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1. 发明申请

WO2008145804A3 INTERFERENCE SHIELDED ELECTRONICS MODULE AND METHOD FOR PROVIDING THE SAME 审中-公开
公开(公告)号：WO2008145804A3
公开(公告)日：2008-12-04
申请号：PCT/FI2008/000059
申请日：2008-05-26
申请人： ELCOTEQ SE , LEHTIMÄKI, Kaija , MAAKANSAS, Greta , HEIKONEN, Mikko , MÄKELÄ, Kimmo
发明人： LEHTIMÄKI, Kaija , MAAKANSAS, Greta , HEIKONEN, Mikko , MÄKELÄ, Kimmo
IPC分类号： H05K9/00 , H05K1/02 , H05K3/00 , H01L23/552
摘要： Interference shielded, for example a RFI and/or EMI shielded, electronics module, such as a circuit board (10) or a printed circuit or a corresponding electronics module, which interference shield forms a contact (4) with at least one edge zone (11) of the circuit board layers (12, 13, 14) of the circuit board, which contact functions in the electronics module as a means of grounding and which circuit board comprises: an outermost electrically conductive layer (3) providing the interference shield of the electronics module; at least one circuit card layer (12, 13, 14) unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer: and encapsulating activation material layer (2), which is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer (12), and which is arranged into a space between the outermost layer (3) and topmost circuit board layer (12) to be therein conformingly against the inner surface of the outermost layer (3) for isolating the electronic components and the wiring pattern from outermost layer, whereby for providing the interference shield, there is a direct conductive contact (4) at the side edge (21) of the circuit board between the outermost layer (3) and the edge zone (11) of the circuit board layer (12, 13, 14) providing the grounding. Characteristic to the shielded module is that the outermost shield layer (3) is essentially a single-layered covering and an outermost surface layer of the circuit board unit (10). Characteristic to the method is that the same comprises steps: a panel (1) comprising several circuit board units (10) is covered by an encapsulating layer (2); individual circuit boards (10) are separated from the panel along separation lines (A-A, B-B) of the circuit board units; and a surrounding shield layer is applied as the outermost layer, which forms an electrically conductive interference shield.

2. 发明申请

WO2012085347A1 METHOD AND APPARATUS FOR PERFORMING AN OPERATION AIMED AT A PART OF AN ELECTRONIC STRUCTURE 审中-公开
标题翻译：用于在电子结构的一部分执行操作的方法和装置
公开(公告)号：WO2012085347A1
公开(公告)日：2012-06-28
申请号：PCT/FI2011/051138
申请日：2011-12-20
申请人： TEKNOLOGIAN TUTKIMUSKESKUS VTT , JOKELAINEN, Kimmo , MOILANEN, Ville , VASALA, Hannu , MÄKELÄ, Kimmo , HAAPALAINEN, Ahti
发明人： JOKELAINEN, Kimmo , MOILANEN, Ville , VASALA, Hannu , MÄKELÄ, Kimmo , HAAPALAINEN, Ahti
IPC分类号： H01L21/67 , H05K13/00 , H01L21/66
CPC分类号： H01L21/67294 , H01L21/681 , H01L22/20 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： In the method at least one operation requiring location precision aimed at a part (10, 80) of an electronic structure is performed in a serial production apparatus for electronic structures. The operation can be printing of solder paste, dosing solder paste, assembling an electronic component, die bonding, wire bonding, tuning an electronic structure or protecting an electronic component by dispensing. The part of the electronic structure has an operation area (81), where the operation requiring location precision is aimed. The part of the electronic device can for example be a circuit board, the operation area of which is the circuit layout of the circuit board, whereby the method comprises defining the geometry of the circuit layout and the operation is aimed at the circuit layout area. The part of the electronic structure is moved into a standard position in the working area of the processing unit (100, 110, 120, 150, 160, 170), the geometry of the operation area of the part of the electronic structure is defined using computer vision technology (38) and the processing unit is used to perform the location precise operation aimed at the operation area of the part of the electronic structure. The defining of the geometry of the operation area of at least one part of an electronic structure and the operation requiring location precision aimed at the operation area of at least one second part of an electronic structure are performed at least partly at the same time. The method comprises utilising a predefined geometry of the operation area of the part of the electronic structure for performing the operation in a location precise manner in the operation area.
摘要翻译：在该方法中，在用于电子结构的串行生产设备中执行需要针对电子结构的部分（10,80）的位置精度的至少一个操作。该操作可以是印刷焊膏，计量焊膏，组装电子部件，芯片接合，引线接合，调整电子结构或通过分配来保护电子部件。电子结构的一部分具有操作区域（81），其中针对要求位置精度的操作。电子设备的部分可以例如是电路板，其操作区域是电路板的电路布局，由此该方法包括限定电路布局的几何形状，并且操作针对电路布局区域。电子结构的一部分移动到处理单元（100,110,120,150,160,170）的工作区域中的标准位置，电子结构部分的操作区域的几何形状使用计算机视觉技术（38）和处理单元用于执行针对电子结构部分操作区域的位置精确操作。至少部分地同时执行电子结构的至少一部分的操作区域的几何形状的定义和针对电子结构的至少一个第二部分的操作区域的位置精度的操作。该方法包括利用电子结构部分的操作区域的预定几何形状，以便在操作区域中精确地进行位置的操作。

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