专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2005119810A3 LINEAR LASER LIGHT BEAM FOR MAKING OLEDS 审中-公开
标题翻译：线性激光灯用于制造OLED
公开(公告)号：WO2005119810A3
公开(公告)日：2006-04-06
申请号：PCT/US2005017013
申请日：2005-05-12
申请人： EASTMAN KODAK CO , KAY DAVID BLAIR , BURBERRY MITCHELL STEWART , RIVERS ANDREA S , BOROSON MICHAEL LOUIS , TUTT LEE WILLIAM , PHELAN GIANA MARIE , HAAS DANIEL DILLON , NGUYEN KELVIN , PHILLIPS BRADLEY ALLEN
发明人： KAY DAVID BLAIR , BURBERRY MITCHELL STEWART , RIVERS ANDREA S , BOROSON MICHAEL LOUIS , TUTT LEE WILLIAM , PHELAN GIANA MARIE , HAAS DANIEL DILLON , NGUYEN KELVIN , PHILLIPS BRADLEY ALLEN
IPC分类号： H01L51/00 , H01L51/30 , H01L51/56 , H05B6/00 , H01L51/40 , B41M5/26
CPC分类号： H01L51/0013 , C23C14/048 , H01L51/0052 , H01L51/0059 , H01L51/0062 , H01L51/0081 , H01L51/0084 , H01L51/0085 , H01L51/0089 , H01L51/56
摘要： A method of transferring organic material from a donor element to a substrate includes providing a radiation source; and selecting the power of the radiation applied to the donor element by the radiation source to cause the transfer of organic material to the substrate wherein the time that one or more positions of the donor element receives radiation is greater than 1 millisecond.
摘要翻译：将有机材料从供体元件转移到衬底的方法包括提供辐射源; 以及通过辐射源选择施加到施主元件的辐射的功率，以使有机材料转移到衬底，其中施主元件的一个或多个位置接收辐射的时间大于1毫秒。

2. 发明申请

WO2005119804A3 DEPOSITING ORGANIC LAYERS FOR OLED 审中-公开
标题翻译：沉积有机层的有机层
公开(公告)号：WO2005119804A3
公开(公告)日：2006-07-20
申请号：PCT/US2005016807
申请日：2005-05-13
申请人： EASTMAN KODAK CO , NGUYEN KELVIN , TUTT LEE WILLIAM , BOROSON MICHAEL LOUIS
发明人： NGUYEN KELVIN , TUTT LEE WILLIAM , BOROSON MICHAEL LOUIS
IPC分类号： H01L51/40 , B05D5/12 , C23C14/04 , C23C14/12 , H01L51/00 , H01L51/30 , H01L51/56
CPC分类号： C23C14/12 , C23C14/048 , H01L51/0013 , H01L51/0052 , H01L51/0059 , H01L51/0062 , H01L51/0084 , H01L51/0085 , H01L51/0089 , H01L51/56 , Y10S430/146
摘要： A method of transferring organic material from a donor element onto a substrate of an OLED device includes providing a linear laser light beam which is moved relative to the donor element and substrate and which has a predetermined number of laser modulatable channels, each of which when activated causes laser light to illuminate the donor element which heats to a sufficient level to vaporize organic material and transfer such material onto a substrate, and selecting the pattern of activated laser modulatable channels such that only a portion of the OLED device receives organic material during a single relative motion pass of the linear laser light beam to the donor element and substrate.
摘要翻译：将有机材料从施主元件转移到OLED器件的衬底上的方法包括提供相对于施主元件和衬底移动的线性激光束，并且具有预定数量的激光可调节通道，每个通道激活时使得激光照亮供体元件，其加热到足够的水平以蒸发有机材料并将这种材料转移到基底上，并且选择激活的激光可调制通道的图案，使得只有一部分OLED器件在单个时间期间接收有机材料线性激光束到施主元件和基板的相对运动通过。

3. 发明申请

WO2007142788A2 LASER ABLATION RESIST 审中-公开
标题翻译：激光消除电阻
公开(公告)号：WO2007142788A2
公开(公告)日：2007-12-13
申请号：PCT/US2007011626
申请日：2007-05-15
申请人： EASTMAN KODAK CO , PHILLIPS SCOTT E , TREDWELL TIMOTHY JOHN , TUTT LEE W , PEARCE GLENN THOMAS , NGUYEN KELVIN , WEXLER RONALD MYRON
发明人： PHILLIPS SCOTT E , TREDWELL TIMOTHY JOHN , TUTT LEE W , PEARCE GLENN THOMAS , NGUYEN KELVIN , WEXLER RONALD MYRON
CPC分类号： G03F1/00 , Y10S430/145 , Y10S430/146
摘要： A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.
摘要翻译：一种通过在基板（10）上涂覆第一抗蚀剂层（12）来制造微结构器件的方法。通过抗蚀剂的辐射诱导热去除在衬底上产生图案。

4. 发明申请

WO2011005952A3 METHODS FOR FORMING FRITTED COVER SHEETS WITH MASKS AND GLASS PACKAGES COMPRISING THE SAME 审中-公开
标题翻译：用带有面罩和玻璃包装的FRITTED COVER SHEETS来制造方法
公开(公告)号：WO2011005952A3
公开(公告)日：2011-03-10
申请号：PCT/US2010041359
申请日：2010-07-08
申请人： CORNING INC , ABBOTT JOHN S JR , NGUYEN KELVIN , ZHANG LU
发明人： ABBOTT JOHN S JR , NGUYEN KELVIN , ZHANG LU
IPC分类号： C03C8/24 , C03C17/04 , C03C17/09 , C03C17/40 , C03C27/06 , H01L51/52
CPC分类号： C03C27/06 , C03C8/24 , C03C17/09 , C03C17/40 , C03C2217/252 , C03C2217/253 , C03C2218/328 , C03C2218/34 , C03C2218/355 , C03C2218/365 , H01L51/5246 , Y10T428/24868
摘要： A method for forming a fritted cover sheet for sealing a glass package includes providing a transparent substrate having a sealing surface and a backing surface and forming at least one mask on one of the sealing surface of the substrate or the backing surface of the substrate. A sealing frit may be formed on the sealing surface of the substrate such that the at least one mask is positioned adjacent a perimeter defined by the sealing frit.
摘要翻译：形成用于密封玻璃封装的烧结盖板的方法包括提供具有密封表面和背衬表面的透明基板，并且在基板的密封表面或基板的背衬表面中的一个上形成至少一个掩模。可以在衬底的密封表面上形成密封玻璃料，使得至少一个掩模位于由密封玻璃料限定的周边附近。

5. 发明申请

WO2009108335A2 HERMETICALLY-SEALED PACKAGES FOR ELECTRONIC COMPONENTS HAVING REDUCED UNUSED AREAS 审中-公开
标题翻译：用于电子元件的密封封装具有减少的未使用区域
公开(公告)号：WO2009108335A2
公开(公告)日：2009-09-03
申请号：PCT/US2009001219
申请日：2009-02-26
申请人： CORNING INC , NGUYEN KELVIN , PASTEL MICHELLE N , ZHANG LU
发明人： NGUYEN KELVIN , PASTEL MICHELLE N , ZHANG LU
IPC分类号： B65D85/00
CPC分类号： H01L21/67005 , H01L51/5246
摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).
摘要翻译：提供了用于电子元件例如OLED的气密密封封装。该封装具有第一玻璃基板（12），第二玻璃基板（16）和将第一基板和第二基板（12,16）分隔开并将电子元件（18）气密密封在基板之间的壁（14） 12,16）。该包装具有减少的外部未使用区域，其特征在于距离D first（32a）和D second（32b）中的至少一个，并且在某些实施例中，两者都小于200微米，例如D first（32a ）和Dsecond（32b）大约为100微米。未使用区域的减少可以用于通过使用更宽的烧结玻璃料壁（14）来增加观察面积，改进电引线设计和/或增加封装强度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式