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    • 1. 发明申请
    • DRILLING HOLES WITH MINIMAL TAPER IN CURED SILICONE
    • 用固化硅胶中的最小水龙头钻孔
    • WO2013096372A1
    • 2013-06-27
    • PCT/US2012/070470
    • 2012-12-19
    • ELECTRO SCIENTIFIC INDUSTRIES, INC.
    • NOEL, M. ShaneSECOY, Todd C.
    • B23K26/38
    • B23K26/402B23K26/388B23K26/389B23K2203/42B23K2203/50
    • A laser machining system is used to precision laser drill holes in an elastomeric material, preferably silicone rubber, to form holes to support miniature electronic components temporarily while they are being processed or tested. The holes are formed by directing laser pulses from a laser to a top surface of the elastomeric material in a plurality of passes in a direction proceeding from a non-zero inner diameter to the desired diameter or from the desired diameter to the inner diameter. The plurality of passes forms a first pattern such that a successive pass of the plurality of passes overlaps a previous pass of the plurality of passes. The first pattern is repeated without a direction change or the first pattern is repeated while reversing the direction of the plurality of passes until the hole is formed through a bottom surface of the elastomeric material.
    • 激光加工系统用于将弹性体材料(优选硅橡胶)中的激光钻孔精确地形成孔,以在处理或测试时临时支撑微型电子部件。 通过在从非零内径到期望直径或从所需直径到内径的方向上以多次通过将激光脉冲从激光引导到弹性体材料的顶表面而形成孔。 多个通道形成第一图案,使得多个通道的连续通过与多个通过的先前通过重叠。 在没有方向改变的情况下重复第一图案或重复第一图案,同时反转多个通道的方向,直到孔通过弹性体材料的底表面形成。