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    • 5. 发明申请
    • PROCESS FOR THICK FILM CIRCUIT PATTERNING
    • 厚膜电路图的工艺
    • WO0203766A3
    • 2002-04-04
    • PCT/US0120252
    • 2001-06-26
    • DU PONTKEUSSEYAN ROUPEN LEON
    • KEUSSEYAN ROUPEN LEON
    • H05K1/09G03F7/00G03F7/36H01B13/00H05K3/04H05K3/20G03F7/34
    • H05K3/046G03F7/00G03F7/36H05K3/207H05K2203/0525H05K2203/0528
    • A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer (104) is applied onto a substrate surface. The photosensitive layer (104) is imaged with a pattern (106) using actinic radiation, the exposed areas (107) of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet (101 on 102) will cause the thick film (101) to adhere to the remaining tacky areas (104). Upon peeling the sheet (102), a thick film print pattern (101) will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.
    • 使用光敏聚合物层图案化厚膜电功能图案的工艺。 将粘性感光层(104)施加到基材表面上。 感光层(104)使用光化辐射用图案(106)成像,感光层的曝光区域(107)变硬并且非粘性。 随后应用厚膜组合物片(102在102上)将使厚膜(101)粘附到剩余的粘性区域(104)。 在剥离片材(102)时,将生产厚膜印刷图案(101)。 该步骤之后是由所使用的厚膜组合物规定的处理轮廓,其导致具有电功能性质的图案。 本发明还延伸到其中从使用的片材中回收厚膜组合物的方法。