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    • 2. 发明申请
    • DSSC PHOTOVOLTAIC DEVICE COMPRISING PHOTOELECTROCHEMICAL CELLS AND PROVIDED WITH BYPASS MEANS AND UV FILTER
    • 包含光电化学电池的DSSC光伏器件和旁路装置和UV滤光片
    • WO2012081046A1
    • 2012-06-21
    • PCT/IT2011/000405
    • 2011-12-15
    • DYEPOWERLANUTI, AlessandroMASTROIANNI, SimoneREALE, AndreaBROWN, Thomas, MeredithPENNA, Stefano
    • LANUTI, AlessandroMASTROIANNI, SimoneREALE, AndreaBROWN, Thomas, MeredithPENNA, Stefano
    • H01G9/20
    • H01G9/2068H01G9/2031H01G9/2059H01G9/2081Y02E10/542
    • The present invention relates to a DSSC photovoltaic device comprising at least one photoelectrochemical cell (4) provided with a negative electrode or photo-electrode and a positive electrode or counter electrode, said at least one photoelectrochemical cell (4) being interposed between two substrates, a first substrate (9) on the side of said positive electrode and a second substrate (10) on the side of said negative electrode, each one of said substrates (9, 10) having a relevant first face (2, 3) and a relevant second face (22, 33), opposed with respect to said first face, the first face (2) of said first substrate (9) being faced toward said first face (3) of said second substrate (10). Particularly, said DSSC photovoltaic device further comprises: integrated bypass means on said substrates, said bypass means comprising a bypass diode (5, 5') for said at least one photoelectrochemical cell (4), said bypass diode (5) being provided on one edge of the photovoltaic device, wherein said edge is defined by at least two portions, a portion of said first substrate (9) and a portion of said second substrate (10), and by an encapsulating material (41), comprised of electrically insulating material, interposed between said two portions; two conductive tracks (6, 7) connecting the anode and cathode of said bypass diode (5, 5') to the negative and positive electrode of said cell, respectively; and UV filtering means to at least partially filter UV radiation, applied on at least a face (2, 22, 3, 33) of said substrates (9, 10), at least in correspondence of said at least one cell.
    • 本发明涉及一种DSSC光伏器件,其包括至少一个光电化学电池(4),该光电化学电池(4)设置有负电极或光电极以及正电极或对电极,所述至少一个光电化学电池(4)插入在两个衬底之间, 所述正极侧的第一基板(9)和位于所述负极侧的第二基板(10),所述基板(9,10)中的每一个具有相关的第一面(2,3)和 相对于所述第一面相对的相关的第二面(22,33),所述第一基板(9)的第一面(2)面向所述第二基板(10)的所述第一面(3)。 特别地,所述DSSC光伏器件还包括:在所述衬底上的集成旁路装置,所述旁路装置包括用于所述至少一个光电化学电池(4)的旁路二极管(5,5'),所述旁路二极管(5)设置在一个 边缘,其中所述边缘由至少两个部分限定,所述第一基板(9)的一部分和所述第二基板(10)的一部分以及由电绝缘的包封材料(41)限定 材料,插入在所述两个部分之间; 将所述旁路二极管(5,5')的阳极和阴极分别连接到所述电池的负极和正极的两个导电轨道(6,7) 和UV过滤装置,至少部分地至少部分地过滤施加在所述基板(9,10)的至少一个面(2,22,3,33)上的UV辐射,至少对应于所述至少一个单元。
    • 4. 发明申请
    • LAYER-SELECTIVE LASER ABLATION PATTERNING
    • 层选择性激光吸收图案
    • WO2006129126A2
    • 2006-12-07
    • PCT/GB2006/050133
    • 2006-05-30
    • PLASTIC LOGIC LIMITEDHAYTON, CarlCAIN, PaulBROWN, Thomas, Meredith
    • HAYTON, CarlCAIN, PaulBROWN, Thomas, Meredith
    • H01L51/05
    • H01L51/102H01L51/0017H01L51/0021H01L51/055
    • The present invention relates to methods of fabricating electronic devices such as thin film transistor (TFT) structures using laser ablation for selective patterning. A method of fabricating an organic electronic device, said organic electronic device having a structure including an upper conductive layer and an underlying layer immediately beneath said upper conducting layer and having at least one solution processable semiconducting layer, said upper conducting layer preferably having a thickness of between 10 nm and 200 nm, the method comprising patterning said upper conductive layer of said structure by: laser ablating said upper conductive layer using a pulsed laser to remove regions of upper conductive layer from said underlying layer for said patterning; and wherein said laser ablating uses a single pulse of said laser to substantially completely remove a said region of said upper conductive layer to expose said underlying layer beneath.
    • 本发明涉及使用激光烧蚀来选择性图案化的诸如薄膜晶体管(TFT)结构的电子器件的制造方法。 一种制造有机电子器件的方法,所述有机电子器件具有包括在上导电层正下方的上导电层和下层的结构,并且具有至少一个溶液可加工半导体层,所述上导电层优选具有 在10nm和200nm之间,所述方法包括:通过以下步骤对所述结构的所述上导电层进行图案化:使用脉冲激光激光烧蚀所述上导电层,以从所述下层移除用于所述图案化的上导电层的区域; 并且其中所述激光烧蚀使用所述激光器的单个脉冲基本上完全去除所述上导电层的所述区域,以暴露下面的下层。