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    • 7. 发明申请
    • PHOTOPOLYMERIZABLE AND PHOTOCLEAVABLE RESIN AND LOW STRESS COMPOSITE COMPOSITIONS
    • 可光聚合和可光滑树脂和低应力复合组合物
    • WO2008005173A1
    • 2008-01-10
    • PCT/US2007/014158
    • 2007-06-14
    • DENTSPLY INTERNATIONAL INC.JIN, XiaomingHAMMESFAHR, Paul, D.
    • JIN, XiaomingHAMMESFAHR, Paul, D.
    • C08F2/48C08F8/50A61K6/08C08F20/00C08G18/00
    • C08F2/48A61K6/09C08G18/3215C08G18/672C08G18/73C08G18/8116C08L75/16
    • This invention relates to photopolymerizable & photocleavable resin monomers and resin composite compositions, which feature by its unique balanced overall performance including very low polymerization shrinkage and very low shrinkage stress as well. The photoreactive moiety incorporated into such new resin's main frame enable to make the resin and/or the cured resin networks that are based upon such resin photocleavable. Thus the polymerization rate of free radical reaction for (meth)acrylate-based resin systems should be substantially reduced since it alter the network formation process and consequently allow the shrinkage stress getting relief significantly. In addition, it is expected that radically polymerizable resin systems containing such P&P resin would find wide range application in microelectronic, special coating and restorative dentistry where the dimensional stability and contraction stress within cured materials are critical to the total performance.
    • 本发明涉及可光聚合和可光修复的树脂单体和树脂复合组合物,其特征在于其独特的平衡整体性能,包括非常低的聚合收缩率和非常低的收缩应力。 结合到这种新型树脂的主框架中的光反应性部分能够使基于这种树脂的树脂和/或固化树脂网络可光切割。 因此,(甲基)丙烯酸酯类树脂体系的自由基反应的聚合速度应该大大降低,因为它改变了网络形成过程,并且因此允许收缩应力显着减轻。 此外,预期含有这种P&P树脂的自由基聚合性树脂体系将在微电子,特殊涂层和修复牙科中广泛应用,其中固化材料内的尺寸稳定性和收缩应力对总性能至关重要。