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    • 2. 发明申请
    • ENHANCED P-CONTACTS FOR LIGHT EMITTING DEVICES
    • 增强用于发光装置的P-CONT
    • WO2011028855A9
    • 2011-04-28
    • PCT/US2010047606
    • 2010-09-02
    • BHAT RAJARAMNAPIERALA JEROMESIZOV DMITRYXI JINGQUNZAH CHUNG-ENCORNING INC
    • BHAT RAJARAMNAPIERALA JEROMESIZOV DMITRYXI JINGQUNZAH CHUNG-EN
    • H01L33/02H01L33/32
    • H01L33/02H01L33/32H01L33/40
    • An optoelectronic light emitting semiconductor device is provided comprising an active region (10), a p-type Group III nitride layer (20), an n-type Group III nitride layer (30), a p-side metal contact layer (40), an n-side metal contact layer (50), and an undoped tunneling enhancement layer (60). The p-side metal contact layer is characterized by a work function W satisfying the following relation: W = e - AFF ± 0.025eV where e - AFF is the electron affinity of the undoped tunneling enhancement layer. The undoped tunneling enhancement layer and the p-type Group III nitride layer comprise conduction and valence energy bands. The top of the valence band V1 of the undoped tunneling enhancement layer is above the top of the valence band V2 of the p-type Group III nitride layer at the band offset interface to generate a capacity for a relatively high concentration of holes in the undoped tunneling enhancement layer at the band offset interface. Additional embodiments are disclosed and claimed.
    • 提供一种光电子发光半导体器件,其包括有源区(10),p型III族氮化物层(20),n型III族氮化物层(30),p侧金属接触层(40) ,n侧金属接触层(50)和未掺杂的隧道增强层(60)。 p侧金属接触层的特征在于满足以下关系的功函数W:e = AFF±0.025eV其中e-AFF是未掺杂的隧道增强层的电子亲和力。 未掺杂的隧道增强层和p型III族氮化物层包括导电和价态能带。 未掺杂的隧道增强层的价带V1的顶部在带偏移界面处高于p型III族氮化物层的价带V2的顶部,以产生未掺杂的较高浓度的孔的能力 隧道增强层在带偏移接口。 公开和要求保护附加实施例。
    • 4. 发明申请
    • ENHANCED PLANARITY IN GaN EDGE EMITTING LASERS
    • GaN边缘发射激光器中的增强平面图
    • WO2011150135A2
    • 2011-12-01
    • PCT/US2011038015
    • 2011-05-26
    • CORNING INCBHAT RAJARAM
    • BHAT RAJARAM
    • H01S5/10H01S5/343
    • H01S5/3201B82Y20/00H01S5/3202H01S5/3216H01S5/34333
    • A GaN edge emitting laser is provided comprising a semi-polar GaN substrate, an active region, an N-side waveguiding layer, a P-side waveguiding layer, an N-type cladding layer, and a P-type cladding layer. The GaN substrate defines a 2021 crystal growth plane and a glide plane. The N-side and P-side waveguiding layers comprise a GalnN/GaN or GalnN/GalnN superlattice (SL) waveguiding layers. The superlattice layers of the N-side and P-side SL waveguiding layers define respective layer thicknesses that are optimized for waveguide planarity, the layer thicknesses being between approximately 1 nm and approximately 5 nm. In accordance with another embodiment of the present disclosure, planarization can be enhanced by ensuring that the N-side and P-side GaN-based waveguiding layers are grown at a growth rate that exceeds approximately 0.09 nm/s, regardless of whether the N-side and P-side GaN-based waveguiding layers are provided as a GalnN/GaN or GalnN/GalnN SL or as bulk waveguiding layers. In still further embodiments, planarization can be enhanced by selecting optimal SL layer thicknesses and growth rates. Additional embodiments are disclosed and claimed.
    • 提供GaN边缘发射激光器,其包括半极性GaN衬底,有源区,N侧波导层,P侧波导层,N型覆层和P型覆层。 GaN衬底限定了2021晶体生长平面和滑动平面。 N侧和P侧波导层包括GalnN / GaN或GalnN / GalnN超晶格(SL)波导层。 N侧和P侧SL波导层的超晶格层限定针对波导平面度优化的各层厚度,层厚度在约1nm至约5nm之间。 根据本公开的另一实施例,可以通过确保以超过约0.09nm / s的生长速率生长N侧和P侧GaN基波导层来增强平坦化,而不管N- 作为GalnN / GaN或GalnN / GalnN SL或作为体波导层提供侧面和P侧GaN基波导层。 在另外的实施例中,可以通过选择最佳SL层厚度和生长速率来增强平坦化。 公开并要求保护附加实施例。