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1. 发明申请

WO2005120238A2 METHOD AND APPARATUS FOR CONTROLLING FREEZING NUCLEATION AND PROPAGATION 审中-公开
标题翻译：用于控制冷冻核和传播的方法和装置
公开(公告)号：WO2005120238A2
公开(公告)日：2005-12-22
申请号：PCT/US2005/016883
申请日：2005-05-12
申请人： COOLIGY, INC. , UPADHYA, Girish , BREWER, Richard, G. , MCMASTER, Mark
发明人： UPADHYA, Girish , BREWER, Richard, G. , MCMASTER, Mark
IPC分类号： A21D2/00
CPC分类号： F28F3/12 , F28F2265/14
摘要： An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.
摘要翻译：公开了一种在液体系统中控制冷冻的装置和方法。该装置包括具有以表面积与体积比为特征的初始区的热交换器。该装置还包括用于启动来自初始区域的流体冷冻的装置，以便在以最终区域表面积与体积比为特征的最终区域的方向上的冷冻期间促进体积膨胀。该设备还可以包括位于初始区域和最终区域之间的多个区域，其中针对每个区域计算区域表面积与体积比。优选地，每个区域的区域表面积与体积比逐渐从初始区域沿最终区域的方向减小。优选地，最终的冷冻区域具有最低的表面积与体积比，并且具有足够的弹性以适应从初始区域冻结的所有流体的体积膨胀。

2. 发明申请

WO2009020668A1 INTERNAL ACCESS MECHANISM FOR A SERVER RACK 审中-公开
标题翻译：服务器机架的内部访问机制
公开(公告)号：WO2009020668A1
公开(公告)日：2009-02-12
申请号：PCT/US2008/009643
申请日：2008-08-07
申请人： COOLIGY INC. , HOM, James , CHOI, Hae-won , LIN, Tien-chih, Eric , WERNER, Douglas, E. , CHOW, Norman , CORREA, Adrian , LEONG, Brandon , GOPALKRISHNAN, Sudhakar , BREWER, Richard, G. , MCMASTER, Mark , UPADHYA, Girish
发明人： HOM, James , CHOI, Hae-won , LIN, Tien-chih, Eric , WERNER, Douglas, E. , CHOW, Norman , CORREA, Adrian , LEONG, Brandon , GOPALKRISHNAN, Sudhakar , BREWER, Richard, G. , MCMASTER, Mark , UPADHYA, Girish
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。

3. 发明申请

WO2007098078A3 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
公开(公告)号：WO2007098078A3
公开(公告)日：2007-08-30
申请号：PCT/US2007/004237
申请日：2007-02-16
申请人： COOLIGY, INC. , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
发明人： CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20 , H05K5/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

4. 发明申请

WO2007098077A2 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098077A2
公开(公告)日：2007-08-30
申请号：PCT/US2007/004236
申请日：2007-02-16
申请人： COOLIGY, INC. , UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
发明人： UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

5. 发明申请

WO2008005404A2 MULTI-STAGE STAGGERED RADIATOR FOR HIGH PERFORMANCE LIQUID COOLING APPLICATIONS 审中-公开
标题翻译：用于高性能液体冷却应用的多级分级散热器
公开(公告)号：WO2008005404A2
公开(公告)日：2008-01-10
申请号：PCT/US2007/015297
申请日：2007-06-28
申请人： COOLIGY INC. , UPADHYA, Girish , CHOW, Norman , WERNER, Douglas, E.
发明人： UPADHYA, Girish , CHOW, Norman , WERNER, Douglas, E.
IPC分类号： F28D1/00
CPC分类号： F28F9/262
摘要： A fluid-based cooling system including a multistage staggered radiator is configured to distribute a parallel airflow to each radiator in the multistage radiator. Each radiator is staggered so as to expose a total frontal area of the radiators to the parallel airflow in a minimized vertical space. Air ducts are configured to provide isolated air pathways into and, in some cases, out of each radiator in the multistage radiator.
摘要翻译：包括多级交错散热器的基于流体的冷却系统被配置为将平行气流分配到多级散热器中的每个散热器。每个散热器交错，以便在最小化的垂直空间中将散热器的正面面积暴露于平行气流。空气管道被配置为向多级散热器中的每个散热器提供隔离的空气通路，并且在某些情况下提供每个散热器。

6. 发明申请

WO2008137143A1 MICRO-TUBE/MULTI-PORT COUNTER FLOW RADIATOR DESIGN FOR ELECTRONIC COOLING APPLICATIONS 审中-公开
标题翻译：用于电子冷却应用的微管/多端口对流式散热器设计
公开(公告)号：WO2008137143A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/005781
申请日：2008-05-02
申请人： COOLIGY INC. , HOM, James , UPADHYA, Girish , ZHOU, Peng , TSAO, Paul , LANDRY, Frederic
发明人： HOM, James , UPADHYA, Girish , ZHOU, Peng , TSAO, Paul , LANDRY, Frederic
IPC分类号： F28D1/04
CPC分类号： F28D1/05391 , F28D1/0435
摘要： A counter flow radiator includes multiple layered cooling cores configured in series along a first direction that is the same as the direction of airflow used to cool fluid flowing through the counter flow radiator. Heated fluid inputs the counter flow radiator at a first end and flows through each cooling core in a serpentine-like path to the second end of the counter flow radiator, effectively progressing in a direction opposite that of the airflow.
摘要翻译：逆流式散热器包括沿着第一方向串联构造的多层冷却芯，其与用于冷却流过逆流式散热器的流体的冷却方向相同。加热流体在第一端处输入逆流式散热器，并且以对应流动式散热器的第二端的蛇形状路径流过每个冷却芯，有效地沿与气流相反的方向前进。

7. 发明申请

WO2007114913A2 MULTI DEVICE COOLING 审中-公开
标题翻译：多设备冷却
公开(公告)号：WO2007114913A2
公开(公告)日：2007-10-11
申请号：PCT/US2007/008281
申请日：2007-03-30
申请人： COOLIGY, INC. , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark
发明人： UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark
IPC分类号： F25D17/06 , F25B1/00
CPC分类号： G06F1/20 , F28D1/0408 , F28D2021/0028 , F28F3/022 , F28F2270/00 , G06F2200/201 , H05K7/20154
摘要： A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat source and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump for driving the fluid. The cooling system further includes a first radiator and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure. Some embodiments include a method of cooling the heat sources for a multi device configuration by using such a cooling system.
摘要翻译：微型冷却系统包括热耦合到第一热源的第一热交换器。冷却系统还具有热耦合到第二热源的第二热交换器和第一热交换器与第二热交换器之间的连接。流体流过第一和第二冷却板。冷却系统具有用于驱动流体的第一泵。冷却系统还包括第一散热器和连接第一热交换器，第二热交换器，第一泵和第一辐射器的管道。一些实施例的管道被设计成使流体损失最小化。一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。在一些实施例中，至少一个热交换器具有至少一个微尺度结构。一些实施例包括通过使用这种冷却系统来冷却多器件配置的热源的方法。

8. 发明申请

WO2007130557A2 METHODOLOGY FOR THE LIQUID COOLING OF HEAT GENERATING COMPONENTS MOUNTED ON A DAUGHTER CARD/EXPANSION CARD IN A PERSONAL COMPUTER THROUGH THE USE OF A REMOTE DRIVE BAY HEAT EXCHANGER WITH A FLEXIBLE FLUID INTERCONNECT 审中-公开
标题翻译：通过使用带有灵活流体互连的远程驱动槽热交换器在个人计算机上安装的热量卡片/扩展卡上的热发生部件的液体冷却方法
公开(公告)号：WO2007130557A2
公开(公告)日：2007-11-15
申请号：PCT/US2007/010807
申请日：2007-05-04
申请人： COOLIGY INC. , CONWAY, Bruce , BREWER, Richard, Grant , TSAO, Paul , HOM, James , WERNER, Douglas, E. , ZHOU, Peng , UPADHYA, Girish , DATTA, Madhav , FIROUZI, Ali , LANDRY, Fredric
发明人： CONWAY, Bruce , BREWER, Richard, Grant , TSAO, Paul , HOM, James , WERNER, Douglas, E. , ZHOU, Peng , UPADHYA, Girish , DATTA, Madhav , FIROUZI, Ali , LANDRY, Fredric
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

9. 发明申请

WO2007120530A2 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A2
公开(公告)日：2007-10-25
申请号：PCT/US2007/008190
申请日：2007-03-30
申请人： COOLIGY, INC. , HOM, James , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark , TSAO, Paul , CONWAY, Bruce , ZHOU, Peng , BREWER, Richard
发明人： HOM, James , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark , TSAO, Paul , CONWAY, Bruce , ZHOU, Peng , BREWER, Richard
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

10. 发明申请

WO2007056599A3 LIQUID COOLING FOR BACKLIT DISPLAYS 审中-公开
公开(公告)号：WO2007056599A3
公开(公告)日：2007-05-18
申请号：PCT/US2006/043999
申请日：2006-11-09
申请人： COOLIGY, INC. , MUNCH, Mark , UPADHYA, Girish
发明人： MUNCH, Mark , UPADHYA, Girish
IPC分类号： H01L23/467
摘要： The present invention provides a cooling system for a backlit device. The cooling system has a first heat collector that comprises a micro tube. The first heat collector is for maintaining contact with the backlit device. The cooling system also has a first radiator, a first pump, an interconnecting tubing, a fluid, and optionally a fan and/or a reservoir. The first radiator is for distributing and/or dispersing heat, the first pump is for driving a fluid flow, and the reservoir is for storing the fluid. The interconnect tubing is interposed between the first heat collector, the first radiator, and the first pump to form a closed cooling loop. Some embodiments further provide a method of cooling a backlit device by using such a cooling system.

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