CPC分类号： H01L21/67323 , H01L21/6733 , H01L21/67366 , H01L21/67396
摘要： The present invention relates generally to a system and method for including a thin conductive polymer film, such carbon-filled PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The conductive film of predetermined size and shape is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable material. The molding process causes a surface of the film to bond to a contact surface of the moldable material such that the film is permanently adhered to the moldable material. As a result, a compatible conductive polymer can be selectively bonded only to those target surfaces where ESD is needed.
摘要翻译：本发明一般涉及一种用于在半导体加工工业中使用的处理机，运输机，载体，托盘等器件的成型工艺中包含薄导电聚合物膜，这种填充碳的PEEK的系统和方法。预定尺寸和形状的导电膜选择性地沿着模腔中的成形表面放置，以与可模制材料的期望目标表面对准。成型工艺使得膜的表面粘合到可模制材料的接触表面，使得膜永久地粘附到可模制材料上。结果，可以将兼容的导电聚合物选择性地结合到需要ESD的那些目标表面上。

4. 发明申请

WO2003046950A2 SEMICONDUCTOR COMPONENT HANDLING DEVICE HAVING A PERFORMANCE FILM 审中-公开
标题翻译：具有性能膜的半导体元器件处理器件
公开(公告)号：WO2003046950A2
公开(公告)日：2003-06-05
申请号：PCT/US2002/037860
申请日：2002-11-26
申请人： ENTEGRIS, INC. , BHATT, Sanjiv, M. , EGGUM, Shawn, D.
发明人： BHATT, Sanjiv, M. , EGGUM, Shawn, D.
IPC分类号： H01L
CPC分类号： H01L21/67323 , H01L21/6733 , H01L21/67346 , H01L21/67366
摘要： The present invention relates generally to a system and method for including a thin protective containment thermopolymer film, such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film of predetermined size and shape is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable material. The molding process causes a surface of the film to bond to a contact surface of the moldable material such that the film is permanently adhered to the moldable material. As a result, a compatible polymer film can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.
摘要翻译：本发明一般涉及一种用于在半导体加工工业中使用的处理机，运输商，载体，托盘等装置的成型工艺中包括诸如PEEK的薄保护性保温热聚合物膜的系统和方法。具有预定尺寸和形状的热塑性薄膜选择性地沿着模腔中的成形表面放置，以与可模制材料的所需目标表面对准。成型工艺使得膜的表面粘合到可模制材料的接触表面，使得膜永久地粘附到可模制材料上。结果，可以将兼容的聚合物膜选择性地结合到那些目标表面，其中耐磨性，耐热性，耐化学性，放气容纳性，刚性增强，硬度，蠕变减少，液体吸收抑制等性能特性是需要。

5. 发明申请

WO2003041937A1 COMPOSITE KINEMATIC COUPLING 审中-公开
标题翻译：复合动力学耦合
公开(公告)号：WO2003041937A1
公开(公告)日：2003-05-22
申请号：PCT/US2002/024505
申请日：2002-08-05
申请人： ENTEGRIS, INC. , BHATT, Sanjiv, M. , EGGUM, Shawn, D.
发明人： BHATT, Sanjiv, M. , EGGUM, Shawn, D.
IPC分类号： B29C45/14
CPC分类号： B29C45/14 , B29C45/14311 , B29C45/16 , B29C45/1657 , B29K2995/0087 , B29L2031/16 , G03F7/70691 , G03F7/708 , H01L21/67379 , H01L21/67775 , H01L21/68
摘要： The kinematic coupling of the present invention may comprise a wafer carrier base plate (100) comprising a first material, and a mounting plate (102) and multiple contact components (104). The mounting plate (102) has multiple recesses (118) corresponding to the number of contacts (104), each recess (118) provided with a protrusion (116) for engaging the bore of a respective contact component (104). The contact component (104) comprises a second material having a lower coefficient of friction than the first material. The contact component (104) may comprise an interior surface (108) with a contact surface (106) that converges as the interior surface (108) deepens. The contact component (104) may be provided to the base plate (100) as part of an over-molding, snap-in-place, staking, ultrasonic weld, or adhesive operation and held in place by mechanical interlocking.
摘要翻译：本发明的运动耦合可以包括包括第一材料和安装板（102）和多个接触部件（104）的晶片载体基板（100）。安装板（102）具有对应于触头数量（104）的多个凹部（118），每个凹部（118）设置有用于接合相应接触部件（104）的孔的突起（116）。接触部件（104）包括具有比第一材料低的摩擦系数的第二材料。接触部件（104）可以包括内表面（108），其具有当内表面（108）加深时会聚的接触表面（106）。接触部件（104）可以作为过模制，卡合就位，铆接，超声波焊接或粘合操作的一部分提供给基板（100），并通过机械联锁保持在适当位置。

6. 发明申请

WO2003046950A3 SEMICONDUCTOR COMPONENT HANDLING DEVICE HAVING A PERFORMANCE FILM 审中-公开
公开(公告)号：WO2003046950A3
公开(公告)日：2003-06-05
申请号：PCT/US2002/037860
申请日：2002-11-26
申请人： ENTEGRIS, INC. , BHATT, Sanjiv, M. , EGGUM, Shawn, D.
发明人： BHATT, Sanjiv, M. , EGGUM, Shawn, D.
IPC分类号： A47G19/08
摘要： The present invention relates generally to a system and method for including a thin protective containment thermopolymer film (10), such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material. The film is permanently adhered to the moldable material. As a result, a compatible polymer film (10) can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.

7. 发明申请

WO2003045673A1 INFORMATIONAL POLYMER FILM INSERT MOLDING 审中-公开
标题翻译：信息聚合物薄膜INSERT MOLDING
公开(公告)号：WO2003045673A1
公开(公告)日：2003-06-05
申请号：PCT/US2002/037865
申请日：2002-11-26
申请人： ENTEGRIS, INC. , BHATT, Sanjiv, M. , EGGUM, Shawn, D.
发明人： BHATT, Sanjiv, M. , EGGUM, Shawn, D.
IPC分类号： B29D22/00
CPC分类号： B29C45/14688 , B29C37/0032 , B29C45/14811 , B29C2045/14713 , B29C2045/14737 , B29C2045/14852 , B29K2715/006 , B29K2995/002 , B29K2995/0026 , B29K2995/0087 , B29L2009/00
摘要： A system and method for using a thin polymer film member (34) to bond indicia (36) in the molding process for manufacturing wafer containers (10) and other plastic articles for use in the semi-conductor manufacturing industry, and particularly such articles for use in semiconductor fabrication clean room environments. The system and method enables multicolored indicia and unique electronically readable indicia to be blonded to the article, while also providing a protective containment barrier to inhibit process contamination stemming from the indicia and to protect the indicia from physical damage.
摘要翻译：一种使用薄聚合物膜构件（34）在模制过程中结合标记（36）以制造晶片容器（10）和用于半导体的其他塑料制品的系统和方法制造业，特别是用于半导体制造洁净室环境中的这类制品。该系统和方法使多色标记和独特的电子可读标记能够被包裹到物品中，同时还提供保护性屏障以抑制源自标记的过程污染并保护标记免受物理损害。

8. 发明申请

WO2006033741A2 FUEL CELL MANIFOLD 审中-公开
标题翻译：燃料电池管理
公开(公告)号：WO2006033741A2
公开(公告)日：2006-03-30
申请号：PCT/US2005/029677
申请日：2005-08-22
申请人： ENTEGRIS, INC. , EGGUM, Shawn, D. , JOHNSON, Michael, W.
发明人： EGGUM, Shawn, D. , JOHNSON, Michael, W.
IPC分类号： H01M2/02 , B65B43/42 , E03B11/00 , F03B11/02
CPC分类号： H01M8/2485 , H01M8/02 , H01M8/04007 , H01M8/04089 , Y10T137/4807 , Y10T137/8593
摘要： A manifold for a fuel cell includes at least one floating manifold port disposable in an oversized opening defined in a manifold frame, the manifold port being shiftable in at least one plane relative to the oversized opening for reducing the positional tolerance requirement of the manifold port, thereby effecting enhanced mating of adjacent fuel cell components. A method of forming a manifold for a fuel cell is further included.
摘要翻译：用于燃料电池的歧管包括至少一个浮动歧管端口，其一次性地限定在歧管框架中的过大的开口中，歧管端口可相对于过大的开口在至少一个平面中移位，以减小歧管端口的位置公差要求，从而实现相邻燃料电池组件的增强配合。还包括形成用于燃料电池的歧管的方法。

9. 发明申请

WO2005043660A1 CONNECTOR ASSEMBLY FOR FLUID TRANSFER 审中-公开
标题翻译：用于流体转移的连接器组件
公开(公告)号：WO2005043660A1
公开(公告)日：2005-05-12
申请号：PCT/US2004/036279
申请日：2004-11-01
申请人： ENTEGRIS, INC. , EGGUM, Shawn, D.
发明人： EGGUM, Shawn, D.
IPC分类号： H01M8/00
CPC分类号： H01M8/04201 , H01M8/04216 , H01M8/1011 , H01M2250/30 , Y02B90/18 , Y02E60/523 , Y10T137/0318
摘要： A fuel cell system has an improved connector assembly to provide for the quick connection of a fuel cartridge and the fuel cell. Two leak resistant connector members with an easy to engage coupling mechanism that stably grips the two connector members to provide for flow between the member. The first connector member is adapted to engage the second connector member to fo a unitary structure, which can establish fluid communication between the connector members. Generally, both the first connector member and the second connector member comprise a fluid flow path that can be each sealed/unsealed by a poppet valve or other suitable valve members. In some embodiments, the connector members can a engaged/disengaged by rotating an element of the coupling mechanism. The connector assemblies can be particularly useful for the connection of a fuel cell with a fuel cartridge.
摘要翻译：燃料电池系统具有改进的连接器组件以提供燃料盒和燃料电池的快速连接。两个防漏连接器构件具有易于接合的连接机构，其稳定地夹持两个连接器构件以提供构件之间的流动。第一连接器构件适于接合第二连接器构件以形成一体式结构，该一体式结构可建立连接器构件之间的流体连通。通常，第一连接器构件和第二连接器构件均包括流体流动路径，该流体流动路径可以分别通过提升阀或其他合适的阀构件密封/解封。在一些实施例中，连接器构件可以通过旋转连接机构的元件而接合/脱离。连接器组件对于燃料电池与燃料盒的连接特别有用。

10. 发明申请

WO2003042073A1 WAFER SUPPORT ATTACHMENT FOR A SEMI-CONDUCTOR WAFER TRANSPORT CONTAINER 审中-公开
标题翻译：半导体输送器运输容器的支架附件
公开(公告)号：WO2003042073A1
公开(公告)日：2003-05-22
申请号：PCT/US2002/036407
申请日：2002-11-13
申请人： ENTEGRIS, INC. , EGGUM, Shawn, D.
发明人： EGGUM, Shawn, D.
IPC分类号： B65D85/90
CPC分类号： H01L21/67383 , Y10S414/135 , Y10T29/4984 , Y10T29/49844 , Y10T29/49998
摘要： A wafer container (100) for supporting semi-conductor wafer disks. Wafer supports (120, 122) are positioned within an enclosure portion (102) having a plurality of vertically stacked shelves for defining slots (124, 126). The wafer supports are secured within the enclosure portion rigidly at the bottom margin and resiliently at the top margin.
摘要翻译：一种用于支撑半导体晶片盘的晶片容器（100）。晶片支撑件（120,122）定位在具有用于限定狭槽（124,126）的多个垂直堆叠的货架的外壳部分（102）内。晶片支撑件牢固地固定在外壳部分的底部边缘处并且弹性地固定在顶部边缘处。

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